JP2015529402A - 回路基板素子の製造方法及び回路基板素子 - Google Patents
回路基板素子の製造方法及び回路基板素子 Download PDFInfo
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- JP2015529402A JP2015529402A JP2015532359A JP2015532359A JP2015529402A JP 2015529402 A JP2015529402 A JP 2015529402A JP 2015532359 A JP2015532359 A JP 2015532359A JP 2015532359 A JP2015532359 A JP 2015532359A JP 2015529402 A JP2015529402 A JP 2015529402A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 33
- 239000011247 coating layer Substances 0.000 claims abstract description 16
- 238000007788 roughening Methods 0.000 claims abstract description 14
- 150000001875 compounds Chemical class 0.000 claims abstract description 10
- 239000011810 insulating material Substances 0.000 claims abstract description 10
- 238000005488 sandblasting Methods 0.000 claims abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 44
- 239000010410 layer Substances 0.000 claims description 37
- 239000011888 foil Substances 0.000 claims description 27
- 239000004020 conductor Substances 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 5
- 238000003486 chemical etching Methods 0.000 claims description 3
- 239000008262 pumice Substances 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000007654 immersion Methods 0.000 claims description 2
- 230000032798 delamination Effects 0.000 abstract description 12
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 4
- 238000005530 etching Methods 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract 1
- 238000010297 mechanical methods and process Methods 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 description 31
- 239000000047 product Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- 239000004332 silver Substances 0.000 description 8
- 238000002788 crimping Methods 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000013067 intermediate product Substances 0.000 description 5
- 239000004745 nonwoven fabric Substances 0.000 description 5
- 238000004026 adhesive bonding Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000004005 microsphere Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000012800 visualization Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1028—Thin metal strips as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/30—Foil or other thin sheet-metal making or treating
- Y10T29/301—Method
- Y10T29/302—Clad or other composite foil or thin metal making
Abstract
Description
Claims (10)
- a)導電材料からなる構成要素(2,3)を準備すること、
b)前記構成要素(2,3)を、少なくとも1つの接点で導電箔(4)と接触させること、
c)前記箔(4)の、前記構成要素(2,3)と接触する面(4a,4b)に被覆層(5)を付けること、
を含む回路基板素子(1)の製造方法であって、
前記構成要素(2,3)の表面(2o,3o)がステップc)の前に少なくとも部分的に粗化されるとともに、ステップc)の前記被覆層(5)を前記構成要素(2,3)の前記粗化された表面(2o,3o)と接触させる、ことを特徴とする製造方法。 - 前記構成要素(2,3)の前記表面(2o,3o)の前記粗化が、ステップb)による、前記構成要素(2,3)の前記箔(4)との前記接触の前に行われることを特徴とする、請求項1に記載の方法。
- 前記構成要素(2,3)の前記表面(2o,3o)は化学エッチングにより粗化され、前記化学エッチングは好ましくは前記構成要素(2,3)の材料を腐食する流体への前記構成要素(2,3)の浸漬又はそのような流体の前記構成要素(2,3)への散布によって行われることを特徴とする、請求項1又は2に記載の方法。
- 前記構成要素(2,3)の前記表面(2o,3o)は、例えばサンドブラスト又は高圧下での軽石粉末又は石英粉末の吹き付けといった機械的加工によって粗化されることを特徴とする、請求項1又は2に記載の方法。
- ステップb)による、前記構成要素(2,3)の前記箔(4)との前記接触は、溶接、好ましくは抵抗溶接により行われることを特徴とする、請求項1乃至4のいずれか1つに記載の方法。
- ステップc)による、前記箔(4)の、前記構成要素(2,3)と接触する前記面(4a,4b)へ前記被覆層(5)を付けるのは、前記箔(4)の前記面(4a,4b)を、絶縁材料化合物からなるプリプレグ(5)と圧着することによって行われることを特徴とする、請求項1乃至5のいずれか1つに記載の方法。
- 前記ステップc)において、少なくとも1枚が導電材料からなる少なくとも1つの構成要素(2,3)と接触する複数の導電箔(4)と、前記箔の間にそれぞれ介在された絶縁材料化合物からなる複数のプリプレグ(5)とが、一体に圧着されて多層回路基板素子(1)となることを特徴とする、請求項6に記載の方法。
- 少なくとも1枚の導電箔(4)と、
前記箔(4)の少なくとも一面(4a,4b)を覆う少なくとも1つの被覆層(5)と、
導電材料からなる少なくとも1つの構成要素(2,3)であって、少なくとも1つの接点で前記箔(4)と接触しており、少なくとも部分的に、好ましくは完全に前記被覆層(5)に埋め込まれている構成要素(2,3)と
を備えた回路基板素子において、
前記構成要素(2,3)の、前記被覆層(5)と接触している前記表面(2o,3o)の少なくとも一部が粗化されることを特徴とする、回路基板素子。 - 前記構成要素は、好ましくは、断面が円形又は矩形の、銅からなる導線(2)として形成されていることを特徴とする、請求項8に記載の回路基板素子。
- 前記構成要素は、好ましくは銅からなる板状の部分(3)として構成されていることを特徴とする、請求項8に記載の回路基板素子。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012216926.1A DE102012216926A1 (de) | 2012-09-20 | 2012-09-20 | Verfahren zur Herstellung eines Leiterplattenelements sowie Leiterplattenelement |
DE102012216926.1 | 2012-09-20 | ||
PCT/EP2013/067988 WO2014044515A1 (de) | 2012-09-20 | 2013-08-30 | Verfahren zur herstellung eines leiterplattenelements sowie leiterplattenelement |
Publications (2)
Publication Number | Publication Date |
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JP2015529402A true JP2015529402A (ja) | 2015-10-05 |
JP6067859B2 JP6067859B2 (ja) | 2017-01-25 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2015532359A Active JP6067859B2 (ja) | 2012-09-20 | 2013-08-30 | 回路基板素子の製造方法及び回路基板素子 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20150237738A1 (ja) |
EP (1) | EP2898759B1 (ja) |
JP (1) | JP6067859B2 (ja) |
CN (1) | CN104756613B (ja) |
DE (1) | DE102012216926A1 (ja) |
WO (1) | WO2014044515A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6084283B2 (ja) * | 2013-02-12 | 2017-02-22 | 株式会社メイコー | 部品内蔵基板及びその製造方法 |
DE102013226549B4 (de) * | 2013-12-19 | 2022-03-31 | Vitesco Technologies Germany Gmbh | Verfahren zur Herstellung einer Leiterplatte |
JP5999122B2 (ja) * | 2014-02-20 | 2016-09-28 | 株式会社村田製作所 | インダクタの製造方法 |
DE102016211995A1 (de) | 2016-07-01 | 2018-01-04 | Schweizer Electronic Ag | Verfahren zur Herstellung einer Leiterplatte und Leiterplatte |
EP3691421A1 (en) | 2019-01-29 | 2020-08-05 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with embedded filament |
DE102020125140A1 (de) | 2020-09-25 | 2022-03-31 | Jumatech Gmbh | Verfahren zur Herstellung einer Leiterplatte sowie ein Formteil zur Verwendung in diesem Verfahren |
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2012
- 2012-09-20 DE DE102012216926.1A patent/DE102012216926A1/de not_active Ceased
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2013
- 2013-08-30 JP JP2015532359A patent/JP6067859B2/ja active Active
- 2013-08-30 EP EP13756878.8A patent/EP2898759B1/de active Active
- 2013-08-30 CN CN201380049063.XA patent/CN104756613B/zh active Active
- 2013-08-30 US US14/429,070 patent/US20150237738A1/en not_active Abandoned
- 2013-08-30 WO PCT/EP2013/067988 patent/WO2014044515A1/de active Application Filing
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Also Published As
Publication number | Publication date |
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CN104756613B (zh) | 2019-04-02 |
WO2014044515A1 (de) | 2014-03-27 |
US20150237738A1 (en) | 2015-08-20 |
JP6067859B2 (ja) | 2017-01-25 |
EP2898759B1 (de) | 2019-11-27 |
CN104756613A (zh) | 2015-07-01 |
DE102012216926A1 (de) | 2014-03-20 |
EP2898759A1 (de) | 2015-07-29 |
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