201212136 六、發明說明： 【發明所屬之技術領域】 本發明係關於藉由搭載焊球來形成焊料凸塊的配線基 板之製造方法、及搭載焊球所使用之焊球搭載用遮罩。 【先前技術】 過去，已知有搭載1C晶片而構成的配線基板（所謂的 半導體封裝）。在1C晶片的底面通常設置有多個端子，作 爲用於謀求與那些端子的電性連接之構造，將多個具有焊 料凸塊的墊（所謂的 C4墊：Controlled Collapsed Chip Connection墊）設置在配線基板的主面上》又，作爲在上 述配線基板形成焊料凸塊的方法，例如，已提出使搭載在 墊上的焊球加熱熔融而形成焊料凸塊的方案（例如參照專 利文獻1 )。以下，基於第1 〇圖簡單地說明焊料凸塊之形 成方法的具體例。 首先，對形成在基板主面101上之凸塊形成區域R0 內的複數個墊1 02，印刷塗布助熔劑（flux )。接下來，將 具有複數個開口部1 03之焊球搭載用遮罩1 〇4配置在基板 主面1 0 1上，在此狀態下透過各開口部1 03使焊球1 05供 給且搭載在複數個墊1 02上（例如參照專利文獻1 )。接 下來，利用回流使焊球1 0 5加熱熔融，藉以形成焊料凸塊。 [先前技術文獻] [專利文獻] [專利文獻1]日本特開2002-151539號公報（第1圖等） 【發明内容】 -4 - 201212136 [發明所欲解決的課題] 然而，會有基板100的緣部106在遮罩背面〗07側彈 起的情況。在此情況下，由於焊球搭載用遮罩1 的一部 分會被緣部106推升而浮起，所以在焊球搭載用遮罩104 與基板1 〇〇之間會有間隙產生。其結果，成爲在1個開口 部103內有2個焊球105進入的狀態而成爲容易發生焊球 105的位置偏離墊102上等之事態（所謂的雙球（double ball))。因此，成爲無法將焊料凸塊正確地形成在所要的 位置，所以有不良品發生率變高而良率降低的問題。 又，在最近，受到電子零件小型化潮流的影響，焊球 1 0 5也有小口徑化的趨勢，但在此情況下，複數個焊球1 0 5 變得容易進入開口部1 03內。因此，因雙球等之發生所造 成之焊球1 0 5位置偏離的問題可能會變得更加嚴重》 本發明係鑑於上述課題所成就者，其目的在於提供一 種具有焊料凸塊的配線基板之製造方法，能藉由防止雙球 等之發生而可在所要的位置正確地形成焊料凸塊，來使良 率提高。又，其他的目的在於提供一種適於形成焊料凸塊 的焊球搭載用遮罩。 [用於解決課題之手段] 作爲用於解決上述課題之手段（手段η ，係一種具 有焊料凸塊的配線基板之製造方法，其特徵爲包含：基板 準備製程，係準備將複數個墊配置在基板主面上之凸塊形 成區域內的基板；球搭載製程，係使用焊球搭載用遮罩， 在將此焊球搭載用遮罩配置在前述基板主面側的狀態下透 201212136 過貫通穴部使焊球供給且搭載在前述複數個墊上，其中該 焊球搭載用遮罩具有遮罩表面及遮罩背面’在與前述複數 個墊對應的位置形成有貫通前述遮罩表面及前述遮罩背面 的貫通穴部，在爲前述貫通穴部的外側區域且在前述遮罩 背面側中與前述凸塊形成區域的外側區域對應的位置，形 成有接觸前述基板主面而按壓前述基板之按壓部，在爲前 述按壓部的外側區域且在前述遮罩背面側中與前述基板的 緣部對應的位置，形成有避免與前述緣部接觸的凹部；及 回流製程，係使已搭載的前述焊球加熱熔融而形成焊料凸 塊。 據此，若利用手段1，便使用形成有避免與基板的緣 部接觸的凹部之焊球搭載用遮罩，因此即使緣部在遮罩背 面側彈起，緣部仍不會接觸遮罩背面而成爲被收容在凹部 內。其結果，可防止因被緣部推升所造成之焊球搭載用遮 罩浮起，因此使得在焊球搭載用遮罩與基板之間難有間隙 產生。據此，使得因雙球等之發生所造成之焊球位置偏離 難以發生，成爲能在所要的位置正確地形成焊料凸塊，因 此可壓低不良品發生率，所製造之配線基板的良率變高。 以下’就關於上述手段1之具有焊料凸塊的配線基板 之製造方法加以說明。 在基板準備製程’係準備將複數個墊配置在基板主面 上之凸塊形成區域內的基板。基板材料未受特別限定而爲 任意的’但是例如，樹脂基板等是合適的。作爲合適的樹 脂基板’可舉出由EP樹脂（環氧樹脂）、PI樹脂（聚醯 201212136 亞胺樹脂）、ΒΤ樹脂（雙馬來亞醯胺-三嗪樹脂）、ppE 樹脂（聚苯醚樹脂）等所構成之基板。此外，亦可使用由 這些樹脂與玻璃纖維（玻璃織布或玻璃不織布）的複合材 料所構成的基板。作爲其具體例，有玻璃·ΒΤ複合基板、 高Tg玻璃-環氧複合基板（fr_4、^尺^等）等之高耐熱性 積層板等。又，亦可使用由這些樹脂與聚醯胺纖維等之有 機纖維的複合材料所構成的基板。或者是，亦可使用由使 環氧樹脂等之熱硬化性樹脂含浸至連續多孔質PTFE等之 三維網目狀氟系樹脂基材的樹脂-樹脂複合材料所構成之 基板等。作爲其他的基板材料，能選擇例如各種陶瓷等》 又’作爲相關的基板構造未.受特別限定，但是例如在核心 基板的單面或兩面有增建層（build-up layer)的增建多層 配線基板是合適的。 基板主面上之凸塊形成區域的位置及數量未受特別限 定而是任意的，但是在例如所謂的截取多個基板的情況 下，僅有數量與配線基板的截取數量相當的凸塊形成區域 存在。雖然凸塊形成區域可只存在於基板中之一方的主 面，但是亦可存在於他方的主面。 對於配置在凸塊形成區域內的複數個墊，.雖然其用途 未受到限定，但較佳爲例如用於將1C晶片覆晶（flip chip ) 連接的墊（所謂的C4墊）。即，這是因爲在用於覆晶連接 的墊上，必須形成小的焊料凸塊以便謀求與尺寸小的1C晶 片端子電性連接，因此多半使用小口徑的焊球的緣故。 在接下來的球搭載製程，係使用焊球搭載用遮罩來進 201212136 行焊球之搭載。在此使用之焊球搭載用遮罩具有如下的構 造：具有遮罩表面及遮罩背面，在與複數個墊對應的位置 形成有貫通遮罩表面及遮罩背面的貫通穴部，在爲貫通穴 部的外側區域且在遮罩背面中與凸塊形成區域的外側區域 對應的位置，形成有接觸前述基板主面而按壓基板之按壓 部，在爲按壓部的外側區域且在遮罩背面側中與基板的緣 部對應的位置，形成有避免與緣部接觸的凹部。 相關的焊球搭載用遮罩，可使用金屬、樹脂、陶瓷等 任意的材料來製作，但較佳爲使用例如不鏽鋼、銅、鋁、 鎳等金屬材料來製作。其理由說明如下。即，在焊球搭載 用遮罩中形成貫通穴部的部位，會成爲強度比其他部位還 低。另一方面，焊球搭載用遮罩，比要搭載之焊球直徑過 厚太多就會導致操作性等降低，因此必須相當程度地形成 爲薄平板狀。因此就這點來看，在選擇金屬材料的情況下， 即使當將焊球搭載用遮罩薄薄地形成時仍能賦予既定的強 度。 焊球搭載用遮罩的遮罩板厚未受特別限定，但較佳爲 具有比要搭載之焊球的直徑稍大的遮罩板厚，具體而言， 較佳爲具有比要搭載之焊球直徑大上5μιη以上、20 μιη以下 的遮罩板厚的板材。假如，若低於5 μιη，則有不能藉由材 料來將足夠的機械性強度賦予焊球搭載用遮罩之虞。另一 方面，若超過20μιη，則有焊球的定位精度降低之虞。 又，貫通穴部，較佳爲利用在遮罩表面中開口的遮罩 表面側開口部、及在遮罩背面中開口的遮罩背面側開口部 201212136 來構成。依此方式的話，則在遮罩背面側開口部 域比凸塊形成區域還大的情況下，即使要將助熔 整體凸塊形成區域，在球搭載製程中配置焊球 罩，仍使得助熔劑不會對遮罩背面接觸、附著。 難以發生由焊球搭載用遮罩所造成之焊球的帶走 離，能將焊料凸塊正確地形成在所要的位置。 又，貫通穴部具有複數個遮罩表面側開口部 遮罩表面側開口部較佳爲在遮罩背面側開口部的 口。在此情況，能以使焊球1個1個地進入各個 側開口部內的方式設定，因此即使要將遮罩背面 的占有區域作得比遮罩表面側開口部的占有區域 確實地將焊球搭載在既定的位置。故，能將焊料 地形成在所要的位置，不良品發生率變低而良率 此，作爲各遮罩表面側開口部的形成方法，能因 成材料，採用蝕刻、鑽孔加工、沖壓（punching 雷射加工等之過去週知的任意手法。這些遮罩表 部的內徑，係以成爲比要搭載之焊球直徑還大 成，例如形成爲比要搭載之焊球直徑大上5 μιη以_ 以下是較佳的。假如，若低於5 μπι，則有透過遮 開口部使焊球確實地通過會變困難之虞。另一方 過1 00 μηι，則雖能透過遮罩表面側開口部使焊球 過’但有成爲難以將焊球搭載在既定位置之虞。連 成爲難以適用於位在凸塊形成區域內的複數個墊 距（fine pitch)的情況。 的占有區 劑供給至 搭載用遮 故，成爲 或位置偏 ，複數個 內底面開 遮罩表面 側開口部 大，仍能 凸塊正確 提高。在 應遮罩形 )加工、 面側開口 的方式形 t ' 1 ΟΟμηι 罩表面側 面，若超 確實地通 I 一步地， 係微細間 201212136 又，凹部，係在爲按壓部的外側區域且在遮罩背面側 中與基板的緣部對應的位置中開口。又’凹部’較佳爲沿 著緣部所形成之溝部。在依此方式進行的情況’能將在遮 罩背面中凹部開口的面積縮小’因此能將形成凹部時之焊 球搭載用遮覃的強度降低抑制在最小限度。 將遮罩背面側開口部及凹部形成在焊球搭載用遮罩的 方法，可因應遮罩材料而適宜選擇。在選擇例如金屬材料 的情況，遮罩背面側開口部及凹部’係利用半蝕刻同時地 形成，成爲彼此相等的深度’從生產性及成本性的觀點來 看是合適的。又’除了半蝕刻以外’亦可採用切削加工或 加壓（press )加工等方法。 進一步地，作爲焊球搭載用遮罩的合適方法，例如， 可舉出：選擇不鏽鋼板，並且在該不鏽鋼板中將成爲遮罩 背面側的面加以半蝕刻而同時形成遮罩背面側開口部及凹 部後，對有遮罩背面側開口部的部位的既定位置施加雷射 開孔加工而形成複數個遮罩表面側開口部。此製造方法的 優點’由於是對遮罩背面側開口部形成後之薄壁部位進行 開孔’因此開孔時的加工負擔少，能提高成本性及生產性。 其他的優點，係相較於在先進行開孔加工後形成遮罩背面 側開口部的情況’能以高精度形成形狀良好的複數個遮罩 表面側開口部。 在球搭載製程中所使用的焊球尺寸未受特別限定，可 因應要被形成的焊料凸塊的用途適宜設定，但是例如，較 佳爲使用直徑爲200μΐη以下的微型球（micr〇_baU)。這是 •10- 201212136 因爲在使用微型球的情況’能對應所謂的C4墊的微細化， 比較容易地形成小的焊料凸塊。又，這是因爲在使用微小 且輕量的焊球的情況’容易引起所謂雙球的發生之本案特 有的問題，故採用上述手段的意義大。 作爲焊球所使用的焊料材料未受特別限.定，但可使用 例如錫鉛共晶焊料（S n/ 3 7 P b :熔點1 8 3 °C )。亦可使用錫 鉛共晶焊料以外的Sn/Pb系焊料，例如Sn/36Pb/2Ag組成 之焊料（熔點1 90 °C )等。又，除了如上述的加鉛焊料以外， 亦可選擇Sn-Ag系焊料、Sn-Ag-Cu系焊料、Sn-Ag-Bi系焊 料、Sn-Ag-Bi-Cu系焊料、Sn-Zn系焊料、Sn-Zn-Bi系焊料 等之無鉛焊料。 然後，使用相關的焊球搭載用遮罩，並且在將此焊球 搭載用遮罩配置在基板主面側的狀態下透過貫通穴部（複 數個遮罩表面側開口部）使焊球供給且搭載在複數個墊上。 在接下來的回流製程，藉由將經搭載在各墊上的焊球 加熱至既定溫度而使其熔融，來形成既定形狀的焊料凸 塊。經過以上的製程，可製造具有焊料凸塊的配線基板。 作爲用於解決上述課題之其他手段（手段2)，係一 種焊球搭載用遮罩，其具有遮罩表面及遮罩背面，形成有 貫通前述遮罩表面及前述遮罩背面的貫通穴部，在配置於 基板之基板主面側的狀態下，透過前述複數個貫通穴部使 焊球供給且搭載在前述基板主面上，其特徵爲在前述貫通 穴部的外側區域之前述遮罩背面側，形成有接觸前述基板 主面而按壓前述基板之按壓部，在前述按壓部的外側區域 -11- 201212136 之前述遮罩背面側，形成有避免與前述基板的緣部接觸的 凹部。 據此，若利用手段2，便可在焊球搭載用遮罩形成避 免與基板的緣部接觸的凹部，因此即使要在緣部會在遮罩 背面側彈起的情況下將焊球搭載用遮罩配置在基板主面 側，緣部仍不會接觸遮罩背面而成爲被收容在凹部內。其 結果，可防止因被緣部推升所造成之焊球搭載用遮罩浮 起，因此使得在焊球搭載用遮罩與基板之間難有間隙產 生。據此，使得因雙球等之發生所造成之焊球位置偏離難 以發生，所以成爲適合焊料凸塊之形成的焊球搭載用遮罩。 【實施方式】 [用於實施發明的形態] 以下，基於第1圖〜第7圖詳細地說明將本發明具體化 之一實施形態的配線基板之製造方法。 如第1圖所示般，本實施形態之配線基板1 0，係在兩 面具備增建層1 5、1 6的兩面增建多層配線基板。構成配線 基板10之核心基板17，係平面觀察約略矩形狀的板狀構 件，在其複數個部位形成有未圖示的貫穿孔導體（through hole conductor) »這些貫穿孔導體，係電性連接核心基板 1 7上面側的增建層1 5的導體、及核心基板1 7下面側的增 建層16的導體。 在增建層15的表面（第1基板主面13)上，設定平 面觀察約略矩形狀的凸塊形成區域R 1，在凸塊形成區域 R1內，配置有複數個高度80μιη〜ΙΟΟμπι左右的焊料凸塊 -12- 201212136 62。這些焊料凸塊62，係用於與1C晶片71之端子的覆晶 連接，所謂的C4用的墊。另一方面，亦在增建層16的表 面（第2基板主面14)上設定凸塊形成區域（省略圖示）， 在該凸塊形成區域內，設有複數個高度400μηι〜600μηι左右 的焊料凸塊63。這些焊料凸塊63，係用於與未圖示之母板 側之端子的電性連接，所謂的B G Α凸塊。 本實施形態之增建層1 5、1 6都具有同樣的構造，所以 在此僅就上面側的增建層1 5詳細地說明。如第7圖所示， 增建層15係將層間絕緣層31、32及鍍銅導體層43、44交 替積層所構成。層間絕緣層3 1 ' 3 2的厚度皆爲約3 Ομηι， 例如由使環氧樹脂·含浸至連續多孔質PTFE的樹脂-樹脂複 合材料所構成。又，在第2層之層間絕緣層32的表面，將 複數個墊2 1配置成陣列狀。進一步地，層間絕緣層32的 表面係利用防焊阻劑3 3來幾乎整體地覆蓋著。在此防焊阻 劑33，形成有使各墊21露出之開口部22。進一步地，在 層間絕緣層3 1、3 2中之既定部位，分別設有由鑛銅所構成 之塡充導通導體（filledviaconductor) 41、42。塡充導通 導體41、42將墊21及導體層43、44相互地電性連接。 接下來，就具有焊料凸塊62、63之配線基板10的製 造方法加以說明。 首先，進行基板準備製程，係準備將複數個墊21配置 在第1基板主面13上之凸塊形成區域R1內的基板11(參 照第2圖）。又，在此階段，成爲各墊21從防焊阻劑3 3 之各開口部22露出的狀態。 -13- 201212136 在接下來的助熔劑供給製程’係將基板11放置（set) 在未圖示之過去週知的印刷裝置，藉由進行使用網狀遮罩 (mesh mask)的印刷，將助熔劑F1薄薄地均勻塗布在第 1基板主面1 3側上（參照第3圖）。此時，在比凸塊形成 區域R1大上一圈的區域之助溶劑F1的供給區域R2整體’ 塗布助熔劑F 1。 在接下來的球搭載製程’使用焊球搭載用遮罩51進行 焊球6 1的搭載（參照第4圖）。在本實施形態’使用直徑 約ΙΟΟμιη的微型球作爲焊球61。又，焊球搭載用遮罩51 係由具有遮罩表面52及遮罩背面53的不鏽鋼板所構成。 又，焊球搭載用遮罩5 1係具有比要搭載之焊球ό 1.的直徑 大上ΙΟμηι左右的遮罩板厚（ΙΙΟμι»)的板材。又’遮罩表 面52及遮罩背面53係成爲不具有突出部分的平坦面。然 後，在焊球搭載用遮罩5 1中與各墊2 1對應的位置’形成 有貫通遮罩表面52及遮罩背面53的貫通穴部54。貫通穴 部5 4，係由在遮罩表面5 2中開口之複數個遮罩表面側開 口部5 5、及在遮罩背面5 3中開口之1個遮罩背面側開口 部5 6所構成。各遮罩表面側開口部5 5，除了遮罩表面5 2 以外也在遮罩背面側開口部5 6的內底面5 7中開口 ’係具 有遠比凸塊形成區域R 1小的占有區域R3之平面觀察圓形 狀的貫通孔（參照第4圖、第5圖）。各遮罩表面側開口 部55具有比要搭載之焊球61的直徑大上數十μιη左右的 內徑（130μηι〜170μιη左右）。又，各遮罩表面側開口部55 係設定爲遮罩板厚的50%的深度（55 μιη)。另一方面’遮 -14- 201212136 罩背面側開口部5 6，係形成在遮罩背面5 3側中與凸塊形 成區域R1對應的位置，係具有比助熔劑F 1的供給區域R2 稍廣的占有區域R4之平面觀察矩形狀的貫通孔（參照第4 圖、第5圖）。據此，遮罩背面側開口部5 6之占有區域 R4成爲比各遮罩表面側開口部55之占有區域R3還大。 又，遮罩背面側開口部5 6係設定爲遮罩板厚的5 0 %的深 度（5 5 μιη )。 如第4圖所示，在爲貫通穴部54的外側區域且在遮罩 背面5 3側中與凸塊形成區域R 1 (及助熔劑F 1的供給區域 R2 )的外側區域對應的位置，形成有按壓部58。按壓部58， 係設定爲與遮罩板厚相同的厚度，具有接觸第1基板主面 1 3而按壓基板1 1的功能。然後，在爲按壓部5 8的外側區 域且在遮罩背面5 3側中與基板1 1的緣部1 2對應的位置， 形成有避免與緣部12接觸的溝部59(凹部）。溝部59係 沿著緣部1 2形成，以整體構成矩形環狀（參照第4圖、第 5圖）。溝部59，成爲可收容在緣部12發生之朝遮罩背面 53側彈起的部分（第4圖、第6圖所示之緣部12)。又， 溝部5 9的寬度，係比緣部1 2的寬度稍大，在本實施形態 設定爲200 μιη左右。又，溝部59,係在不鏽鋼板中將成爲 遮罩背面5 3的面加以半蝕刻，藉以與遮罩背面側開口部 5 6同時地形成。因此，遮罩背面側開口部5 6及溝部5 9係 成爲彼此相等的深度。 又’本實施形態之焊球搭載用遮罩5 1，係以如下的順 序製造：同時形成遮罩背面側開口部5 6及溝部5 9後，在 •15- 201212136 遮罩背面側開口部5 6的內底面5 7實施雷射開孔加工而形 成複數個遮罩表面側開口部55。若利用此製造方法，便因 對遮罩背面側開口部5 6形成後的薄壁部位進行遮罩表面 側開口部5 5用的開孔，所以開孔時的加工負擔少，能提高 成本性及生產性。又，相較於在先實施開孔加工後形成遮 罩背面側開口部56的情況，能以高精度形成形狀良好的遮 罩表面側開口部5 5。而且，能藉由選擇非機械性加工之光 學性加工，來效率佳地形成多數個微細孔。 然後，在球搭載製程，係在使遮罩背面側開口部56對 向於助熔劑F1的供給區域R2,並且使溝部59對向於基板 11的緣部12的狀態下’使焊球搭載用遮罩51的遮罩背面 5 3密貼在位於第1基板主面1 3側的防焊阻劑3 3的表面（參 照第4圖）。此時’由於在遮罩背面側開口部5 6的內底面 5 7與防焊阻劑3 3的表面之間形成空隙，所以可避免如助 熔劑F1接觸、附著在遮罩背面5 3之事態。又’在緣部12 發生之彈起的部分會被收容在溝部59內’所以焊球搭載用 遮罩51被緣部12按壓而避免如浮起之事態。接著’在焊 球搭載用遮罩51的遮罩表面52側’供給多個直徑約100 μιη 的焊球61。其結果，焊球61，落入遮罩表面側開口部55 內，承載在位於遮罩表面側開口部55正下方的塾21上’ 藉由助熔劑F1的黏著力而暫時固定在墊2 1(參照第6圖）。 即，藉由進行球搭載製程’複數個焊球6 1係透過貫通穴部 54而供給、搭載在複數個墊21上° 在接下來的回流製程’係將基板1 1放置在過去週知的[Technical Field] The present invention relates to a method of manufacturing a wiring board in which solder bumps are formed by mounting solder balls, and a solder ball mounting mask used for mounting solder balls. [Prior Art] In the past, a wiring board (so-called semiconductor package) including a 1C wafer has been known. A plurality of terminals are usually provided on the bottom surface of the 1C wafer, and as a structure for electrically connecting to the terminals, a plurality of pads having solder bumps (so-called C4 pads: Controlled Collapsed Chip Connection pads) are disposed on the wiring. In the main surface of the substrate, as a method of forming a solder bump on the wiring board, for example, it has been proposed to heat-melt the solder ball mounted on the pad to form a solder bump (see, for example, Patent Document 1). Hereinafter, a specific example of the method of forming the solder bump will be briefly described based on the first drawing. First, a plurality of pads 102 formed in the bump forming region R0 formed on the main surface 101 of the substrate are printed and coated with a flux. Next, the solder ball mounting mask 1 〇 4 having a plurality of openings 203 is placed on the main surface 1101 of the substrate, and in this state, the solder balls 156 are supplied and mounted through the respective openings 030. A plurality of pads 102 are used (for example, refer to Patent Document 1). Next, the solder balls 105 are heated and melted by reflow to form solder bumps. [PRIOR ART DOCUMENT] [Patent Document 1] JP-A-2002-151539 (Picture 1 and the like) [Description of the Invention] - 4 - 201212136 [Problems to be Solved by the Invention] However, there is a substrate 100. The edge portion 106 is bounced on the side of the mask back 07. In this case, since a part of the solder ball mounting mask 1 is lifted up by the edge portion 106 and floats, a gap is generated between the solder ball mounting mask 104 and the substrate 1 . As a result, in a state in which two solder balls 105 enter each of the openings 103, the position of the solder balls 105 is likely to be displaced from the pad 102 (so-called double ball). Therefore, since the solder bump cannot be accurately formed at a desired position, there is a problem that the defective product rate is increased and the yield is lowered. Further, recently, the solder ball 105 has a tendency to have a small diameter due to the trend of miniaturization of electronic components. However, in this case, a plurality of solder balls 1 0 5 easily enter the opening portion 103. Therefore, the problem of the positional deviation of the solder balls 105 caused by the occurrence of double balls or the like may become more serious. The present invention has been made in view of the above problems, and an object thereof is to provide a wiring substrate having solder bumps. In the manufacturing method, the solder bump can be accurately formed at a desired position by preventing the occurrence of double balls or the like, thereby improving the yield. Further, another object is to provide a solder ball mounting mask suitable for forming solder bumps. [Means for Solving the Problem] As a means for solving the above-described problems (method η is a method of manufacturing a wiring board having solder bumps, characterized in that it includes a substrate preparation process, and is prepared to arrange a plurality of pads The substrate in the bump formation area on the main surface of the substrate; the ball mounting process is performed by using a solder ball mounting mask, and the solder ball mounting mask is placed on the main surface side of the substrate, and the through hole is penetrated through 201212136. The solder ball is supplied to and mounted on the plurality of pads, wherein the solder ball mounting mask has a mask surface and a mask back surface ′, and the mask surface and the mask are formed at positions corresponding to the plurality of pads The through hole portion on the back surface is formed at a position corresponding to the outer region of the bump forming region on the outer side region of the through hole portion and at a position corresponding to the outer region of the bump forming region, and a pressing portion that contacts the substrate main surface and presses the substrate a position corresponding to the edge of the substrate in the outer region of the pressing portion and on the back side of the mask is formed to avoid connection with the edge portion In the reflow process, the solder ball to be mounted is heated and melted to form a solder bump. Accordingly, when the device 1 is used, the solder ball for forming the recess portion that avoids contact with the edge portion of the substrate is used. Since the mask is bounced on the back side of the mask, the edge portion does not come into contact with the back surface of the mask and is housed in the concave portion. As a result, it is possible to prevent the solder ball from being mounted by being pushed up by the edge portion. Since the mask floats, it is difficult to generate a gap between the solder ball mounting mask and the substrate. Accordingly, the positional deviation of the solder ball due to the occurrence of the double ball or the like is hard to occur, and the position can be correct at the desired position. Since the solder bumps are formed, the yield of the defective product can be lowered, and the yield of the printed wiring board becomes high. Hereinafter, a method of manufacturing the wiring board having the solder bumps of the above-described means 1 will be described. A system in which a plurality of pads are disposed in a bump formation region on the main surface of the substrate. The substrate material is not particularly limited and is arbitrary, but for example, a resin substrate or the like is suitable. As a suitable resin substrate, an epoxy resin (epoxy resin), a PI resin (polyfluorene 201212136 imine resin), an anthracene resin (bismaleimide-triazine resin), and a ppE resin (polyphenylene) are exemplified. A substrate composed of an ether resin or the like may be used. A substrate composed of a composite material of these resins and glass fibers (glass woven fabric or glass non-woven fabric) may be used. As a specific example thereof, there is a glass/ruthenium composite substrate and a high Tg. A highly heat-resistant laminated board such as a glass-epoxy composite substrate (fr_4, ^^^^, etc.), or a substrate made of a composite material of organic fibers such as these resins and polyamide fibers. A substrate made of a resin-resin composite material in which a thermosetting resin such as an epoxy resin is impregnated into a three-dimensional mesh-like fluororesin base material such as continuous porous PTFE can be used. As another substrate material, For example, various ceramics and the like are selected as the related substrate structure. However, for example, an additional multilayer wiring having a build-up layer on one or both sides of the core substrate is selected. The substrate is suitable. The position and the number of the bump forming regions on the main surface of the substrate are not particularly limited, but are arbitrary, but in the case of, for example, so-called cutting of a plurality of substrates, there are only a number of bump forming regions corresponding to the number of intercepts of the wiring substrate. presence. Although the bump forming region may exist only on one of the main faces of the substrate, it may exist on the other main face. For the plurality of pads disposed in the bump formation region, although the use thereof is not limited, it is preferably, for example, a pad for connecting a 1C wafer flip chip (so-called C4 pad). That is, this is because a small solder bump must be formed on the pad for flip chip connection in order to electrically connect to the 1C wafer terminal having a small size, so that a small-diameter solder ball is often used. In the next ball mounting process, a solder ball mounting mask is used to mount the 201212136 solder balls. The solder ball mounting mask used here has a structure having a mask surface and a back surface of the mask, and a through hole portion penetrating through the surface of the mask and the back surface of the mask is formed at a position corresponding to the plurality of pads. In the outer region of the cavity portion, at a position corresponding to the outer region of the bump forming region in the mask back surface, a pressing portion that presses the substrate while contacting the main surface of the substrate is formed, and is an outer region of the pressing portion and a back side of the mask. A recess corresponding to the edge portion is formed at a position corresponding to the edge of the substrate. The related solder ball mounting mask can be produced by using any material such as metal, resin, or ceramic. However, it is preferably made of a metal material such as stainless steel, copper, aluminum, or nickel. The reason is explained below. In other words, the portion where the through hole portion is formed in the solder ball mounting mask has a lower strength than the other portions. On the other hand, since the solder ball mounting mask is too thick in diameter compared with the diameter of the solder ball to be mounted, the operability and the like are lowered, so that it must be formed into a thin flat plate to a considerable extent. Therefore, in view of this, in the case of selecting a metal material, a predetermined strength can be imparted even when the solder ball mounting mask is formed thin. The thickness of the mask for the solder ball mounting mask is not particularly limited, but it is preferably thicker than the diameter of the solder ball to be mounted, and specifically, it is preferably soldered to be mounted. A plate having a mask thickness of 5 μm or more and 20 μm or less is larger than the ball diameter. If it is less than 5 μm, there is a possibility that a sufficient mechanical strength cannot be imparted to the solder ball mounting mask by the material. On the other hand, if it exceeds 20 μm, the positioning accuracy of the solder balls is lowered. Further, the through hole portion is preferably configured by a mask surface side opening portion that is opened in the mask surface and a mask back side opening portion 201212136 that is opened in the mask back surface. In this way, when the opening side of the mask is larger than the bump forming region, even if the flux-forming integral bump forming region is to be disposed, the solder ball cover is placed in the ball mounting process, and the flux is still made. It will not touch or adhere to the back of the mask. It is difficult to cause the solder ball to be removed by the solder ball mounting mask, and the solder bump can be accurately formed at a desired position. Further, the through hole portion has a plurality of mask surface side opening portions. The mask surface side opening portion is preferably a port on the mask back side opening portion. In this case, the solder balls can be set to enter the respective side opening portions one by one. Therefore, even if the occupied area of the mask back surface is to be made of the soldering ball than the occupied area of the mask surface side opening portion Mounted in an established location. Therefore, the solder can be formed at a desired position, and the occurrence rate of defective products is lowered, and the yield is improved. As a method of forming the openings on the surface of each mask surface, etching, drilling, and punching can be used for the material. Any method known in the past such as laser processing, etc. The inner diameter of these mask surfaces is larger than the diameter of the solder ball to be mounted, for example, 5 μm larger than the diameter of the solder ball to be mounted. It is preferable that if it is less than 5 μm, it may become difficult to pass the solder ball through the opening portion, and the other side may pass through the opening on the surface of the mask. When the solder ball is over, it is difficult to mount the solder ball at a predetermined position, and it is difficult to apply it to a plurality of fine pitches in the bump formation region. When the cover is closed or the position is offset, the opening of the surface of the inner surface of the plurality of inner bottom surfaces is large, and the bumps can be correctly raised. The surface of the cover surface is shaped by the shape of the mask and the opening on the side of the mask, t '1 ΟΟμηι Ultra surely through step I, lines 201,212,136 and recesses between the fine, based on the position of the mask and the back surface side of the substrate and the edge portion corresponding to the outer region of the pressing portion of the opening. Further, the 'recessed portion' is preferably a groove portion formed along the edge portion. In the case of the above-described method, the area of the recess opening in the back surface of the mask can be reduced. Therefore, it is possible to minimize the decrease in the strength of the solder ball mounting concealer when forming the recess. The method of forming the opening on the back side of the mask and the concave portion in the solder ball mounting mask can be appropriately selected depending on the mask material. When a metal material is selected, for example, the mask-side opening portion and the recessed portion are simultaneously formed by half etching, and have a depth equal to each other', which is suitable from the viewpoint of productivity and cost. Further, in addition to the half etching, a method such as cutting processing or press processing may be employed. Further, as a suitable method of the solder ball mounting mask, for example, a stainless steel plate is selected, and the surface on the back side of the mask is half-etched and the opening on the back side of the mask is simultaneously formed in the stainless steel plate. After the recessed portion, a plurality of mask surface side opening portions are formed by applying a laser drilling process to a predetermined position of the portion having the opening on the back side of the mask. The advantage of this manufacturing method is that the thin portion of the opening on the back side of the mask is opened. Therefore, the processing load at the time of opening is small, and cost and productivity can be improved. Other advantages are that a plurality of mask surface side opening portions having a good shape can be formed with high precision as compared with the case where the opening on the back side of the mask is formed after the opening processing. The size of the solder ball used in the ball mounting process is not particularly limited, and may be appropriately set depending on the use of the solder bump to be formed. For example, it is preferable to use a microball having a diameter of 200 μΐη or less (micr〇_baU). . This is •10-201212136 Since the case of using a microball can correspond to the miniaturization of a so-called C4 pad, it is easier to form a small solder bump. Further, this is because the use of a small and lightweight solder ball is a problem that is particularly problematic in the case of the so-called double ball. Therefore, the above means is of great significance. The solder material used as the solder ball is not particularly limited, but a tin-lead eutectic solder (S n / 3 7 P b : melting point of 1 8 3 ° C) can be used. A Sn/Pb-based solder other than tin-lead eutectic solder, for example, a solder composed of Sn/36Pb/2Ag (melting point: 1 90 °C), or the like can be used. Further, in addition to the lead-added solder as described above, Sn-Ag solder, Sn-Ag-Cu solder, Sn-Ag-Bi solder, Sn-Ag-Bi-Cu solder, and Sn-Zn system may be selected. Lead-free solder such as solder or Sn-Zn-Bi solder. Then, the solder ball is supplied through the through hole portion (a plurality of mask surface side openings) while the solder ball mounting mask is placed on the main surface side of the substrate. Equipped on a plurality of mats. In the subsequent reflow process, solder balls mounted on the pads are heated to a predetermined temperature to be melted to form solder bumps having a predetermined shape. Through the above process, a wiring substrate having solder bumps can be manufactured. Another means for the above-mentioned problem (the means 2) is a solder ball mounting mask having a mask surface and a back surface of the mask, and a through hole portion penetrating the surface of the mask and the back surface of the mask. In a state in which it is disposed on the main surface side of the substrate of the substrate, the solder ball is supplied through the plurality of through hole portions and is mounted on the main surface of the substrate, and is characterized in that the back surface side of the mask is outside the through hole portion. A pressing portion that contacts the main surface of the substrate and presses the substrate is formed, and a concave portion that avoids contact with an edge portion of the substrate is formed on the back side of the mask on the outer region -11 to 201212136 of the pressing portion. According to this, the solder ball mounting mask can be used to form a concave portion that avoids contact with the edge portion of the substrate. Therefore, even if the edge portion is bounced on the back surface side of the mask, the solder ball is mounted. The mask is placed on the main surface side of the substrate, and the edge portion is not accommodated in the concave portion and does not come into contact with the back surface of the mask. As a result, it is possible to prevent the solder ball mounting mask from being lifted by the edge portion being lifted, so that a gap is unlikely to occur between the solder ball mounting mask and the substrate. According to this, it is difficult to cause the positional deviation of the solder ball due to the occurrence of the double ball or the like, and therefore, it becomes a solder ball mounting mask suitable for the formation of the solder bump. [Embodiment] [Embodiment for Carrying Out the Invention] Hereinafter, a method of manufacturing a wiring board according to an embodiment of the present invention will be described in detail based on Figs. 1 to 7 . As shown in Fig. 1, the wiring board 10 of the present embodiment is a multi-layer wiring board in which both sides of the build-up layers 15 and 16 are provided on both sides. The core substrate 17 constituting the wiring board 10 is formed into a substantially rectangular plate-like member in plan view, and a through hole conductor (not shown) is formed in a plurality of portions. These through-hole conductors are electrically connected to the core. The conductor of the build-up layer 15 on the upper side of the substrate 17 and the conductor of the build-up layer 16 on the lower side of the core substrate 17. On the surface of the build-up layer 15 (the first substrate main surface 13), a substantially rectangular bump-forming region R1 is formed in plan view, and a plurality of solders having a height of about 80 μm to ΙΟΟμπι are disposed in the bump-forming region R1. Bump -12- 201212136 62. These solder bumps 62 are used for flip chip connection with the terminals of the 1C wafer 71, so-called pads for C4. On the other hand, a bump forming region (not shown) is provided on the surface (second substrate main surface 14) of the build-up layer 16, and a plurality of heights of about 400 μm to 600 μm are provided in the bump forming region. Solder bump 63. These solder bumps 63 are used for electrical connection with terminals on the mother board side (not shown), so-called B G Α bumps. Since the additional layers 15 and 16 of the present embodiment have the same structure, only the above-described additional layer 15 of the upper side will be described in detail. As shown in Fig. 7, the build-up layer 15 is formed by alternately stacking the interlayer insulating layers 31 and 32 and the copper-plated conductor layers 43, 44. The interlayer insulating layer 3 1 ' 3 2 has a thickness of about 3 μm, and is composed of, for example, a resin-resin composite material in which an epoxy resin is impregnated into continuous porous PTFE. Further, a plurality of pads 2 1 are arranged in an array on the surface of the interlayer insulating layer 32 of the second layer. Further, the surface of the interlayer insulating layer 32 is almost entirely covered with the solder resist 3 3 . In the solder resist 33, an opening 22 for exposing each pad 21 is formed. Further, at a predetermined portion of the interlayer insulating layers 3 1 and 3 2 , filled via conductors 41 and 42 made of ore copper are respectively provided. The charge conducting conductors 41, 42 electrically connect the pads 21 and the conductor layers 43, 44 to each other. Next, a method of manufacturing the wiring substrate 10 having the solder bumps 62, 63 will be described. First, the substrate preparation process is performed, and a plurality of pads 21 are placed on the substrate 11 in the bump formation region R1 on the first substrate main surface 13 (refer to Fig. 2). Moreover, at this stage, each of the pads 21 is exposed from the respective opening portions 22 of the solder resist 3 3 . -13- 201212136 In the next flux supply process, the substrate 11 is placed in a conventional printing device (not shown), and printing is performed by using a mesh mask. The flux F1 is evenly applied to the first substrate main surface 13 side (see FIG. 3). At this time, the flux F1 is applied to the entire supply region R2 of the co-solvent F1 in a region one turn larger than the bump forming region R1. In the next ball mounting process, the solder ball 61 is mounted using the solder ball mounting mask 51 (see Fig. 4). In the present embodiment, a microball having a diameter of about ΙΟΟμηη is used as the solder ball 61. Further, the solder ball mounting mask 51 is composed of a stainless steel plate having a mask surface 52 and a mask back surface 53. Further, the solder ball mounting mask 51 has a mask thickness (ΙΙΟμι») which is larger than the diameter of the solder ball 1. Further, the mask surface 52 and the mask back surface 53 are flat surfaces having no protruding portions. Then, a through hole portion 54 that penetrates the mask surface 52 and the mask back surface 53 is formed at a position ' corresponding to each of the pads 2 1 in the solder ball mounting mask 51. The through hole portion 504 is composed of a plurality of mask surface side opening portions 5 that are opened in the mask surface 52, and one mask back surface side opening portion 56 that is opened in the mask back surface 53. . In addition to the mask surface 5 2 , each of the mask surface side opening portions 5 5 also has an opening region R3 which is far smaller than the bump forming region R 1 in the inner bottom surface 57 of the mask back side opening portion 56. The circular through hole is observed in plan view (see Fig. 4 and Fig. 5). Each of the mask surface side opening portions 55 has an inner diameter (about 130 μm to 170 μm) which is about several tens of μm larger than the diameter of the solder balls 61 to be mounted. Further, each of the mask surface side opening portions 55 is set to have a depth (55 μm) of 50% of the thickness of the mask. On the other hand, the cover back side opening portion 56 is formed at a position corresponding to the bump forming region R1 in the mask back surface 53 side, and is slightly wider than the supply region R2 of the flux F1. A rectangular through hole is observed in the plane of the occupied area R4 (see FIG. 4 and FIG. 5). As a result, the occupied area R4 of the mask-side opening-side opening portion 56 is larger than the occupied area R3 of each of the mask-surface-side opening portions 55. Further, the mask back side opening portion 56 is set to have a depth (5 5 μm) of 50% of the thickness of the mask. As shown in FIG. 4, in the outer region of the through hole portion 54, and on the side of the mask back surface 53, the position corresponding to the outer region of the bump forming region R1 (and the supply region R2 of the flux F1), A pressing portion 58 is formed. The pressing portion 58 is set to have the same thickness as the thickness of the mask, and has a function of contacting the first substrate main surface 13 and pressing the substrate 11. Then, a groove portion 59 (concave portion) for avoiding contact with the edge portion 12 is formed at a position corresponding to the edge portion 12 of the substrate 11 in the outer region of the pressing portion 58 and on the side of the mask back surface 53. The groove portion 59 is formed along the edge portion 12, and has a rectangular ring shape as a whole (see Figs. 4 and 5). The groove portion 59 is accommodated in a portion (the edge portion 12 shown in Figs. 4 and 6) which is generated by the edge portion 12 to be bounced toward the mask back surface 53 side. Further, the width of the groove portion 59 is slightly larger than the width of the edge portion 12, and is set to about 200 μm in the present embodiment. Further, the groove portion 59 is half-etched in the surface of the stainless steel sheet which is the mask back surface 53, and is formed simultaneously with the mask back side opening portion 56. Therefore, the mask back side opening portion 56 and the groove portion 59 are formed to have the same depth. In addition, the solder ball mounting mask 51 of the present embodiment is manufactured in the following order: after the mask back side opening portion 56 and the groove portion 5 9 are formed at the same time, the back side opening portion 5 is masked in the period of 15th to 12th The inner bottom surface 5 of the 6 is subjected to laser drilling to form a plurality of mask surface side opening portions 55. According to this manufacturing method, since the opening for the surface-side opening portion 5 is formed in the thin-walled portion formed by the opening-side opening portion 56 of the mask, the processing load at the time of opening is small, and the cost can be improved. And productive. Moreover, the mask surface side opening portion 5 having a good shape can be formed with high precision as compared with the case where the mask back side opening portion 56 is formed after the hole forming process. Further, it is possible to efficiently form a plurality of fine pores by selecting optical processing of non-mechanical processing. In the ball mounting process, the solder ball is mounted in a state where the mask back side opening portion 56 is opposed to the supply region R2 of the flux F1 and the groove portion 59 is opposed to the edge portion 12 of the substrate 11. The mask back surface 539 of the mask 51 is in close contact with the surface of the solder resist 3 on the side of the first substrate main surface 13 (see FIG. 4). At this time, since a gap is formed between the inner bottom surface 57 of the opening-side opening portion 56 of the mask and the surface of the solder resist 3 3, it is possible to avoid the situation in which the flux F1 is in contact with and adheres to the back surface of the mask 53. . Further, the portion of the edge portion 12 that is bounced is accommodated in the groove portion 59. Therefore, the solder ball mounting mask 51 is pressed by the edge portion 12 to prevent the floating state. Then, a plurality of solder balls 61 having a diameter of about 100 μm are supplied to the side of the mask surface 52 of the solder ball mounting mask 51. As a result, the solder ball 61 falls into the opening surface portion 55 of the mask surface, and is carried on the crucible 21 located directly below the opening portion 55 on the surface of the mask surface. The toner is temporarily fixed to the mat 2 by the adhesive force of the flux F1. (Refer to Figure 6). In other words, by performing the ball mounting process, a plurality of solder balls 6 1 are supplied through the through hole portions 54 and are mounted on a plurality of pads 21. In the subsequent reflow process, the substrate 1 1 is placed in the past.
S -16 - 201212136 回流爐內，將已搭載在各墊21上之各焊球61加熱至既定 溫度而使其熔融。其結果，形成第7圖所示形狀之焊料凸 塊62。又，雖然省略詳細的說明，但對第2基板主面1 4 側形成焊料凸塊63亦依此進行。經過以上的製程’製造具 有焊料凸塊62、63的配線基板1〇。 據此，根據本實施形態便能獲得以下的效果。 (1)在本實施形態的製造方法，使用形成有避免與基 板11的緣部12接觸的溝部59之焊球搭載用遮罩51’因 此即使緣部1 2在遮罩背面5 3側彈起，緣部1 2仍不會接觸 遮罩背面53而成爲被收容在溝部59內。其結果，可防止 因被緣部12推升所造成之焊球搭載用遮罩51浮起，因此 使得在焊球搭載用遮罩5 1與基板1 1之間難有間隙產生。 據此，使得因雙球（參照第10圖）等之發生所造成之焊球 61位置偏離難以發生，能在所要的位置正確地形成焊料凸 塊62、63。故，可壓低不良品發生率，所製造之配線基板 10的良率變高。 (2 )在本實施形態，貫通穴部54係藉由遮罩表面側 開口部55與遮罩背面側開口部56構成，遮罩背面側開口 部56的占有區域R4成爲比助熔劑F1的供給區域R2還 大。因此，即使要將助熔劑F 1供給在供給區域R2，在球 搭載製程中配置焊球搭載用遮罩51，仍使得助熔劑F1不 會對遮罩背面53接觸、附著。故，成爲難以發生因焊球搭 載用遮罩51所造成之焊球61的帶走或位置偏離，能將焊 料凸塊62正確地形成在所要的位置。 -17- 201212136 又，亦可如以下般變更本實施形態。 •在上述實施形態之焊球搭載用遮罩51，貫通穴部54 係藉由複數個遮罩表面側開口部5 5、及1個遮罩背面側開 口部56構成。但是，亦可形成複數個藉由1個遮罩表面側 開口部5 5及1個遮罩背面側開口部5 6所構成之開口部， 將各個遮罩背面側開口部56的占有面積作成比各個遮罩 表面側開口部55的占有面積大。又，亦可以省略遮罩背面 側開口部5 6，使各遮罩表面側開口部5 5在遮罩表面5 2及 遮罩背面5 3雙方中開口的方式進行。 •在上述實施形態，係以半蝕刻形成焊球搭載用遮罩 5 1之遮罩背面側開口部5 6及溝部5 9，但亦可利用切削加 工等來形成它。又在上述實施形態，係利用雷射開孔加工 來形成在焊球搭載用遮罩51之複數個遮罩表面側開口部 5 5，但亦可利用鑽孔加工等來形成它們。 •在上述實施形態，係利用金屬材料來形成焊球搭載 用遮罩5 1 ’但是亦可利用例如樹脂材料來形成。在此情況， 當模具成形時，亦可以同時形成遮罩表面側開口部55、遮 罩背面側開口部5 6、及溝部5 9的方式進行。 •在上述實施形態，係使用直徑爲約ΙΟΟμπι的微型球 作爲要被搭載之焊球61 ’但亦能使用例如直徑爲 300μιη~500μιη左右之比較大的焊球。 •在上述實施形態，配線基板10所具備之複數個墊 21’係成爲用於將1C晶片71覆晶連接的墊，但亦可爲用 於將I C晶片7 1以外的電子零件或其他配線基板覆晶連接 -18- 201212136 的墊。 •在上述實施形態之焊球搭載用遮罩51，係在遮 面53中與緣部12對應的位置形成溝部59。但是，亦 第8圖所示之焊球搭載用遮罩81，在遮罩背面 部1 2對應的位置’利用軟質材料形成保持部8 9，該 部8 9係將在緣部1 2發生之朝遮罩背面8 3側彈起的部 以保持。在依此方式進行的情況，保持部8 9被緣部 壓而變形’藉此產生凹部，所以可防止因被被緣部12 所造成之焊球搭載用遮罩81的浮起。 •在上述實施形態之製造方法，係使用在遮罩背i 中在與緣部12對應的位置形成溝部59之焊球搭載用 51。但是’亦可使用如第9圖所示，藉由使與緣部12 的位置彎曲，來形成避免與緣部12接觸之凹部99的 搭載用遮罩91。在此情況，隨著凹部99之形成，產 遮罩表面92側突出的突條93，因此可藉由突條93來 焊球6 1朝焊球搭載用遮罩9 1外脫落。 接著’以下列舉由前述的實施形態所掌握的技術兒 (1 )在上述手段1中，一種具有焊料凸塊的配線 製造方法’其特徵爲：在前述基板準備製程後且前 g m M f呈後’進行將助熔劑供給.至整體前述凸塊形成 2 15 ‘溶齊IM共給製程，前述凹部，係藉由將在前述緣部 之朝前述遮罩背面側彈起的部分加以收容，來避免與 緣部的接觸。 (2)在上述手段1中，一種具有焊料凸塊的配線 罩背 可如 與緣 保持 分加 2按 按壓 S 53 遮罩 對應 焊球 生在 防止 丨、想。 基板 述球 區域 發生 前述 基板 -19- 201212136 之製造方法，其特徵爲：前述凹部，係利用軟質材料形成， 係將在前述緣部發生之朝前述遮罩背面側彈起的部分加以 保持的保持部。 【圖式簡單說明】 第1圖係本實施形態之具有焊料凸塊的配線基板的槪 略圖。 第2圖係用於說明配線基板之製造方法的主要部分剖 面圖。 第3圖係用於說明配線基板之製造方法的主要部分剖 面圖。 第4圖係用於說明配線基板之製造方法的主要部分放 大剖面圖。 第5圖係用於說明配線基板之製造方法的主要部分平 面圖。 第6圖係用於說明配線基板之製造方法的主要部分放 大剖面圖。 第7圖係用於說明配線基板之製造方法的主要部分剖 面圖。 第8圖係用於說明在其他實施形態之配線基板之製造 方法的主要部分放大剖面圖。 第9圖係用於說明在其他實施形態之配線基板之製造 方法的主要部分放大剖面圖。 第1 〇圖係顯示過去技術之問題點的主要部分放大剖 面圖。 -20- 201212136 【主要元件符號說明】 10 配 線 基 11 基 板 12 基 板 的 13 作 爲 基 2 1 墊 51 、 81 、 91 焊 球 搭 52 ' 92 遮 罩 表 板 緣部 板主面的第1基板主面 載用遮罩 面 53 ' 83 遮 罩 背 面 54 貫 通 穴 部 55 遮 罩 表 面 56 遮 罩 背 面 57 遮 罩 背 面 58 按 壓 部 59 作 爲 凹 部 6 1 焊 球 62 焊 料 凸 塊 99 凹 部 R1 凸 塊 形 成 R3 遮 罩 表 面 R4 遮 罩 背 面 側開口部 側開口部 側開口部的內底面 的溝部 區域 側開口部的占有區域 側開口部的占有區域 -21 -S -16 - 201212136 In the reflow furnace, each of the solder balls 61 mounted on the pads 21 is heated to a predetermined temperature to be melted. As a result, the solder bumps 62 having the shape shown in Fig. 7 are formed. Further, although the detailed description is omitted, the formation of the solder bumps 63 on the side of the main surface 14 of the second substrate is also performed. Through the above process, a wiring substrate 1A having solder bumps 62 and 63 is manufactured. According to this embodiment, the following effects can be obtained. (1) In the manufacturing method of the present embodiment, the solder ball mounting mask 51' in which the groove portion 59 that is in contact with the edge portion 12 of the substrate 11 is formed is used, so that the edge portion 1 2 bounces on the mask back surface 5 3 side. The edge portion 1 2 does not contact the mask back surface 53 and is housed in the groove portion 59. As a result, it is possible to prevent the solder ball mounting mask 51 from being lifted by the edge portion 12 from being lifted up, so that a gap is unlikely to occur between the solder ball mounting mask 5 1 and the substrate 1 1 . According to this, it is difficult to cause the positional deviation of the solder ball 61 due to the occurrence of the double ball (refer to Fig. 10) or the like, and the solder bumps 62 and 63 can be accurately formed at a desired position. Therefore, the incidence of defective products can be lowered, and the yield of the manufactured wiring substrate 10 becomes high. (2) In the present embodiment, the through hole portion 54 is formed by the mask surface side opening portion 55 and the mask back side opening portion 56, and the occupied region R4 of the mask back side opening portion 56 is supplied to the flux F1. The area R2 is still large. Therefore, even if the flux F1 is to be supplied to the supply region R2, the solder ball mounting mask 51 is placed in the ball mounting process, so that the flux F1 does not contact or adhere to the mask back surface 53. Therefore, it is difficult to cause the solder ball 61 to be removed or displaced due to the solder ball mounting mask 51, and the solder bump 62 can be accurately formed at a desired position. -17- 201212136 Further, the present embodiment can be changed as follows. In the solder ball mounting mask 51 of the above-described embodiment, the through hole portion 54 is composed of a plurality of mask surface side opening portions 55 and one mask back side opening portion 56. However, a plurality of openings formed by one of the mask surface side opening portions 55 and one of the mask back side opening portions 56 may be formed, and the occupied area of each of the mask back side opening portions 56 may be formed as a ratio. The area occupied by each of the mask surface side opening portions 55 is large. Further, the mask back side opening portion 5 may be omitted so that the mask surface side opening portions 55 are opened in both the mask surface 5 2 and the mask back surface 53. In the above-described embodiment, the mask back side opening portion 56 and the groove portion 5 of the solder ball mounting mask 5 1 are formed by half etching, but it may be formed by cutting or the like. Further, in the above-described embodiment, the plurality of mask surface side opening portions 5 of the solder ball mounting mask 51 are formed by laser drilling, but they may be formed by drilling or the like. In the above embodiment, the solder ball mounting mask 5 1 ' is formed of a metal material, but it may be formed of, for example, a resin material. In this case, when the mold is molded, the mask surface side opening portion 55, the mask back side opening portion 56, and the groove portion 59 may be simultaneously formed. In the above embodiment, a microball having a diameter of about ΙΟΟμπι is used as the solder ball 61' to be mounted. However, a relatively large solder ball having a diameter of about 300 μm to 500 μm can also be used. In the above-described embodiment, the plurality of pads 21' included in the wiring board 10 are pads for flip-chip bonding the 1C wafer 71, but may be electronic components or other wiring boards other than the IC wafer 71. Flip-chip connection -18- 201212136 pad. In the solder ball mounting mask 51 of the above-described embodiment, the groove portion 59 is formed at a position corresponding to the edge portion 12 in the mask surface 53. However, in the solder ball mounting mask 81 shown in Fig. 8, the holding portion 8 is formed of a soft material at a position corresponding to the mask back portion 12, and the portion 8 is formed at the edge portion 12. The portion that bounces toward the back side of the mask 8 3 is held. In the case of the above-described manner, the holding portion 88 is deformed by the edge portion, and the concave portion is formed. Therefore, the floating of the solder ball mounting mask 81 caused by the edge portion 12 can be prevented. In the manufacturing method of the above-described embodiment, the solder ball mounting 51 in which the groove portion 59 is formed at a position corresponding to the edge portion 12 in the mask back i is used. However, as shown in Fig. 9, by using the position of the edge portion 12, the mounting mask 91 for avoiding the concave portion 99 in contact with the edge portion 12 can be formed. In this case, as the concave portion 99 is formed, the protrusion 93 protruding from the side of the mask surface 92 is produced. Therefore, the solder ball 61 can be detached from the solder ball mounting mask 91 by the protrusion 93. Next, the technique (1) of the above-described means 1 in the above-described means 1 is a method of manufacturing a wiring having solder bumps, which is characterized in that after the substrate preparation process and before the front gm M f is 'Providing the flux supply to the entire bump formation 2 15 'solubilization IM co-feeding process, the recess is prevented by accommodating the portion of the edge portion that is bounced toward the back side of the mask Contact with the rim. (2) In the above means 1, a wiring cover back having a solder bump can be added as a rim to the edge. 2 Pressing the S 53 mask corresponding to the solder ball is generated to prevent smudging. In the method of manufacturing the above-mentioned substrate -19-201212136, the concave portion is formed of a soft material, and is held in a portion of the edge portion that is bounced toward the back surface side of the mask. unit. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a wiring board having solder bumps in the present embodiment. Fig. 2 is a cross-sectional view showing the main part of a method of manufacturing a wiring board. Fig. 3 is a cross-sectional view showing the main part of a method of manufacturing a wiring board. Fig. 4 is a cross-sectional view showing the main part of a method of manufacturing a wiring board. Fig. 5 is a plan view showing a principal part for explaining a method of manufacturing a wiring board. Fig. 6 is a cross-sectional view showing the main part of a method of manufacturing a wiring board. Fig. 7 is a cross-sectional view showing the main part of a method of manufacturing a wiring board. Fig. 8 is an enlarged cross-sectional view showing the main part of a method of manufacturing a wiring board according to another embodiment. Fig. 9 is an enlarged cross-sectional view showing the main part of a method of manufacturing a wiring board according to another embodiment. The first diagram shows an enlarged cross-sectional view of the main part of the problem point of the past technology. -20- 201212136 [Description of main component symbols] 10 Wiring base 11 Substrate 12 Substrate 13 As a base 2 1 Pad 51, 81, 91 Solder ball 52' 92 First main surface of the main surface of the mask edge board Carrier mask 53' 83 Mask back 54 Passing hole 55 Mask surface 56 Mask back 57 Mask back 58 Pressing portion 59 as recess 6 1 Solder ball 62 Solder bump 99 Recess R1 Bump to form R3 mask The surface R4 covers the occupied area of the opening portion of the groove portion region side opening portion of the inner bottom surface of the opening portion on the back side opening portion side opening portion side opening portion - 21 -