JP4849926B2 - 半導体装置及び半導体装置の製造方法 - Google Patents
半導体装置及び半導体装置の製造方法 Download PDFInfo
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- JP4849926B2 JP4849926B2 JP2006086533A JP2006086533A JP4849926B2 JP 4849926 B2 JP4849926 B2 JP 4849926B2 JP 2006086533 A JP2006086533 A JP 2006086533A JP 2006086533 A JP2006086533 A JP 2006086533A JP 4849926 B2 JP4849926 B2 JP 4849926B2
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
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- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
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- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/467—Adding a circuit layer by thin film methods
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
ビルドアップ基板のような積層基板の製造にも、加熱により回路形成基板を樹脂材で接着する工程が含まれることが多い。そこで、このような加熱工程を一括して行うことで、別個の加熱工程を一回の加熱工程のみで行ってしまう。これにより、半導体装置の製造に係わる工程数を低減し、半導体装置のコストを低減する。
該積層基板は第1の樹脂材により接合された複数の回路形成層を含み、
該半導体素子は第2の樹脂材により前記積層基板に接合され、
該第1の樹脂材と該第2の樹脂材とは、同じ加熱条件で硬化する樹脂よりなることを特徴とする半導体装置。
前記第1の樹脂材と前記第2の樹脂材とは、同一の樹脂よりなることを特徴とする半導体装置。
第3の樹脂材により半導体素子に接着された放熱部材を更に有し、
該第3の樹脂材は、前記第1の樹脂材及び前記第2の樹脂材と同じ加熱条件で硬化する樹脂よりなることを特徴とする半導体装置。
前記第3の樹脂材は、前記第1の樹脂材及び前記第2の樹脂材と同一の樹脂よりなることを特徴とする半導体装置。
前記第1の樹脂材及び前記第2の樹脂材の各々は、絶縁性樹脂中に導電性樹脂が埋め込まれた構成であり、該導電性樹脂により半導体装置の電極及び前記積層基板内の電極が接合されたことを特徴とする半導体装置。
第3の樹脂材により半導体素子に接着された放熱部材を更に有し、
該第3の樹脂材は、前記第1の樹脂材及び前記第2の樹脂材の前記導電性樹脂と同一の樹脂よりなることを特徴とする半導体装置。
前記導電性樹脂は、基材樹脂中に分散した導電性粒子及び拡散したはんだを含むことを特徴とする半導体装置。
複数の回路形成層の間にシート状の第1の樹脂材を配置して該積層基板を構成し、且つ該積層基板の上にシート状の第2の樹脂材を介して半導体素子を配置して積層体を形成し、
該積層体を加圧しながら加熱して該第1及び第2の樹脂材を硬化させ、前記回路形成層同士及び前記半導体素子を同時に接合する
ことを特徴とする半導体装置の製造方法。
前記積層体の前記半導体素子の上に第3の樹脂材を介して放熱部材を配置し、
前記積層体を加熱する際に該第3の樹脂材も同時に硬化させて前記放熱部材を前記半導体素子に接着する
ことを特徴とする半導体装置の製造方法。
シート状の絶縁性樹脂に、前記回路形成層の電極に対応した位置に孔を形成し、該孔に導電性樹脂を充填して前記第1の樹脂材を形成し、
シート状の絶縁性樹脂に、前記半導体素子の電極に対応した位置に孔を形成し、該孔に導電性樹脂を充填して前記第2の樹脂材を形成する
ことを特徴とする半導体装置の製造方法。
前記導電性樹脂は、基材樹脂と該基材樹脂中に分散して含まれた導電性粒子よりなり、該導電性粒子の表面に金属被膜が形成されていることを特徴とする半導体装置の製造方法。
前記導電性粒子は金属粒子であり、前記金属被膜ははんだ被膜でることを特徴とする半導体装置の製造方法。
10a 孔
12 導電性ペースト
20 ビルドアップ基板
22 コア基板
22a 電極
24 ビルドアップ層
24a 電極
26 接着材シート
28 半導体チップ
30 接着材シート
32 ヒートスプレッダ
34 接着材ペースト
40 マルチチップモジュール
42 チップ部品
Claims (5)
- 積層基板上に搭載された半導体素子を有する半導体装置であって、
該積層基板は第1の樹脂材により接合された複数の回路形成層を含み、
前記半導体素子は第2の樹脂材により前記積層基板に接合され、
該第1の樹脂材と該第2の樹脂材とは、同じ加熱条件で硬化した樹脂よりなり、
前記第1の樹脂材は、前記回路形成層の電極に対応する位置に形成された第1の孔に導電性ペーストが充填された第1の絶縁性接着材シートであり、且つ、前記第2の樹脂材は、前記半導体素子の電極に対応する位置に形成された第2の孔に導電性ペーストが充填された第2の絶縁性接着材シートであり、
前記導電性ペーストは、基材樹脂中に分散した導電性粒子及び拡散したはんだを含む
ことを特徴とする半導体装置。 - 請求項1記載の半導体装置であって、
前記第1の絶縁性接着材シートと前記第2の絶縁性接着剤シートとは、同一の樹脂よりなることを特徴とする半導体装置。 - 請求項1記載の半導体装置であって、
第3の樹脂材により半導体素子に接着された放熱部材を更に有し、
該第3の樹脂材は、前記第1の樹脂材及び前記第2の樹脂材と同じ加熱条件で硬化する樹脂よりなることを特徴とする半導体装置。 - 積層基板上に搭載された半導体素子を有する半導体装置の製造方法であって、
複数の回路形成層の間にシート状の第1の樹脂材を配置して該積層基板を構成し、且つ該積層基板の上にシート状の第2の樹脂材を介して半導体素子を配置して積層体を構成し、前記第1の樹脂材は前記回路形成層の電極に対応する位置に形成された第1の孔に導電性ペーストが充填された第1の絶縁性接着材シートであり、且つ、前記第2の樹脂材は、前記半導体素子の電極に対応する位置に形成された第2の孔に導電性ペーストが充填された第2の絶縁性接着材シートであり、前記導電性ペーストは、基材樹脂中に分散し、金属粒子或いはフィラーにはんだがコーティングされた導電性粒子を含み、
該積層体を加圧しながら加熱して、前記はんだを前記基材樹脂中に拡散させながら前記第1及び第2の樹脂材を硬化させ、前記回路形成層同士及び前記半導体素子を同時に接合する
ことを特徴とする半導体装置の製造方法。 - 請求項4記載の半導体装置の製造方法であって、
前記積層体の前記半導体素子の上に第3の樹脂材を介して放熱部材を配置し、
前記積層体を加熱する際に該第3の樹脂材も同時に硬化させて前記放熱部材を前記半導体素子に接着する
ことを特徴とする半導体装置の製造方法。
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JP2006086533A JP4849926B2 (ja) | 2006-03-27 | 2006-03-27 | 半導体装置及び半導体装置の製造方法 |
US11/526,100 US20070222039A1 (en) | 2006-03-27 | 2006-09-25 | Semiconductor device and manufacturing method of a semiconductor device |
US12/712,604 US8168471B2 (en) | 2006-03-27 | 2010-02-25 | Semiconductor device and manufacturing method of a semiconductor device |
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JP2006086533A JP4849926B2 (ja) | 2006-03-27 | 2006-03-27 | 半導体装置及び半導体装置の製造方法 |
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JP (1) | JP4849926B2 (ja) |
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US8253250B2 (en) * | 2007-03-30 | 2012-08-28 | Nec Corporation | Interconnection structure of electronic device having multilayer interconnections structure with electrically conductive layers |
US10037941B2 (en) * | 2014-12-12 | 2018-07-31 | Qualcomm Incorporated | Integrated device package comprising photo sensitive fill between a substrate and a die |
JP2016134481A (ja) * | 2015-01-19 | 2016-07-25 | 富士通株式会社 | 積層チップ及び積層チップの製造方法 |
DE102016222631A1 (de) * | 2016-11-17 | 2018-05-17 | Zf Friedrichshafen Ag | Leiterplattenanordnung mit einem elektrischen Bauteil und einem Kühlkörper |
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JPH08316641A (ja) | 1995-05-12 | 1996-11-29 | Hitachi Ltd | 一括接続法による多層配線基板 |
JP3207174B2 (ja) | 1999-02-01 | 2001-09-10 | 京セラ株式会社 | 電気素子搭載配線基板およびその製造方法 |
JP4004196B2 (ja) * | 1999-11-16 | 2007-11-07 | イビデン株式会社 | 半導体チップ |
JP4683770B2 (ja) * | 2001-05-31 | 2011-05-18 | 京セラ株式会社 | 電気素子内蔵配線基板およびその製法 |
JP3861669B2 (ja) * | 2001-11-22 | 2006-12-20 | ソニー株式会社 | マルチチップ回路モジュールの製造方法 |
TW200302685A (en) * | 2002-01-23 | 2003-08-01 | Matsushita Electric Ind Co Ltd | Circuit component built-in module and method of manufacturing the same |
JP2003243797A (ja) * | 2002-02-19 | 2003-08-29 | Matsushita Electric Ind Co Ltd | モジュール部品 |
JP3764137B2 (ja) * | 2002-11-07 | 2006-04-05 | 富士通株式会社 | ヒートシンクの実装方法 |
JP2005340686A (ja) | 2004-05-31 | 2005-12-08 | Fujitsu Ltd | 積層基板及びその製造方法、かかる積層基板を有する電子機器 |
JP2005340687A (ja) | 2004-05-31 | 2005-12-08 | Fujitsu Ltd | 積層基板及びその製造方法、かかる積層基板を有する電子機器 |
US7849591B2 (en) * | 2005-10-14 | 2010-12-14 | Fujikura Ltd. | Method of manufacturing a printed wiring board |
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- 2006-09-25 US US11/526,100 patent/US20070222039A1/en not_active Abandoned
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US20070222039A1 (en) | 2007-09-27 |
US8168471B2 (en) | 2012-05-01 |
JP2007266129A (ja) | 2007-10-11 |
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