TWI524442B - Method for manufacturing wiring board having solder bumps, mask for solder ball mounting - Google Patents
Method for manufacturing wiring board having solder bumps, mask for solder ball mounting Download PDFInfo
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- TWI524442B TWI524442B TW100108462A TW100108462A TWI524442B TW I524442 B TWI524442 B TW I524442B TW 100108462 A TW100108462 A TW 100108462A TW 100108462 A TW100108462 A TW 100108462A TW I524442 B TWI524442 B TW I524442B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
本發明係關於藉由搭載焊球來形成焊料凸塊的配線基板之製造方法、及搭載焊球所使用之焊球搭載用遮罩。 The present invention relates to a method of manufacturing a wiring board in which a solder bump is formed by mounting a solder ball, and a solder ball mounting mask used for mounting a solder ball.
過去，已知有搭載IC晶片而構成的配線基板(所謂的半導體封裝)。在IC晶片的底面通常設置有多個端子，作為用於謀求與那些端子的電性連接之構造，將多個具有焊料凸塊的墊(所謂的C4墊：Controlled Collapsed Chip Connection墊)設置在配線基板的主面上。又，作為在上述配線基板形成焊料凸塊的方法，例如，已提出使搭載在墊上的焊球加熱熔融而形成焊料凸塊的方案(例如參照專利文獻1)。以下，基於第10圖簡單地說明焊料凸塊之形成方法的具體例。 In the past, a wiring board (so-called semiconductor package) including an IC chip has been known. A plurality of terminals are usually provided on the bottom surface of the IC wafer, and as a structure for electrically connecting to the terminals, a plurality of pads having solder bumps (so-called C4 pads: Controlled Collapsed Chip Connection pads) are disposed on the wiring. The main surface of the substrate. Moreover, as a method of forming a solder bump on the wiring board, for example, it has been proposed to heat-melt a solder ball mounted on a pad to form a solder bump (see, for example, Patent Document 1). Hereinafter, a specific example of the method of forming the solder bump will be briefly described based on Fig. 10 .
首先，對形成在基板主面101上之凸塊形成區域R0內的複數個墊102，印刷塗布助熔劑(flux)。接下來，將具有複數個開口部103之焊球搭載用遮罩104配置在基板主面101上，在此狀態下透過各開口部103使焊球105供給且搭載在複數個墊102上(例如參照專利文獻1)。接下來，利用回焊使焊球105加熱熔融，藉以形成焊料凸塊。 First, a flux is printed and applied to a plurality of pads 102 formed in the bump forming region R0 on the main surface 101 of the substrate. Then, the solder ball mounting mask 104 having the plurality of openings 103 is placed on the substrate main surface 101, and in this state, the solder balls 105 are supplied through the respective openings 103 and mounted on the plurality of pads 102 (for example, Refer to Patent Document 1). Next, the solder balls 105 are heated and melted by reflow, thereby forming solder bumps.
[專利文獻1]日本特開2002-151539號公報(第1圖等) [Patent Document 1] Japanese Laid-Open Patent Publication No. 2002-151539 (Fig. 1, etc.)
然而，會有基板100的緣部106在遮罩背面107側彈起的情況。在此情況下，由於焊球搭載用遮罩104的一部分會被緣部106推升而浮起，所以在焊球搭載用遮罩104與基板100之間會有間隙產生。其結果，成為在1個開口部103內有2個焊球105進入的狀態而成為容易發生焊球105的位置偏離墊102上等之事態(所謂的雙球(double ball))。因此，成為無法將焊料凸塊正確地形成在所要的位置，所以有不良品發生率變高而良率降低的問題。However, there is a case where the edge portion 106 of the substrate 100 bounces on the side of the mask back 107. In this case, since a part of the solder ball mounting mask 104 is lifted up by the edge portion 106 and floats, a gap is generated between the solder ball mounting mask 104 and the substrate 100. As a result, in a state in which two solder balls 105 enter each of the openings 103, the position of the solder balls 105 is likely to be displaced from the pad 102 (so-called double ball). Therefore, since the solder bump cannot be accurately formed at a desired position, there is a problem that the defective product rate is increased and the yield is lowered.
又，在最近，受到電子零件小型化潮流的影響，焊球105也有小口徑化的趨勢，但在此情況下，複數個焊球105變得容易進入開口部103內。因此，因雙球等之發生所造成之焊球105位置偏離的問題可能會變得更加嚴重。Further, recently, the solder ball 105 tends to have a small diameter due to the trend of miniaturization of electronic components. However, in this case, the plurality of solder balls 105 easily enter the opening 103. Therefore, the problem of the positional deviation of the solder ball 105 caused by the occurrence of double balls or the like may become more serious.
本發明係鑑於上述課題所成就者，其目的在於提供一種具有焊料凸塊的配線基板之製造方法，能藉由防止雙球等之發生而可在所要的位置正確地形成焊料凸塊，來使良率提高。又，其他的目的在於提供一種適於形成焊料凸塊的焊球搭載用遮罩。The present invention has been made in view of the above problems, and an object of the invention is to provide a method of manufacturing a wiring board having solder bumps, which can accurately form solder bumps at desired positions by preventing occurrence of double balls or the like. The yield is improved. Further, another object is to provide a solder ball mounting mask suitable for forming solder bumps.
作為用於解決上述課題之手段(手段1)，係一種具有焊料凸塊的配線基板之製造方法，其特徵為包含：基板準備製程，係準備將複數個墊配置在基板主面上之凸塊形成區域內的基板；球搭載製程，係使用焊球搭載用遮罩，在將此焊球搭載用遮罩配置在前述基板主面側的狀態下透過貫通穴部將焊球供給且搭載在前述複數個墊上，其中該焊球搭載用遮罩具有遮罩表面及遮罩背面，在與前述複數個墊對應的位置形成有貫通前述遮罩表面及前述遮罩背面的貫通穴部，在為前述貫通穴部的外側區域且在前述遮罩背面側中與前述凸塊形成區域的外側區域對應的位置，形成有接觸前述基板主面而按壓前述基板之按壓部，在為前述按壓部的外側區域且在前述遮罩背面側中與前述基板的緣部對應的位置，形成有避免與前述緣部接觸的凹部；及回焊製程，係使已搭載的前述焊球加熱熔融而形成焊料凸塊；前述凹部，係利用軟質材料形成，係將在前述緣部發生之朝前述遮罩背面側彈起的部分加以保持的保持部。 As a means for solving the above-described problems (means 1), a method of manufacturing a wiring board having solder bumps, comprising: a substrate preparation process, which is a bump for arranging a plurality of pads on a main surface of a substrate In the ball-mounting process, the solder ball mounting mask is used, and the solder ball mounting mask is placed on the main surface side of the substrate, and the solder ball is supplied through the through hole portion and mounted on the substrate. a plurality of pads, wherein the solder ball mounting mask has a mask surface and a mask back surface, and a through hole portion penetrating the mask surface and the back surface of the mask is formed at a position corresponding to the plurality of pads. a pressing portion that presses the substrate main surface and contacts the substrate, and is located at an outer region of the pressing portion, at a position corresponding to an outer region of the bump forming region on the outer side region of the mask portion. And a recess portion that avoids contact with the edge portion is formed at a position corresponding to an edge portion of the substrate on the back side of the mask; and a reflow process is performed to enable the front portion to be mounted Heating and melting the solder balls to form solder bumps; the concave portion based material is formed by a soft, bouncing back surface side of the mask-based portion to be held in the holding portion toward the occurrence of the edge portion.
據此，若利用手段1，便使用形成有避免與基板的緣部接觸的凹部之焊球搭載用遮罩，因此即使緣部在遮罩背面側彈起，緣部仍不會接觸遮罩背面而成為被收容在凹部內。其結果，可防止因被緣部推升所造成之焊球搭載用遮罩浮起，因此使得在焊球搭載用遮罩與基板之間難有間隙產生。據此，使得因雙球等之發生所造成之焊球位置偏離難以發生，成為能在所要的位置正確地形成焊料凸塊，因此可壓低不良品發生率，所製造之配線基板的良率變高。 According to this, when the means 1 is used, the solder ball mounting mask in which the concave portion which is in contact with the edge portion of the substrate is formed is used. Therefore, even if the edge portion bounces on the back side of the mask, the edge portion does not contact the back surface of the mask. It is contained in the recess. As a result, it is possible to prevent the solder ball mounting mask from being lifted by the edge portion being lifted up, so that it is difficult to generate a gap between the solder ball mounting mask and the substrate. According to this, it is difficult to cause the solder ball position to be displaced due to the occurrence of the double ball or the like, and the solder bump can be accurately formed at the desired position. Therefore, the occurrence rate of the defective product can be lowered, and the yield of the manufactured wiring substrate becomes small. high.
以下，就關於上述手段1之具有焊料凸塊的配線基板之製造方法加以說明。 Hereinafter, a method of manufacturing the wiring board having the solder bumps of the above-described means 1 will be described.
在基板準備製程，係準備將複數個墊配置在基板主面上之凸塊形成區域內的基板。基板材料未受特別限定而為任意的，但是例如，樹脂基板等是合適的。作為合適的樹脂基板，可舉出由EP樹脂(環氧樹脂)、PI樹脂(聚醯亞胺樹脂)、BT樹脂(雙馬來亞醯胺-三嗪樹脂)、PPE樹脂(聚苯醚樹脂)等所構成之基板。此外，亦可使用由這些樹脂與玻璃纖維(玻璃織布或玻璃不織布)的複合材料所構成的基板。作為其具體例，有玻璃-BT複合基板、高Tg玻璃-環氧複合基板(FR-4、FR-5等)等之高耐熱性積層板等。又，亦可使用由這些樹脂與聚醯胺纖維等之有機纖維的複合材料所構成的基板。或者是，亦可使用由使環氧樹脂等之熱硬化性樹脂含浸至連續多孔質PTFE等之三維網目狀氟系樹脂基材的樹脂-樹脂複合材料所構成之基板等。作為其他的基板材料，能選擇例如各種陶瓷等。又，作為相關的基板構造未受特別限定，但是例如在核心基板的單面或兩面有增建層(build-up layer)的增建多層配線基板是合適的。In the substrate preparation process, a substrate in which a plurality of pads are disposed in a bump formation region on the main surface of the substrate is prepared. The substrate material is not particularly limited and is arbitrary, but for example, a resin substrate or the like is suitable. Examples of suitable resin substrates include EP resin (epoxy resin), PI resin (polyimine resin), BT resin (bismaleimide-triazine resin), and PPE resin (polyphenylene ether resin). ) A substrate formed by the like. Further, a substrate composed of a composite material of these resins and glass fibers (glass woven fabric or glass non-woven fabric) may also be used. Specific examples thereof include a high heat-resistant laminated board such as a glass-BT composite substrate or a high Tg glass-epoxy composite substrate (FR-4, FR-5, etc.). Further, a substrate composed of a composite material of these resins and organic fibers such as polyamide fibers may be used. Alternatively, a substrate made of a resin-resin composite material obtained by impregnating a thermosetting resin such as an epoxy resin into a three-dimensional mesh-shaped fluorine resin substrate such as continuous porous PTFE may be used. As other substrate materials, for example, various ceramics and the like can be selected. Further, the related substrate structure is not particularly limited, but for example, an additional multilayer wiring board having a build-up layer on one side or both sides of the core substrate is suitable.
基板主面上之凸塊形成區域的位置及數量未受特別限定而是任意的，但是在例如所謂的截取多個基板的情況下，僅有數量與配線基板的截取數量相當的凸塊形成區域存在。雖然凸塊形成區域可只存在於基板中之一方的主面，但是亦可存在於他方的主面。The position and the number of the bump forming regions on the main surface of the substrate are not particularly limited, but are arbitrary, but in the case of, for example, so-called cutting of a plurality of substrates, there are only a number of bump forming regions corresponding to the number of intercepts of the wiring substrate. presence. Although the bump forming region may exist only on one main surface of the substrate, it may exist on the other main surface.
對於配置在凸塊形成區域內的複數個墊，雖然其用途未受到限定，但較佳為例如用於將IC晶片覆晶(flip chip)連接的墊(所謂的C4墊)。即，這是因為在用於覆晶連接的墊上，必須形成小的焊料凸塊以便謀求與尺寸小的IC晶片端子電性連接，因此多半使用小口徑的焊球的緣故。For the plurality of pads disposed in the bump formation region, although the use thereof is not limited, it is preferably, for example, a pad for connecting flip chips of an IC chip (so-called C4 pad). That is, this is because a small solder bump must be formed on the pad for flip chip connection in order to electrically connect the IC chip terminal having a small size, so that a small-diameter solder ball is often used.
在接下來的球搭載製程，係使用焊球搭載用遮罩來進行焊球之搭載。在此使用之焊球搭載用遮罩具有如下的構造：具有遮罩表面及遮罩背面，在與複數個墊對應的位置形成有貫通遮罩表面及遮罩背面的貫通穴部，在為貫通穴部的外側區域且在遮罩背面中與凸塊形成區域的外側區域對應的位置，形成有接觸前述基板主面而按壓基板之按壓部，在為按壓部的外側區域且在遮罩背面側中與基板的緣部對應的位置，形成有避免與緣部接觸的凹部。In the next ball mounting process, a solder ball mounting mask is used to mount the solder ball. The solder ball mounting mask used here has a structure having a mask surface and a back surface of the mask, and a through hole portion penetrating through the surface of the mask and the back surface of the mask is formed at a position corresponding to the plurality of pads. In the outer region of the cavity portion, at a position corresponding to the outer region of the bump forming region in the mask back surface, a pressing portion that presses the substrate while contacting the main surface of the substrate is formed, and is an outer region of the pressing portion and a back side of the mask. A recess corresponding to the edge portion is formed at a position corresponding to the edge of the substrate.
相關的焊球搭載用遮罩，可使用金屬、樹脂、陶瓷等任意的材料來製作，但較佳為使用例如不鏽鋼、銅、鋁、鎳等金屬材料來製作。其理由說明如下。即，在焊球搭載用遮罩中形成貫通穴部的部位，會成為強度比其他部位還低。另一方面，焊球搭載用遮罩，比要搭載之焊球直徑過厚太多就會導致操作性等降低，因此必須相當程度地形成為薄平板狀。因此就這點來看，在選擇金屬材料的情況下，即使當將焊球搭載用遮罩薄薄地形成時仍能賦予既定的強度。The related solder ball mounting mask can be produced using any material such as metal, resin, or ceramic. However, it is preferably made of a metal material such as stainless steel, copper, aluminum, or nickel. The reason is explained below. In other words, the portion where the hole portion is formed in the solder ball mounting mask has a lower strength than the other portions. On the other hand, the solder ball mounting mask is too thick in diameter compared to the diameter of the solder ball to be mounted, which results in a decrease in operability and the like, and therefore must be formed into a thin flat plate to a considerable extent. Therefore, in this regard, in the case of selecting a metal material, a predetermined strength can be imparted even when the solder ball mounting mask is formed thin.
焊球搭載用遮罩的遮罩板厚未受特別限定，但較佳為具有比要搭載之焊球的直徑稍大的遮罩板厚，具體而言，較佳為具有比要搭載之焊球直徑大上5μm以上、20μm以下的遮罩板厚的板材。假如，若低於5μm，則有不能藉由材料來將足夠的機械性強度賦予焊球搭載用遮罩之虞。另一方面，若超過20μm，則有焊球的定位精度降低之虞。The thickness of the mask for the solder ball mounting mask is not particularly limited, but it is preferably thicker than the diameter of the solder ball to be mounted, and specifically, it is preferably soldered to be mounted. A plate having a mask thickness of 5 μm or more and 20 μm or less in diameter. If it is less than 5 μm, there is a possibility that a sufficient mechanical strength cannot be imparted to the solder ball mounting mask by the material. On the other hand, if it exceeds 20 μm, the positioning accuracy of the solder ball is lowered.
又，貫通穴部，較佳為利用在遮罩表面中開口的遮罩表面側開口部、及在遮罩背面中開口的遮罩背面側開口部來構成。依此方式的話，則在遮罩背面側開口部的占有區域比凸塊形成區域還大的情況下，即使要將助熔劑供給至整體凸塊形成區域，在球搭載製程中配置焊球搭載用遮罩，仍使得助熔劑不會對遮罩背面接觸、附著。故，成為難以發生由焊球搭載用遮罩所造成之焊球的帶走或位置偏離，能將焊料凸塊正確地形成在所要的位置。Further, it is preferable that the through hole portion is formed by a mask surface side opening portion that is opened in the mask surface and a mask back surface side opening portion that is opened in the mask back surface. In this case, when the occupied area of the opening on the back side of the mask is larger than the area in which the bump is formed, even if the flux is supplied to the entire bump forming region, the solder ball is placed in the ball mounting process. The mask still keeps the flux from contacting and adhering to the back of the mask. Therefore, it is difficult to cause the solder ball to be removed or displaced by the solder ball mounting mask, and the solder bump can be accurately formed at a desired position.
又，貫通穴部具有複數個遮罩表面側開口部，複數個遮罩表面側開口部較佳為在遮罩背面側開口部的內底面開口。在此情況，能以使焊球1個1個地進入各個遮罩表面側開口部內的方式設定，因此即使要將遮罩背面側開口部的占有區域作得比遮罩表面側開口部的占有區域大，仍能確實地將焊球搭載在既定的位置。故，能將焊料凸塊正確地形成在所要的位置，不良品發生率變低而良率提高。在此，作為各遮罩表面側開口部的形成方法，能因應遮罩形成材料，採用蝕刻、鑽孔加工、沖壓(punching)加工、雷射加工等之過去週知的任意手法。這些遮罩表面側開口部的內徑，係以成為比要搭載之焊球直徑還大的方式形成，例如形成為比要搭載之焊球直徑大上5μm以上、100μm以下是較佳的。假如，若低於5μm，則有透過遮罩表面側開口部使焊球確實地通過會變困難之虞。另一方面，若超過100μm，則雖能透過遮罩表面側開口部使焊球確實地通過，但有成為難以將焊球搭載在既定位置之虞。進一步地，成為難以適用於位在凸塊形成區域內的複數個墊係微細間距(fine pitch)的情況。Further, the through hole portion has a plurality of mask surface side opening portions, and the plurality of mask surface side opening portions are preferably opened at the inner bottom surface of the mask back side opening portion. In this case, since the solder balls can be set one by one into each of the mask surface side opening portions, the occupied area of the mask back side opening portion is required to be occupied by the mask surface side opening portion. The area is large, and the solder ball can still be reliably placed in a predetermined position. Therefore, the solder bump can be accurately formed at a desired position, and the defective product rate is lowered and the yield is improved. Here, as a method of forming the opening surface side of each mask surface, any conventionally known method such as etching, drilling, punching, and laser processing can be employed depending on the material for forming the mask. The inner diameter of the opening on the side of the mask surface is formed to be larger than the diameter of the solder ball to be mounted, and is preferably formed to be, for example, 5 μm or more and 100 μm or less larger than the diameter of the solder ball to be mounted. On the other hand, if it is less than 5 μm, it may become difficult to pass the solder ball through the opening on the surface of the mask. On the other hand, when the thickness exceeds 100 μm, the solder ball can pass through the mask-side opening portion, but it is difficult to mount the solder ball at a predetermined position. Further, it is difficult to apply to a plurality of pad fine pitches which are located in the bump formation region.
又，凹部，係在為按壓部的外側區域且在遮罩背面側中與基板的緣部對應的位置中開口。又，凹部，較佳為沿著緣部所形成之溝部。在依此方式進行的情況，能將在遮罩背面中凹部開口的面積縮小，因此能將形成凹部時之焊球搭載用遮罩的強度降低抑制在最小限度。Further, the concave portion is opened at a position corresponding to the edge portion of the substrate in the outer region of the pressing portion and on the back side of the mask. Further, the concave portion is preferably a groove portion formed along the edge portion. In the case of the above-described method, the area of the opening of the concave portion in the back surface of the mask can be reduced. Therefore, the strength reduction of the solder ball mounting mask when forming the concave portion can be minimized.
將遮罩背面側開口部及凹部形成在焊球搭載用遮罩的方法，可因應遮罩材料而適宜選擇。在選擇例如金屬材料的情況，遮罩背面側開口部及凹部，係利用半蝕刻同時地形成，成為彼此相等的深度，從生產性及成本性的觀點來看是合適的。又，除了半蝕刻以外，亦可採用切削加工或加壓(press)加工等方法。The method of forming the opening on the back side of the mask and the concave portion in the solder ball mounting mask can be appropriately selected in accordance with the mask material. When a metal material is selected, for example, the opening on the back side and the concave portion are simultaneously formed by half etching, and have a depth equal to each other, which is suitable from the viewpoint of productivity and cost. Further, in addition to the half etching, a method such as cutting processing or press processing may be employed.
進一步地，作為焊球搭載用遮罩的合適方法，例如，可舉出：選擇不鏽鋼板，並且在該不鏽鋼板中將成為遮罩背面側的面加以半蝕刻而同時形成遮罩背面側開口部及凹部後，對有遮罩背面側開口部的部位的既定位置施加雷射開孔加工而形成複數個遮罩表面側開口部。此製造方法的優點，由於是對遮罩背面側開口部形成後之薄壁部位進行開孔，因此開孔時的加工負擔少，能提高成本性及生產性。其他的優點，係相較於在先進行開孔加工後形成遮罩背面側開口部的情況，能以高精度形成形狀良好的複數個遮罩表面側開口部。Further, as a suitable method of the solder ball mounting mask, for example, a stainless steel plate is selected, and the surface on the back side of the mask is half-etched and the opening on the back side of the mask is simultaneously formed in the stainless steel plate. After the recessed portion, a plurality of mask surface side opening portions are formed by applying a laser drilling process to a predetermined position of the portion having the opening on the back side of the mask. The advantage of this manufacturing method is that the thin portion of the opening on the back side of the mask is opened, so that the processing load at the time of opening is small, and cost and productivity can be improved. Other advantages are that a plurality of mask surface side opening portions having a good shape can be formed with high precision, compared to the case where the opening on the back side of the mask is formed after the opening processing.
在球搭載製程中所使用的焊球尺寸未受特別限定，可因應要被形成的焊料凸塊的用途適宜設定，但是例如，較佳為使用直徑為200μm以下的微型球(micro-ball)。這是因為在使用微型球的情況，能對應所謂的C4墊的微細化，比較容易地形成小的焊料凸塊。又，這是因為在使用微小且輕量的焊球的情況，容易引起所謂雙球的發生之本案特有的問題，故採用上述手段的意義大。 The size of the solder ball used in the ball mounting process is not particularly limited, and may be appropriately set depending on the use of the solder bump to be formed. For example, a micro-ball having a diameter of 200 μm or less is preferably used. This is because, in the case of using a microball, it is possible to relatively easily form a small solder bump in accordance with the miniaturization of a so-called C4 pad. Moreover, this is because the use of a small and lightweight solder ball is likely to cause a problem unique to the present invention in which the so-called double ball is generated. Therefore, the above means is of great significance.
作為焊球所使用的焊料材料未受特別限定，但可使用例如錫鉛共晶焊料(Sn/37Pb：熔點183℃)。亦可使用錫鉛共晶焊料以外的Sn/Pb系焊料，例如Sn/36Pb/2Ag組成之焊料(熔點190℃)等。又，除了如上述的加鉛焊料以外，亦可選擇Sn-Ag系焊料、Sn-Ag-Cu系焊料、Sn-Ag-Bi系焊料、Sn-Ag-Bi-Cu系焊料、Sn-Zn系焊料、Sn-Zn-Bi系焊料等之無鉛焊料。 The solder material used as the solder ball is not particularly limited, but for example, tin-lead eutectic solder (Sn/37Pb: melting point: 183 ° C) can be used. A Sn/Pb-based solder other than tin-lead eutectic solder, for example, a solder composed of Sn/36Pb/2Ag (melting point: 190 ° C), or the like can be used. Further, in addition to the lead-added solder as described above, Sn-Ag solder, Sn-Ag-Cu solder, Sn-Ag-Bi solder, Sn-Ag-Bi-Cu solder, and Sn-Zn system may be selected. Lead-free solder such as solder or Sn-Zn-Bi solder.
然後，使用相關的焊球搭載用遮罩，並且在將此焊球搭載用遮罩配置在基板主面側的狀態下透過貫通穴部(複數個遮罩表面側開口部)使焊球供給且搭載在複數個墊上。 Then, the solder ball is supplied through the through hole portion (a plurality of mask surface side openings) while the solder ball mounting mask is placed on the main surface side of the substrate. Equipped on a plurality of mats.
在接下來的回焊製程，藉由將經搭載在各墊上的焊球加熱至既定溫度而使其熔融，來形成既定形狀的焊料凸塊。經過以上的製程，可製造具有焊料凸塊的配線基板。 In the subsequent reflow process, solder balls mounted on the pads are heated to a predetermined temperature to be melted to form solder bumps of a predetermined shape. Through the above process, a wiring substrate having solder bumps can be manufactured.
作為用於解決上述課題之其他手段(手段2)，係一種焊球搭載用遮罩，其具有遮罩表面及遮罩背面，形成有貫通前述遮罩表面及前述遮罩背面的貫通穴部，在配置於基板之基板主面側的狀態下，透過前述複數個貫通穴部使焊球供給且搭載在前述基板主面上，其特徵為在前述貫通穴部的外側區域之前述遮罩背面側，形成有接觸前述基板主面而按壓前述基板之按壓部，在前述按壓部的外側區域 之前述遮罩背面側，形成有避免與前述基板的緣部接觸的凹部；前述凹部，係利用軟質材料形成，係將在前述緣部發生之朝前述遮罩背面側彈起的部分加以保持的保持部。 Another means for the above-mentioned problem (the means 2) is a solder ball mounting mask having a mask surface and a back surface of the mask, and a through hole portion penetrating the surface of the mask and the back surface of the mask. In a state in which it is disposed on the main surface side of the substrate of the substrate, the solder ball is supplied through the plurality of through hole portions and is mounted on the main surface of the substrate, and is characterized in that the back surface side of the mask is outside the through hole portion. a pressing portion that contacts the main surface of the substrate and presses the substrate, and an outer portion of the pressing portion is formed a recessed portion that avoids contact with an edge portion of the substrate is formed on the back side of the mask, and the recessed portion is formed of a soft material and holds a portion that is raised toward the back surface side of the mask by the edge portion. Holder.
據此，若利用手段2，便可在焊球搭載用遮罩形成避免與基板的緣部接觸的凹部，因此即使要在緣部會在遮罩背面側彈起的情況下將焊球搭載用遮罩配置在基板主面側，緣部仍不會接觸遮罩背面而成為被收容在凹部內。其結果，可防止因被緣部推升所造成之焊球搭載用遮罩浮起，因此使得在焊球搭載用遮罩與基板之間難有間隙產生。據此，使得因雙球等之發生所造成之焊球位置偏離難以發生，所以成為適合焊料凸塊之形成的焊球搭載用遮罩。 According to this, the solder ball mounting mask can be used to form a concave portion that avoids contact with the edge portion of the substrate. Therefore, even if the edge portion is bounced on the back surface side of the mask, the solder ball is mounted. The mask is placed on the main surface side of the substrate, and the edge portion is not accommodated in the concave portion and does not come into contact with the back surface of the mask. As a result, it is possible to prevent the solder ball mounting mask from being lifted by the edge portion being lifted up, so that it is difficult to generate a gap between the solder ball mounting mask and the substrate. According to this, it is difficult to cause the position of the solder ball due to the occurrence of the double ball or the like to be deviated, and therefore, it becomes a solder ball mounting mask suitable for the formation of the solder bump.
以下，基於第1圖~第7圖詳細地說明將本發明具體化之一實施形態的配線基板之製造方法。 Hereinafter, a method of manufacturing a wiring board according to an embodiment of the present invention will be described in detail based on FIGS. 1 to 7 .
如第1圖所示般，本實施形態之配線基板10，係在兩面具備增建層15、16的兩面增建多層配線基板。構成配線基板10之核心基板17，係平面觀察約略矩形狀的板狀構件，在其複數個部位形成有未圖示的貫穿孔導體(through hole conductor)。這些貫穿孔導體，係電性連接核心基板17上面側的增建層15的導體、及核心基板17下面側的增建層16的導體。 As shown in Fig. 1, the wiring board 10 of the present embodiment is a multi-layer wiring board in which both sides of the build-up layers 15 and 16 are provided on both sides. The core substrate 17 constituting the wiring board 10 has a substantially rectangular plate-like member viewed in plan view, and a through hole conductor (not shown) is formed in a plurality of portions. These through-hole conductors are electrically connected to the conductor of the build-up layer 15 on the upper side of the core substrate 17, and the conductor of the build-up layer 16 on the lower side of the core substrate 17.
在增建層15的表面(第1基板主面13)上，設定平面觀察約略矩形狀的凸塊形成區域R1，在凸塊形成區域R1內，配置有複數個高度80μm~100μm左右的焊料凸塊62。這些焊料凸塊62，係用於與IC晶片71之端子的覆晶連接，所謂的C4用的墊。另一方面，亦在增建層16的表面(第2基板主面14)上設定凸塊形成區域(省略圖示)，在該凸塊形成區域內，設有複數個高度400μm~600μm左右的焊料凸塊63。這些焊料凸塊63，係用於與未圖示之母板側之端子的電性連接，所謂的BGA凸塊。On the surface of the buildup layer 15 (the first substrate main surface 13), a substantially rectangular bump formation region R1 is formed in plan view, and a plurality of solder bumps having a height of about 80 μm to 100 μm are disposed in the bump formation region R1. Block 62. These solder bumps 62 are used for flip chip connection with the terminals of the IC wafer 71, so-called pads for C4. On the other hand, a bump forming region (not shown) is provided on the surface (second substrate main surface 14) of the build-up layer 16, and a plurality of heights of about 400 μm to 600 μm are provided in the bump forming region. Solder bump 63. These solder bumps 63 are used for electrical connection to terminals on the mother board side (not shown), so-called BGA bumps.
本實施形態之增建層15、16都具有同樣的構造，所以在此僅就上面側的增建層15詳細地說明。如第7圖所示，增建層15係將層間絕緣層31、32及鍍銅導體層43、44交替積層所構成。層間絕緣層31、32的厚度皆為約30μm，例如由使環氧樹脂含浸至連續多孔質PTFE的樹脂-樹脂複合材料所構成。又，在第2層之層間絕緣層32的表面，將複數個墊21配置成陣列狀。進一步地，層間絕緣層32的表面係利用防焊阻劑33來幾乎整體地覆蓋著。在此防焊阻劑33，形成有使各墊21露出之開口部22。進一步地，在層間絕緣層31、32中之既定部位，分別設有由鍍銅所構成之填充導通導體(filled via conductor)41、42。填充導通導體41、42將墊21及導體層43、44相互地電性連接。Since the additional layers 15 and 16 of the present embodiment have the same structure, only the above-described additional layer 15 on the upper side will be described in detail. As shown in Fig. 7, the build-up layer 15 is formed by alternately stacking the interlayer insulating layers 31 and 32 and the copper-plated conductor layers 43, 44. The interlayer insulating layers 31 and 32 each have a thickness of about 30 μm, and are made of, for example, a resin-resin composite material in which an epoxy resin is impregnated into continuous porous PTFE. Further, a plurality of pads 21 are arranged in an array on the surface of the interlayer insulating layer 32 of the second layer. Further, the surface of the interlayer insulating layer 32 is almost entirely covered by the solder resist 33. In the solder resist 33, an opening 22 for exposing each pad 21 is formed. Further, filled via conductors 41 and 42 made of copper plating are respectively provided at predetermined portions of the interlayer insulating layers 31 and 32. The pad-on conductors 41 and 42 electrically connect the pad 21 and the conductor layers 43 and 44 to each other.
接下來，就具有焊料凸塊62、63之配線基板10的製造方法加以說明。Next, a method of manufacturing the wiring substrate 10 having the solder bumps 62 and 63 will be described.
首先，進行基板準備製程，係準備將複數個墊21配置在第1基板主面13上之凸塊形成區域R1內的基板11(參照第2圖)。又，在此階段，成為各墊21從防焊阻劑33之各開口部22露出的狀態。First, the substrate preparation process is performed, and a plurality of pads 21 are placed on the substrate 11 in the bump formation region R1 on the first substrate main surface 13 (see FIG. 2). Moreover, at this stage, each of the pads 21 is exposed from the respective opening portions 22 of the solder resist 33.
在接下來的助熔劑供給製程，係將基板11放置(set)在未圖示之過去週知的印刷裝置，藉由進行使用網狀遮罩(mesh mask)的印刷，將助熔劑F1薄薄地均勻塗布在第1基板主面13側上(參照第3圖)。此時，在比凸塊形成區域R1大上一圈的區域之助熔劑F1的供給區域R2整體，塗布助熔劑F1。In the next flux supply process, the substrate 11 is placed on a conventionally known printing device (not shown), and the flux F1 is thinly printed by performing printing using a mesh mask. It is uniformly applied to the first substrate main surface 13 side (see Fig. 3). At this time, the flux F1 is applied to the entire supply region R2 of the flux F1 in a region one turn larger than the bump forming region R1.
在接下來的球搭載製程，使用焊球搭載用遮罩51進行焊球61的搭載(參照第4圖)。在本實施形態，使用直徑約100μm的微型球作為焊球61。又，焊球搭載用遮罩51係由具有遮罩表面52及遮罩背面53的不鏽鋼板所構成。又，焊球搭載用遮罩51係具有比要搭載之焊球61的直徑大上10μm左右的遮罩板厚(110μm)的板材。又，遮罩表面52及遮罩背面53係成為不具有突出部分的平坦面。然後，在焊球搭載用遮罩51中與各墊21對應的位置，形成有貫通遮罩表面52及遮罩背面53的貫通穴部54。貫通穴部54，係由在遮罩表面52中開口之複數個遮罩表面側開口部55、及在遮罩背面53中開口之1個遮罩背面側開口部56所構成。各遮罩表面側開口部55，除了遮罩表面52以外也在遮罩背面側開口部56的內底面57中開口，係具有遠比凸塊形成區域R1小的占有區域R3之平面觀察圓形狀的貫通孔(參照第4圖、第5圖)。各遮罩表面側開口部55具有比要搭載之焊球61的直徑大上數十μm左右的內徑(130μm~170μm左右)。又，各遮罩表面側開口部55係設定為遮罩板厚的50%的深度(55μm)。另一方面，遮罩背面側開口部56，係形成在遮罩背面53側中與凸塊形成區域R1對應的位置，係具有比助熔劑F1的供給區域R2稍廣的占有區域R4之平面觀察矩形狀的貫通孔(參照第4圖、第5圖)。據此，遮罩背面側開口部56之占有區域R4成為比各遮罩表面側開口部55之占有區域R3還大。又，遮罩背面側開口部56係設定為遮罩板厚的50%的深度(55μm)。In the next ball mounting process, the solder ball 61 is mounted using the solder ball mounting mask 51 (see FIG. 4). In the present embodiment, a microball having a diameter of about 100 μm is used as the solder ball 61. Further, the solder ball mounting mask 51 is composed of a stainless steel plate having a mask surface 52 and a mask back surface 53. Moreover, the solder ball mounting mask 51 is a board material having a mask thickness (110 μm) larger than the diameter of the solder ball 61 to be mounted by about 10 μm. Further, the mask surface 52 and the mask back surface 53 are flat surfaces that do not have protruding portions. Then, a through hole portion 54 that penetrates the mask surface 52 and the mask back surface 53 is formed at a position corresponding to each of the pads 21 in the solder ball mounting mask 51. The through hole portion 54 is composed of a plurality of mask surface side opening portions 55 that are opened in the mask surface 52, and a mask back surface side opening portion 56 that is opened in the mask back surface 53. Each of the mask surface side opening portions 55 is opened in the inner bottom surface 57 of the mask back side opening portion 56 except for the mask surface 52, and has a plan view circular shape which is much smaller than the bump forming region R1. Through hole (see Fig. 4 and Fig. 5). Each of the mask surface side opening portions 55 has an inner diameter (about 130 μm to 170 μm) which is about several tens of μm larger than the diameter of the solder balls 61 to be mounted. Further, each of the mask surface side opening portions 55 is set to have a depth (55 μm) of 50% of the thickness of the mask. On the other hand, the mask back side opening portion 56 is formed at a position corresponding to the bump forming region R1 on the mask back surface 53 side, and has a plane observation of the occupied region R4 slightly larger than the supply region R2 of the flux F1. A rectangular through hole (see Fig. 4 and Fig. 5). As a result, the occupied region R4 of the mask back side opening portion 56 is larger than the occupied region R3 of each of the mask surface side opening portions 55. Further, the mask back side opening portion 56 is set to have a depth (55 μm) of 50% of the thickness of the mask.
如第4圖所示，在為貫通穴部54的外側區域且在遮罩背面53側中與凸塊形成區域R1(及助熔劑F1的供給區域R2)的外側區域對應的位置，形成有按壓部58。按壓部58，係設定為與遮罩板厚相同的厚度，具有接觸第1基板主面13而按壓基板11的功能。然後，在為按壓部58的外側區域且在遮罩背面53側中與基板11的緣部12對應的位置，形成有避免與緣部12接觸的溝部59(凹部)。溝部59係沿著緣部12形成，以整體構成矩形環狀(參照第4圖、第5圖)。溝部59，成為可收容在緣部12發生之朝遮罩背面53側彈起的部分(第4圖、第6圖所示之緣部12)。又，溝部59的寬度，係比緣部12的寬度稍大，在本實施形態設定為200μm左右。又，溝部59，係在不鏽鋼板中將成為遮罩背面53的面加以半蝕刻，藉以與遮罩背面側開口部56同時地形成。因此，遮罩背面側開口部56及溝部59係成為彼此相等的深度。As shown in Fig. 4, a pressing portion is formed at a position corresponding to the outer region of the bump forming region R1 (and the supply region R2 of the flux F1) on the outer side region of the through hole portion 54 and on the side of the mask back surface 53. Part 58. The pressing portion 58 is set to have the same thickness as the thickness of the mask, and has a function of contacting the first substrate main surface 13 and pressing the substrate 11. Then, a groove portion 59 (concave portion) that avoids contact with the edge portion 12 is formed at a position corresponding to the edge portion 12 of the substrate 11 in the outer region of the pressing portion 58 and on the side of the mask back surface 53. The groove portion 59 is formed along the edge portion 12, and has a rectangular ring shape as a whole (see FIGS. 4 and 5). The groove portion 59 is a portion that can be accommodated in the edge portion 12 and that bounces toward the mask back surface 53 side (the edge portion 12 shown in FIGS. 4 and 6). Further, the width of the groove portion 59 is slightly larger than the width of the edge portion 12, and is set to about 200 μm in the present embodiment. Further, the groove portion 59 is half-etched in the stainless steel plate to face the mask back surface 53, and is formed simultaneously with the mask back side opening portion 56. Therefore, the mask back side opening portion 56 and the groove portion 59 are formed to have the same depth.
又，本實施形態之焊球搭載用遮罩51，係以如下的順序製造：同時形成遮罩背面側開口部56及溝部59後，在遮罩背面側開口部56的內底面57實施雷射開孔加工而形成複數個遮罩表面側開口部55。若利用此製造方法，便因對遮罩背面側開口部56形成後的薄壁部位進行遮罩表面側開口部55用的開孔，所以開孔時的加工負擔少，能提高成本性及生產性。又，相較於在先實施開孔加工後形成遮罩背面側開口部56的情況，能以高精度形成形狀良好的遮罩表面側開口部55。而且，能藉由選擇非機械性加工之光學性加工，來效率佳地形成多數個微細孔。 Further, the solder ball mounting mask 51 of the present embodiment is manufactured in such a manner that the mask back surface side opening portion 56 and the groove portion 59 are simultaneously formed, and then the laser is applied to the inner bottom surface 57 of the mask back side opening portion 56. A plurality of mask surface side opening portions 55 are formed by opening. According to this manufacturing method, since the opening for the surface-side opening portion 55 is formed in the thin-walled portion formed by the opening-side opening portion 56 of the mask, the processing load at the time of opening is small, and the cost and production can be improved. Sex. In addition, the mask surface side opening portion 55 having a good shape can be formed with high precision as compared with the case where the mask back side opening portion 56 is formed after the opening processing. Further, it is possible to efficiently form a plurality of fine pores by selecting optical processing of non-mechanical processing.
然後，在球搭載製程，係在使遮罩背面側開口部56對向於助熔劑F1的供給區域R2，並且使溝部59對向於基板11的緣部12的狀態下，使焊球搭載用遮罩51的遮罩背面53密貼在位於第1基板主面13側的防焊阻劑33的表面(參照第4圖)。此時，由於在遮罩背面側開口部56的內底面57與防焊阻劑33的表面之間形成空隙，所以可避免如助熔劑F1接觸、附著在遮罩背面53之事態。又，在緣部12發生之彈起的部分會被收容在溝部59內，所以焊球搭載用遮罩51被緣部12按壓而避免如浮起之事態。接著，在焊球搭載用遮罩51的遮罩表面52側，供給多個直徑約100μm的焊球61。其結果，焊球61，落入遮罩表面側開口部55內，承載在位於遮罩表面側開口部55正下方的墊21上，藉由助熔劑F1的黏著力而暫時固定在墊21(參照第6圖)。即，藉由進行球搭載製程，複數個焊球61係透過貫通穴部54而供給、搭載在複數個墊21上。 In the ball mounting process, the solder ball is mounted in a state where the mask back side opening portion 56 is opposed to the supply region R2 of the flux F1 and the groove portion 59 is opposed to the edge portion 12 of the substrate 11. The mask back surface 53 of the mask 51 is in close contact with the surface of the solder resist 33 located on the first substrate main surface 13 side (see FIG. 4). At this time, since a gap is formed between the inner bottom surface 57 of the mask back side opening portion 56 and the surface of the solder resist 33, it is possible to avoid a situation in which the flux F1 comes into contact with and adheres to the back surface 53 of the mask. Further, since the portion of the edge portion 12 that is bounced is accommodated in the groove portion 59, the solder ball mounting mask 51 is pressed by the edge portion 12 to avoid a situation in which the floating portion is lifted. Next, a plurality of solder balls 61 having a diameter of about 100 μm are supplied to the mask surface 52 side of the solder ball mounting mask 51. As a result, the solder ball 61 falls into the mask surface side opening portion 55, and is placed on the mat 21 located directly below the mask surface side opening portion 55, and is temporarily fixed to the mat 21 by the adhesive force of the flux F1 ( Refer to Figure 6). In other words, by performing the ball mounting process, a plurality of solder balls 61 are supplied through the through hole portions 54 and are mounted on the plurality of pads 21.
在接下來的回焊製程，係將基板11放置在過去週知的 回焊爐內，將已搭載在各墊21上之各焊球61加熱至既定溫度而使其熔融。其結果，形成第7圖所示形狀之焊料凸塊62。又，雖然省略詳細的說明，但對第2基板主面14側形成焊料凸塊63亦依此進行。經過以上的製程，製造具有焊料凸塊62、63的配線基板10。 In the next reflow process, the substrate 11 is placed in the past. In the reflow furnace, each of the solder balls 61 mounted on the pads 21 is heated to a predetermined temperature to be melted. As a result, the solder bumps 62 having the shape shown in Fig. 7 are formed. Further, although the detailed description is omitted, the formation of the solder bumps 63 on the side of the second substrate main surface 14 is also performed. Through the above process, the wiring substrate 10 having the solder bumps 62, 63 is manufactured.
據此，根據本實施形態便能獲得以下的效果。 According to this embodiment, the following effects can be obtained.
(1)在本實施形態的製造方法，使用形成有避免與基板11的緣部12接觸的溝部59之焊球搭載用遮罩51，因此即使緣部12在遮罩背面53側彈起，緣部12仍不會接觸遮罩背面53而成為被收容在溝部59內。其結果，可防止因被緣部12推升所造成之焊球搭載用遮罩51浮起，因此使得在焊球搭載用遮罩51與基板11之間難有間隙產生。據此，使得因雙球(參照第10圖)等之發生所造成之焊球61位置偏離難以發生，能在所要的位置正確地形成焊料凸塊62、63。故，可壓低不良品發生率，所製造之配線基板10的良率變高。 (1) In the manufacturing method of the present embodiment, the solder ball mounting mask 51 in which the groove portion 59 that is in contact with the edge portion 12 of the substrate 11 is formed is used. Therefore, even if the edge portion 12 bounces on the mask back surface 53 side, the edge is raised. The portion 12 does not contact the mask back surface 53 and is housed in the groove portion 59. As a result, it is possible to prevent the solder ball mounting mask 51 from being lifted by the edge portion 12 from being lifted up, so that a gap is unlikely to occur between the solder ball mounting mask 51 and the substrate 11. According to this, it is difficult to cause the positional deviation of the solder ball 61 due to the occurrence of the double ball (refer to FIG. 10) or the like, and the solder bumps 62 and 63 can be accurately formed at a desired position. Therefore, the incidence of defective products can be lowered, and the yield of the manufactured wiring substrate 10 becomes high.
(2)在本實施形態，貫通穴部54係藉由遮罩表面側開口部55與遮罩背面側開口部56構成，遮罩背面側開口部56的占有區域R4成為比助熔劑F1的供給區域R2還大。因此，即使要將助熔劑F1供給在供給區域R2，在球搭載製程中配置焊球搭載用遮罩51，仍使得助熔劑F1不會對遮罩背面53接觸、附著。故，成為難以發生因焊球搭載用遮罩51所造成之焊球61的帶走或位置偏離，能將焊料凸塊62正確地形成在所要的位置。(2) In the present embodiment, the through hole portion 54 is formed by the mask surface side opening portion 55 and the mask back side opening portion 56, and the occupied region R4 of the mask back side opening portion 56 is supplied to the flux F1. The area R2 is still large. Therefore, even if the flux F1 is to be supplied to the supply region R2, the solder ball mounting mask 51 is placed in the ball mounting process, so that the flux F1 does not come into contact with the mask back surface 53 and adhere thereto. Therefore, it is difficult to cause the solder ball 61 to be removed or displaced due to the solder ball mounting mask 51, and the solder bump 62 can be accurately formed at a desired position.
又，亦可如以下般變更本實施形態。Further, the present embodiment can be changed as follows.
‧在上述實施形態之焊球搭載用遮罩51，貫通穴部54係藉由複數個遮罩表面側開口部55、及1個遮罩背面側開口部56構成。但是，亦可形成複數個藉由1個遮罩表面側開口部55及1個遮罩背面側開口部56所構成之開口部，將各個遮罩背面側開口部56的占有面積作成比各個遮罩表面側開口部55的占有面積大。又，亦可以省略遮罩背面側開口部56，使各遮罩表面側開口部55在遮罩表面52及遮罩背面53雙方中開口的方式進行。In the solder ball mounting mask 51 of the above-described embodiment, the through hole portion 54 is composed of a plurality of mask surface side opening portions 55 and one mask back side opening portion 56. However, a plurality of openings formed by one of the mask surface side opening portions 55 and one of the mask back side opening portions 56 may be formed, and the area occupied by each of the mask back side opening portions 56 may be made larger than that of the respective masks. The cover surface side opening portion 55 has a large occupied area. Moreover, the mask back side opening portion 56 may be omitted, and each mask surface side opening portion 55 may be opened in both the mask surface 52 and the mask back surface 53.
‧在上述實施形態，係以半蝕刻形成焊球搭載用遮罩51之遮罩背面側開口部56及溝部59，但亦可利用切削加工等來形成它。又在上述實施形態，係利用雷射開孔加工來形成在焊球搭載用遮罩51之複數個遮罩表面側開口部55，但亦可利用鑽孔加工等來形成它們。In the above-described embodiment, the mask back side opening portion 56 and the groove portion 59 of the solder ball mounting mask 51 are formed by half etching, but it may be formed by cutting or the like. Further, in the above-described embodiment, the plurality of mask surface side opening portions 55 of the solder ball mounting mask 51 are formed by laser drilling, but they may be formed by drilling or the like.
‧在上述實施形態，係利用金屬材料來形成焊球搭載用遮罩51，但是亦可利用例如樹脂材料來形成。在此情況，當模具成形時，亦可以同時形成遮罩表面側開口部55、遮罩背面側開口部56、及溝部59的方式進行。In the above embodiment, the solder ball mounting mask 51 is formed of a metal material, but may be formed of, for example, a resin material. In this case, when the mold is molded, the mask surface side opening portion 55, the mask back side opening portion 56, and the groove portion 59 may be simultaneously formed.
‧在上述實施形態，係使用直徑為約100μm的微型球作為要被搭載之焊球61，但亦能使用例如直徑為300μm~500μm左右之比較大的焊球。In the above embodiment, a microball having a diameter of about 100 μm is used as the solder ball 61 to be mounted. However, a relatively large solder ball having a diameter of about 300 μm to 500 μm can be used.
‧在上述實施形態，配線基板10所具備之複數個墊21，係成為用於將IC晶片71覆晶連接的墊，但亦可為用於將IC晶片71以外的電子零件或其他配線基板覆晶連接的墊。 In the above-described embodiment, the plurality of pads 21 included in the wiring board 10 are pads for flip-chip bonding the IC chips 71. However, the electronic components other than the IC chips 71 or other wiring boards may be covered. Crystal bonded pads.
．在上述實施形態之焊球搭載用遮罩51，係在遮罩背面53中與緣部12對應的位置形成溝部59。但是，亦可如第8圖所示之焊球搭載用遮罩81，在遮罩背面83中與緣部12對應的位置，利用軟質材料形成保持部89，該保持部89係將在緣部12發生之朝遮罩背面83側彈起的部分加以保持。在依此方式進行的情況，保持部89被緣部12按壓而變形，藉此產生凹部，所以可防止因被緣部12按壓所造成之焊球搭載用遮罩81的浮起。 . In the solder ball mounting mask 51 of the above-described embodiment, the groove portion 59 is formed at a position corresponding to the edge portion 12 in the mask back surface 53. However, the solder ball mounting mask 81 as shown in Fig. 8 may be formed, and the holding portion 89 may be formed of a soft material at a position corresponding to the edge portion 12 in the mask back surface 83, and the holding portion 89 will be at the edge portion. The part that bounces toward the back side 83 side of the mask is held. In the case of the above-described manner, the holding portion 89 is deformed by the edge portion 12 and deformed, whereby the concave portion is formed. Therefore, the floating of the solder ball mounting mask 81 caused by the pressing of the edge portion 12 can be prevented.
．在上述實施形態之製造方法，係使用在遮罩背面53中在與緣部12對應的位置形成溝部59之焊球搭載用遮罩51。但是，亦可使用如第9圖所示，藉由使與緣部12對應的位置彎曲，來形成避免與緣部12接觸之凹部99的焊球搭載用遮罩91。在此情況，隨著凹部99之形成，產生在遮罩表面92側突出的突條93，因此可藉由突條93來防止焊球61朝焊球搭載用遮罩91外脫落。 . In the manufacturing method of the above-described embodiment, the solder ball mounting mask 51 in which the groove portion 59 is formed at a position corresponding to the edge portion 12 in the mask back surface 53 is used. However, as shown in FIG. 9, by bending the position corresponding to the edge portion 12, the solder ball mounting mask 91 for avoiding the concave portion 99 in contact with the edge portion 12 can be formed. In this case, as the concave portion 99 is formed, the protrusion 93 protruding on the side of the mask surface 92 is generated, so that the solder ball 61 can be prevented from falling off the outer surface of the solder ball mounting mask 91 by the protrusion 93.
接著，以下列舉由前述的實施形態所掌握的技術思想。 Next, the technical ideas grasped by the above-described embodiments will be listed below.
(1)在上述手段1中，一種具有焊料凸塊的配線基板之製造方法，其特徵為：在前述基板準備製程後且前述球搭載製程後，進行將助熔劑供給至整體前述凸塊形成區域之助熔劑供給製程，前述凹部，係藉由將在前述緣部發生之朝前述遮罩背面側彈起的部分加以收容，來避免與前述緣部的接觸。 (1) The method of manufacturing a wiring board having solder bumps according to the above aspect 1, characterized in that after the substrate preparation process and the ball mounting process, a flux is supplied to the entire bump forming region. In the flux supply process, the recessed portion is prevented from coming into contact with the edge portion by accommodating a portion which is generated at the edge portion and which is bounced toward the back surface side of the mask.
(2)在上述手段1中，一種具有焊料凸塊的配線基板之製造方法，其特徵為：前述凹部，係利用軟質材料形成，係將在前述緣部發生之朝前述遮罩背面側彈起的部分加以保持的保持部。(2) In the above method 1, a method of manufacturing a wiring board having solder bumps, wherein the recessed portion is formed of a soft material and bounces toward the back side of the mask at the edge portion. The part that is kept is kept.
10．．．配線基板10. . . Wiring substrate
11．．．基板11. . . Substrate
12．．．基板的緣部12. . . Edge of the substrate
13．．．作為基板主面的第1基板主面13. . . First main surface of the substrate as the main surface of the substrate
21．．．墊twenty one. . . pad
51、81、91．．．焊球搭載用遮罩51, 81, 91. . . Solder ball mounting mask
52、92．．．遮罩表面52, 92. . . Mask surface
53、83．．．遮罩背面53,83. . . Mask back
54．．．貫通穴部54. . . Through hole
55．．．遮罩表面側開口部55. . . Mask side opening
56．．．遮罩背面側開口部56. . . Mask back side opening
57．．．遮罩背面側開口部的內底面57. . . Inner bottom surface of the opening on the back side of the mask
58．．．按壓部58. . . Pressing part
59．．．作為凹部的溝部59. . . Groove as a recess
61．．．焊球61. . . Solder ball
62．．．焊料凸塊62. . . Solder bump
99．．．凹部99. . . Concave
R1．．．凸塊形成區域R1. . . Bump forming area
R3．．．遮罩表面側開口部的占有區域R3. . . Occupied area of the opening on the side of the mask surface
R4．．．遮罩背面側開口部的占有區域R4. . . Occupied area of the opening on the back side of the mask
第1圖係本實施形態之具有焊料凸塊的配線基板的概略圖。Fig. 1 is a schematic view showing a wiring board having solder bumps according to the embodiment.
第2圖係用於說明配線基板之製造方法的主要部分剖面圖。Fig. 2 is a cross-sectional view showing the main part of a method of manufacturing a wiring board.
第3圖係用於說明配線基板之製造方法的主要部分剖面圖。Fig. 3 is a cross-sectional view showing the main part of a method of manufacturing a wiring board.
第4圖係用於說明配線基板之製造方法的主要部分放大剖面圖。Fig. 4 is an enlarged cross-sectional view showing the main part for explaining a method of manufacturing a wiring board.
第5圖係用於說明配線基板之製造方法的主要部分平面圖。Fig. 5 is a plan view showing a main part for explaining a method of manufacturing a wiring board.
第6圖係用於說明配線基板之製造方法的主要部分放大剖面圖。Fig. 6 is an enlarged cross-sectional view showing the main part for explaining a method of manufacturing a wiring board.
第7圖係用於說明配線基板之製造方法的主要部分剖面圖。Fig. 7 is a cross-sectional view showing the main part of a method of manufacturing a wiring board.
第8圖係用於說明在其他實施形態之配線基板之製造方法的主要部分放大剖面圖。Fig. 8 is an enlarged cross-sectional view showing the main part of a method of manufacturing a wiring board according to another embodiment.
第9圖係用於說明在其他實施形態之配線基板之製造方法的主要部分放大剖面圖。Fig. 9 is an enlarged cross-sectional view showing the main part of a method of manufacturing a wiring board according to another embodiment.
第10圖係顯示過去技術之問題點的主要部分放大剖面圖。Fig. 10 is an enlarged cross-sectional view showing the main part of the problem of the prior art.
11．．．基板11. . . Substrate
12．．．基板的緣部12. . . Edge of the substrate
13．．．作為基板主面的第1基板主面13. . . First main surface of the substrate as the main surface of the substrate
14．．．作為基板主面的第2基板主面14. . . The second substrate main surface as the main surface of the substrate
21．．．墊twenty one. . . pad
51．．．焊球搭載用遮罩51. . . Solder ball mounting mask
52．．．遮罩表面52. . . Mask surface
53．．．遮罩背面53. . . Mask back
54．．．貫通穴部54. . . Through hole
55．．．遮罩表面側開口部55. . . Mask side opening
56．．．遮罩背面側開口部56. . . Mask back side opening
57．．．遮罩背面側開口部的內底面57. . . Inner bottom surface of the opening on the back side of the mask
58．．．按壓部58. . . Pressing part
59．．．作為凹部的溝部59. . . Groove as a recess
61．．．焊球61. . . Solder ball
R1．．．凸塊形成區域R1. . . Bump forming area
R3．．．遮罩表面側開口部的占有區域R3. . . Occupied area of the opening on the side of the mask surface
R4．．．遮罩背面側開口部的占有區域R4. . . Occupied area of the opening on the back side of the mask
Claims (8)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010056935A JP5479959B2 (en) | 2010-03-15 | 2010-03-15 | Manufacturing method of wiring board having solder bump, mask for mounting solder ball |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201212136A TW201212136A (en) | 2012-03-16 |
| TWI524442B true TWI524442B (en) | 2016-03-01 |
Family
ID=44797397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100108462A TWI524442B (en) | 2010-03-15 | 2011-03-14 | Method for manufacturing wiring board having solder bumps, mask for solder ball mounting |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5479959B2 (en) |
| KR (1) | KR20110103876A (en) |
| TW (1) | TWI524442B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102270748B1 (en) | 2013-11-07 | 2021-06-30 | 삼성전자주식회사 | Device and method of attaching solder ball, and method of fabricating a semiconductor package including the same |
| CN117693808A (en) * | 2021-07-26 | 2024-03-12 | 奔马有限公司 | Ball alignment mask and method for manufacturing ball alignment mask |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4822128B2 (en) * | 2007-01-30 | 2011-11-24 | 澁谷工業株式会社 | Ball array mask support device |
| JP5270192B2 (en) * | 2007-04-16 | 2013-08-21 | アスリートＦａ株式会社 | Mask and substrate manufacturing method using the mask |
-
2010
- 2010-03-15 JP JP2010056935A patent/JP5479959B2/en not_active Expired - Fee Related
-
2011
- 2011-03-14 KR KR1020110022374A patent/KR20110103876A/en not_active Application Discontinuation
- 2011-03-14 TW TW100108462A patent/TWI524442B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP5479959B2 (en) | 2014-04-23 |
| JP2011192767A (en) | 2011-09-29 |
| KR20110103876A (en) | 2011-09-21 |
| TW201212136A (en) | 2012-03-16 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |