CN104103531A - 封装结构及其制作方法 - Google Patents

封装结构及其制作方法 Download PDF

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CN104103531A
CN104103531A CN201310120873.1A CN201310120873A CN104103531A CN 104103531 A CN104103531 A CN 104103531A CN 201310120873 A CN201310120873 A CN 201310120873A CN 104103531 A CN104103531 A CN 104103531A
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circuit board
flexible circuit
rigid
conducting wire
chip
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许诗滨
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Hongqisheng Precision Electronics Qinhuangdao Co Ltd
Zhending Technology Co Ltd
Zhen Ding Technology Co Ltd
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Hongqisheng Precision Electronics Qinhuangdao Co Ltd
Zhending Technology Co Ltd
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Priority to CN201310120873.1A priority Critical patent/CN104103531A/zh
Priority to US14/084,627 priority patent/US9099450B2/en
Publication of CN104103531A publication Critical patent/CN104103531A/zh
Pending legal-status Critical Current

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Abstract

一种封装结构，其包括软硬结合电路板及芯片，所述软硬结合电路板包括软性电路板、硬性的胶片及外层导电线路，所述软性电路板包括相互连接并一体成型的两个弯折区域和一个固定区域，所述软性电路板包括绝缘层及形成于绝缘层相对两表面的导电线路层，所述软性电路板的固定区域及形成于软性电路板的固定区域至少一侧的硬性的胶片及外层导电线路构成软硬结合电路板的硬性区域，所述软性电路板的弯折区域形成软硬结合电路板的软性区域，所述芯片封装于软硬结合电路板的硬性区域，所述软硬结合电路板的硬性部分具有多个电性接触垫，所述芯片具有多个电极垫，每个所述电性接触垫与对应的一个电极垫相互导通。

Description

封装结构及其制作方法
技术领域
本发明涉及芯片封装领域，尤其涉及一种封装结构及其制作方法。
背景技术
芯片封装的一种方法是采用打线(wire bonding)封装或覆晶(Flip Chip)封装等接合方式将芯片与硬质的基板(substrate)结合，形成一个组件后，再将整个的组件组装到电路板而应用到各式之电子产品，从芯片到在电路板组装需经过复杂的程序，其间易产生因质量问题和良率损失而造成成本高，质量不易控制。
芯片封装的另一种方法是将芯片封装到软性电路板板上，但因软性电路板之材料特性限制，使得在软性电路板板上封装芯片加工难度高，且在高脚数封装常有可靠度失效问题，一般只能应用于较低脚数之芯片的封装，从而使得多脚数芯片的封装受到限制。
发明内容
因此，有必要提供一种封装结构及其制作方法，以解决现有芯片封装存在的上述问题。
以下将以实施例说明一种封装结构及其制作方法。
一种封装结构的制作方法，包括步骤:提供一软性电路板，所述软性电路板包括相互连接并一体成型的两个弯折区域和一个固定区域，所述固定区域连接于两个所述弯折区域之间，所述软性电路板包括绝缘层及形成于绝缘层相对两表面的导电线路层；提供胶片及铜箔，胶片和铜箔的形状与软性电路板的固定区域相对应；依次堆叠并压合铜箔、胶及软性电路板，胶片与软性电路板的固定区域相对应；将铜箔制作形成外层导电线路，所述外层线路通过导电孔与内软性电路板的导电线路相互电导通，得到软硬结合电路板，所述外层导电线路包括多个电性接触垫，所述软性电路板的固定区域与形成于软性电路板固定区域的胶片及外层导电线路形成软硬结各电路板的硬性区域，所述软性电路板的弯折区域形成软硬结合电路板的软性区域；以及将芯片封装于所述软硬结合电路板的硬性区域，所述芯片具有多个电极垫，每个所述电极垫与对应的一个电性接触垫相互导通。
一种封装结构，其包括软硬结合电路板及芯片，所述软硬结合电路板包括软性电路板、硬性的胶片及外层导电线路，所述软性电路板包括相互连接并一体成型的两个弯折区域和一个固定区域，所述固定区域连接于两个所述弯折区域之间，所述软性电路板包括绝缘层及形成于绝缘层相对两表面的导电线路层，所述软性电路板的固定区域及形成于软性电路板的固定区域至少一侧的硬性的胶片及外层导电线路构成软硬结合电路板的硬性区域，所述软性电路板的弯折区域形成软硬结合电路板的软性区域，所述芯片封装于软硬结合电路板的硬性区域，所述软硬结合电路板的硬性部分具有多个电性接触垫，所述芯片具有多个电极垫，每个所述电性接触垫与对应的一个电极垫相互导通。
与现有技术相比，本技术方案提供的封装结构及其制作方法，直接将芯片封装于性能良好的软硬结合电路板的硬性部分，从而可以解决现有技术中将芯片封装于封装基板形成组件后再封装于电路板工艺复杂的问题及工艺复杂而产生的产品良率较低的问题，也可以解决由于芯片封装于软性电路板仅能用于较少脚数的芯片的封装的问题。并且，形成的封装结构由于软硬结合电路板具有软性部分，可以轻易的因应不同产品之需要可以很有弹性的做各式的组装，包括挠折、弯曲、绕开避位等，又可以减少尺寸和节省占据空间。
附图说明
图1是本技术方案实施例提供的软性电路板的剖面示意图。
图2是本技术方案实施例提供的第一胶层、第二胶层、第一铜箔和第二铜箔的剖面示意图。
图3是本技术方案实施例提供的依次压合第一铜箔、第一胶层、软性电路板、第二胶层及第二铜箔后，并将第一铜箔和第二铜箔制作形成外层导电线路后的剖面示意图。
图4是本技术方案提供的封装结构的剖面示意图。
图5是本技术方案提供的另一封装结构的剖面示意图。
主要元件符号说明
封装结构 10、20
软性电路板 110
第一绝缘层 111
第一表面 1111
第二表面 1112
第一导电线路 112
第二导电线路 113
弯折区域 114
固定区域 115
防焊层 116
第一胶片 120
第一铜箔 130
第二胶片 140
第二铜箔 150
第一外层导电线路 131
第一电性接触垫 1311
第一防焊层 161
第一开口 1611
导电孔 101
第二外层导电线路 151
第二电性接触垫 1511
第二防焊层 162
第二开口 1621
芯片 200
芯片本体 210
电极垫 220
封装胶体 230
键合线 240
焊球 250
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
下面结合附图及实施例对本技术方案提供的封装结构及其制作方法作进一步说明。
本技术方案提供的封装结构的制作方法包括如下步骤：
第一步，请一并参阅图1至5，制作一个软硬结合电路板100。
所述软硬结合电路板100的制作具体包括如下步骤：
首先，请参阅图1，提供一个软性电路板110。
软性电路板110为制作有导电线路的电路板。软性电路板110可以为单面电路板也可以为双面电路板。本实施例中，以软性电路板110为双面电路板为例进行说明。软性电路板110包括第一绝缘层111、第一导电线路112及第二导电线路113。第一绝缘层111包括相对的第一表面1111和第二表面1112，第一导电线路112形成于第一绝缘层111的第一表面1111，第二导电线路113形成于第一绝缘层111的第二表面1112。软性电路板110包括固定区域115及连接于固定区域115相对两侧的弯折区域114。弯折区域114用于形成软硬结合电路板板的弯折区相对应。固定区域115用于与硬性电路板相互固定连接。
本实施例中，所述弯折区域114的相对两侧形成有防焊层116，用于保护弯折区域114两侧的第一导电线路112和第二导电线路113。可以理解的是，所述弯折区域114的相对两侧也可以不形成有防焊层。
其次，请一并参阅图2及图3，提供第一胶片120、第一铜箔130、第二胶片140及第二铜箔150，第一胶片120和第二胶片140的形状与软性电路板110的固定区域115相对应。
本实施例中，第一胶片120和第二胶片140均为为半固化胶片（prepreg，PP）。
再次，请参阅图3，依次堆叠并压合第一铜箔130、第一胶片120、软性电路板110、第二胶片140及第二铜箔150，第一胶片120和第二胶片140均与软性电路板110的固定区域115相对应。
所述第一胶片120和第二胶片140压合后固化发生硬化，从而使得软性电路板110的固定区域115对应部分成为软硬结合电路板的硬性部分成为软硬结合电路板的硬性区域。
最后，将第一铜箔130制作形成第一外层导电线路131，将第二铜箔150制作形成第二外层导电线路151，并在第一外层导电线路131一侧形成第一防焊层161，在第二外层导电线路151的一侧形成第二防焊层162。
将第一铜箔130和第二铜箔150制作形成导电线路可以采用影像转移工艺及蚀刻工艺。在此过程中，第一铜箔130和第二铜箔150与弯折区域114相对应部分的材料也被蚀刻去除。
在形成第一外层导电线路131和第二外层导电线路151之前，还可以包括制作电导通第一外层导电线路131和第一导电线路112的导电孔101，以及制作电导通第二外层导电线路151及第二导电线路113的导电孔101的步骤。
所述第一外层导电线路131包括多个第一电性接触垫1311，所述第一防焊层161具有多个第一开口1611，每个第一电性接触垫1311从对应的第一开口1611露出。所述第二外层导电线路151包括多个第二电性接触垫1511，所述第二防焊层162具有多个第二开口1621，每个第二电性接触垫1511从对应的第二开口1621露出。
可以理解的是，在压合第一铜箔130、第一胶片120、软性电路板110、第二胶片140及第二铜箔150之前，可以弯折区域114的相对的两侧贴合可剥型胶片。可剥型胶片的形状均与弯折区域的形状相对应，即可剥型胶片刚好能覆盖弯折区域。从而在进行蚀刻过程中，弯折区域114内的导电线路不能与蚀刻药水相接触，从而避免了导电线路被腐蚀。在形成第一外层导电线路131和第二外层导电线路151之后，可以将可剥型胶片从弯折区域114去除。
另外，如果在压合第一铜箔130、第一胶片120、软性电路板110、第二胶片140及第二铜箔150之前，可以弯折区域114的相对的两侧贴合可剥型胶片。第一胶片120和第二胶片140的形状也可以与软性电路板的形状相同，并在制作完成第一外层导电线路131和第二外层导电线路151之后，通过开盖的方式，将弯折区域114对应的第一胶片120、第二胶片140及可剥型胶片一并去除。
可以理解的是，软硬结合电路板100还可以继续进行增层制作，以得到更多层数的软硬结合电路板100。并且，也可以仅在软性电路板110的一侧进行增层制作。
可以理解的是，所述软硬结合电路板100的制作方法不限于本实施例提供的方式。现有技术中用于制作软硬结合电路板的方式都可以用于软硬结合电路板100的制作。
第二步，请参阅图4及图5，在软硬结合电路板100的硬性区域封装芯片200，从而得到封装结构10。
所述芯片200包括芯片本体210、形成于芯片本体210表面的电极垫220。所述芯片200可以采用打线的方式封装于软硬结合电路板100。具体地：先采用封装胶体230将芯片200固定于软硬结合电路板100的第一防焊层161的表面。然后，采用打线的方式在每个第一电性接触垫1311和对应的一个电极垫220之间形成键合线240。最后，还可以通过封装胶体将芯片200及键合线240包覆起来，以对芯片200及键合线240进行保护。
可以理解的是，所述芯片200也可以采用覆晶封装的方式封装于软硬结合电路板100，从而得到封装结构20。多个第一电性接触垫1311的分布较为密集，并且每个电极垫与一个第一电性接触垫1311相对应。从而每个第一电性接触垫1311与对应的电极垫之间可以采用焊球250进行电导通。并且，在芯片200与软硬结合电路板100之间填充封装胶体230，以使得芯片200与软硬结合电路板100紧密结合。
可以理解的是，本技术方案提供的封装结构，还可以在芯片表面形成散热片等结构，以对芯片进行散热。
请参阅图4，本技术方案还提供一种封装结构10，所述封装结构10包括软硬结合电路板100及封装于软硬结合电路板100的芯片200。
所述软硬结合电路板100的硬性区域具有第一外层导电线路131，所述第一外层导电线路131包括多个第一电性接触垫1311。所述芯片200具有多个电极垫220，每个电极垫220与对应的第一电性接触垫1311通过键合线240相互导通。
请参阅图5，本技术方案还提供一种封装结构20，所述封装结构20也包括软硬电路板100及封装于软硬结合电路板100的芯片200。所述软硬结合电路板100的硬性区域具有第一外层导电线路131，所述第一外层导电线路131包括多个第一电性接触垫1311。所述芯片200具有多个电极垫，每个电极垫与对应的第一电性接触垫1311通过焊球250相互导通。
本技术方案提供的封装结构及其制作方法，直接将芯片封装于性能良好的软硬结合电路板的硬性部分，从而可以解决现有技术中将芯片封装于封装基板形成组件后在封装于电路板工艺复杂的问题及工艺复杂而产生的产品良率较低的问题，也可以解决由于芯片封装于软性电路板仅能用于较少脚数的芯片的封装的问题。并且，形成的封装结构由于软硬结合电路板具有软性部分，可以轻易的因应不同产品之需要可以很有弹性的做各式的组装，包括挠折、弯曲、绕开避位等，又可以减少尺寸和节省占据空间。
可以理解的是，对于本领域的普通技术人员来说，可以根据本发明的技术构思做出其它各种相应的改变与变形，而所有这些改变与变形都应属于本发明权利要求的保护范围。

Claims (10)

1.一种封装结构的制作方法，包括步骤:
提供一软性电路板，所述软性电路板包括相互连接并一体成型的两个弯折区域和一个固定区域，所述固定区域连接于两个所述弯折区域之间，所述软性电路板包括绝缘层及形成于绝缘层相对两表面的导电线路层；
提供胶片及铜箔，胶片和铜箔的形状与软性电路板的固定区域相对应；
依次堆叠并压合铜箔、胶及软性电路板，胶片与软性电路板的固定区域相对应；
将铜箔制作形成外层导电线路，所述外层线路通过导电孔与内软性电路板的导电线路相互电导通，得到软硬结合电路板，所述外层导电线路包括多个电性接触垫，所述软性电路板的固定区域与形成于软性电路板固定区域的胶片及外层导电线路形成软硬结各电路板的硬性区域，所述软性电路板的弯折区域形成软硬结合电路板的软性区域；以及
将芯片封装于所述软硬结合电路板的硬性区域，所述芯片具有多个电极垫，每个所述电极垫与对应的一个电性接触垫相互导通。
2.如权利要求1所述的封装结构的制作方法，其特征在于，通过打线方式将芯片封装于软硬结合电路板，每个所述电极垫与对应的一个电性接触垫通过键合线相互导通。
3.如权利要求1所述的封装结构的制作方法，其特征在于，通过覆晶封装方式将芯片封装于软硬结合电路板，每个所述电极垫与对应的一个电性接触垫通过焊球相互导通。
4.如权利要求1所述的封装结构的制作方法，其特征在于，将所述芯片封装于所述软硬结合电路板的硬性区域之前，还包括在所述软硬结合电路板的硬性区域表面防焊层，所述防焊层具有多个开口，每个电性接触垫从对应的开口露出。
5.一种封装结构，其包括软硬结合电路板及芯片，所述软硬结合电路板包括软性电路板、硬性的胶片及外层导电线路，所述软性电路板包括相互连接并一体成型的两个弯折区域和一个固定区域，所述固定区域连接于两个所述弯折区域之间，所述软性电路板包括绝缘层及形成于绝缘层相对两表面的导电线路层，所述软性电路板的固定区域及形成于软性电路板的固定区域至少一侧的硬性的胶片及外层导电线路构成软硬结合电路板的硬性区域，所述软性电路板的弯折区域形成软硬结合电路板的软性区域，所述芯片封装于软硬结合电路板的硬性区域，所述软硬结合电路板的硬性部分具有多个电性接触垫，所述芯片具有多个电极垫，每个所述电性接触垫与对应的一个电极垫相互导通。
6.如权利要求5所述的封装结构，其特征在于，每个所述电性接触垫与对应的一个电极垫之间通过键合线相互导通。
7.如权利要求6所述的封装结构，其特征在于，还包括封装胶体，所述封装胶体包覆所述键合线及芯片。
8.如权利要求5所述的封装结构，其特征在于，每个所述电性接触垫与对应的一个电极垫之间通过焊球相互导通。
9.如权利要求8所述的封装结构，其特征在于，还包括封装胶体，所述封装胶体填充在芯片与软硬结合电路板之间。
10.如权利要求5所述的封装结构，其特征在于，所述软硬结合电路板还包括防焊层，所述防焊层形成于软硬结合电路板硬性部分的表面，所述防焊层具有多个开口，每个电性接触垫从对应的开口露出。
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