CN1589093A - 改善点焊中细微漆包线焊点强度的方法 - Google Patents

改善点焊中细微漆包线焊点强度的方法 Download PDF

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CN1589093A
CN1589093A CNA2004100510693A CN200410051069A CN1589093A CN 1589093 A CN1589093 A CN 1589093A CN A2004100510693 A CNA2004100510693 A CN A2004100510693A CN 200410051069 A CN200410051069 A CN 200410051069A CN 1589093 A CN1589093 A CN 1589093A
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enamelled wire
circuit board
trickle
spot welding
wire
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CNA2004100510693A
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尹向阳
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Mornsun Guangzhou Science and Technology Ltd
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Mornsun Guangzhou Science and Technology Ltd
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Priority to CNA2004100510693A priority Critical patent/CN1589093A/zh
Publication of CN1589093A publication Critical patent/CN1589093A/zh
Priority to DE112005001965T priority patent/DE112005001965T5/de
Priority to PCT/CN2005/000478 priority patent/WO2006015528A1/zh
Priority to US11/573,295 priority patent/US20080202795A1/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

本发明公开了一种改善点焊中细微漆包线焊点强度的方法，就是将已与电路板焊合的漆包线绕电路板弯曲后，再拉出使用或连接元件。本发明以电路板本身作为支承，将漆包线弯曲折叠，转移了漆包线的受力点，漆包线受到拉力、上下摆动、扭转等外力时不会直接作用在与电路板的焊合点上，从而有效地保护了漆包线与电路板的焊接，防止线材从焊点处断丝、脱落，适用于直径为10－1mm级别以下的漆包线与电路板互焊的情况。

Description

改善点焊中细微漆包线焊点强度的方法
技术领域
本发明涉及一种焊接方法，尤其涉及一种适用于直径为10-1mm级别以下的漆包线与电路板点焊中改善细微漆包线焊点强度的方法。
背景技术
目前在直径为10-1mm级别以下细微漆包线与电路板互焊的情况中，使用状态可以是单一细微漆包线、也可以是多根纽成一束细微漆包线，对上述细微漆包线通常使用SW点电焊方式来互焊，SW电子点焊机具有无需预先除去绝缘漆就可直接焊接漆包线的功能。其基本工作原理是点电焊焊接是以强大电流短时间通过两个点电极(包括平行电极)之间被压紧搭接的金属工件，在电阻热及压力下形成焊点的焊接。其具体操作方法如图1所示，在电路板3上焊接时SW电子点焊机根据漆包线8的线径和焊件的不同要求，设置焊接压力、输出脉冲幅度和脉冲宽度三组参数，当施加在焊头的压力达到设定值时，才能触发微动开关接通电流。由于平行电极7的尖端设有一定阻值的欧姆接触，通电后电极7尖端产生电火花，与电极尖端接触的绝缘漆一部分被烧除，其余部分向两端退缩，裸露出漆包线。由于焊接压力的继续作用，驱使大量电流转入裸露的漆包线和金属基底9，电能转化为热能，实现在同一个脉冲完成除漆和焊接。经过上述焊接后的漆包线(如图2所示)，一般都是直接拉出使用，受力点集中在线材与焊点相交的A处一点上，这样，当线材受到拉力、上下摆动、扭转等外力作用时，由于线材在受力和加热空冷的焊接过程，其硬度提高，而塑性、韧性大大下降，非常容易导致A处线材从焊点脱落、断丝的现象，给电路增加不稳定因素而留下隐患。
发明内容
本发明的目的在于提供一种适用于直径为10-1mm级别以下的各种常见漆包线与电路板点焊中改善细微漆包线焊点强度的方法。不仅能保证过细的漆包线与电路板焊接的稳定性，而且有效地解决了线材从焊点脱落、断丝的问题。
本发明的目的通过以下技术方案予以实现：
本发明提供的一种改善细微漆包线焊点强度的方法，就是将已与电路板焊点焊合的细微漆包线绕电路板弯曲后，拉到电路板焊点背面使用或连接元件。本发明利用电路板本身的结构找出一个支点，将线材进行折叠弯曲，再拉出使用或连接元件，以转移线材的受力点，焊接好后线材所受的拉力、上下摆动、扭转等外力不会直接作用在焊点上，达到避开线材最脆弱的A受力点处的效果，从而很好地保护了线材与电路板的焊接，有效地防止了线材从焊点处断丝、脱落。
本发明所述细微漆包线与电路板焊点的相交点贴近电路板的板面，这样有利于细微漆包线绕电路板弯曲。
本发明支点的结构可以是电路板自身设计的结构，如其上的孔、洞等，也可是根据线材折叠弯曲的需要在电路板上增设的其它微小的支点结构。为此本发明可做如下进一步的改进：所述细微漆包线可以直接绕过电路板的边端弯曲折叠。为了更好地对细微漆包线进行定位，本发明也可以在所述电路板的边端设置凹槽，细微漆包线经过该凹槽绕电路板弯曲；或者在所述电路板上设置通孔，细微漆包线穿过该通孔绕电路板弯曲。
本发明具有以下有益效果：1、有效预防线材在外力作用下从焊点处脱落、断丝，消除电路的隐患，确保电路的正常工作；2、结构简单，连接时操作方便。
附图说明
图1现有技术SW点电焊工作原理示意图；
图2是现有技术细微漆包线和电路板的焊接示意图；
图3是本发明实施例之一的结构示意图；
图4是本发明实施例之二的结构示意图；
图5是本发明实施例之三的结构示意图。
具体实施方式
如图3所示为本发明的实施例之一，细微漆包线1与电路板3经焊点2相互焊接，细微漆包线1与焊点2相交于A点，A点贴近电路板3的板面。细微漆包线1直接绕过电路板3的边端弯曲折叠，拉到电路板焊点背面使用或连接元件；在电路板3的底部形成作用支点B，细微漆包线摆动段1′则以B为支点拉出或连接元件。在细微漆包线1受到拉力、上下摆动、扭转等外力时避免了直接作用在与焊点2相交的A点处，从而有效地保护了细微漆包线与电路板的焊接，防止线材从焊点处断丝、脱落。
图4所示为本发明的实施例之二，与实施例一不同之处在于：细微漆包线1与金属片6焊接，电路板3的边端设有凹槽4，细微漆包线1经过该凹槽4绕电路板3弯曲折叠。
图5所示为本发明的实施例之三，与实施例一不同之处在于：细微漆包线1与金属片6焊接，电路板3上设有通孔5，细微漆包线1穿过该通孔5绕电路板3弯曲折叠。

Claims (5)

1、一种改善点焊中细微漆包线焊点强度的方法，其特征在于：与电路板焊点焊合的细微漆包线绕电路板弯曲后，拉到电路板焊点背面使用或连接元件。
2、根据权利要求1所述的改善点焊中细微漆包线焊点强度的方法，其特征在于：所述细微漆包线与电路板焊点的相交点贴近电路板的板面。
3、根据权利要求1或2所述的改善点焊中细微漆包线焊点强度的方法，其特征在于：所述细微漆包线直接绕过电路板的边端弯曲。
4、根据权利要求1或2所述的改善点焊中细微漆包线焊点强度的方法，其特征在于：所述电路板的边端设有凹槽，细微漆包线经过该凹槽绕电路板弯曲。
5、根据权利要求1或2所述的改善点焊中细微漆包线焊点强度的方法，其特征在于：所述电路板上设有通孔，细微漆包线穿过该通孔绕电路板弯曲。
CNA2004100510693A 2004-08-13 2004-08-13 改善点焊中细微漆包线焊点强度的方法 Pending CN1589093A (zh)

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Application Number Priority Date Filing Date Title
CNA2004100510693A CN1589093A (zh) 2004-08-13 2004-08-13 改善点焊中细微漆包线焊点强度的方法
DE112005001965T DE112005001965T5 (de) 2004-08-13 2005-04-11 Verfahren zum Verbessern einer Lötverbindungsfestigkeit eines sehr kleinen emaillierten Drahts beim SW
PCT/CN2005/000478 WO2006015528A1 (fr) 2004-08-13 2005-04-11 Procede d’amelioration de la qualite de la soudure du petit cable emaille dans les soudures par points
US11/573,295 US20080202795A1 (en) 2004-08-13 2005-04-11 Method of Improving the Strength of a Spot-Welded Joint Between Fine Enameled Wire and Circuit Board

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CNA2004100510693A CN1589093A (zh) 2004-08-13 2004-08-13 改善点焊中细微漆包线焊点强度的方法

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WO (1) WO2006015528A1 (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101808461A (zh) * 2010-03-22 2010-08-18 北京巨数数字技术开发有限公司 一种电路板
CN101394968B (zh) * 2005-12-23 2010-12-15 杨仕桐 电阻焊焊头及其制备方法
CN104772541A (zh) * 2015-04-10 2015-07-15 安徽铜峰电子股份有限公司 可增加电容器喷金端面与引线连接强度的焊接方法
CN111850780A (zh) * 2019-04-24 2020-10-30 株式会社丰田自动织机 织机的纬纱检测装置
CN114083166A (zh) * 2021-11-03 2022-02-25 湖南立方新能源科技有限责任公司 一种电芯极耳焊线工艺及电芯极耳焊线结构

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DE102012216926A1 (de) * 2012-09-20 2014-03-20 Jumatech Gmbh Verfahren zur Herstellung eines Leiterplattenelements sowie Leiterplattenelement
US11126069B2 (en) * 2018-06-27 2021-09-21 Coretronic Corporation Projector and optical module including extending wire
DE112020006487T5 (de) * 2020-01-10 2022-12-01 Ghsp, Inc. Leiterplatte für Statorwicklungen mit integrierten Sicherungsstrukturen

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3944777A (en) * 1974-12-13 1976-03-16 David Porat Method for joining resistive and conductive materials
GB2176654B (en) * 1985-06-11 1988-08-10 Avx Corp Method for optimising the decoupling of integrated circuit devices
JPS6459975A (en) * 1987-08-31 1989-03-07 Tokin Corp Piezoelectric actuator
CN2518239Y (zh) * 2001-12-10 2002-10-23 宝安区西乡镇共乐富耀电子零组件厂 电子连接器结构改良
CN1462172A (zh) * 2002-05-27 2003-12-17 联测科技股份有限公司 具固定防焊层的印刷电路板

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101394968B (zh) * 2005-12-23 2010-12-15 杨仕桐 电阻焊焊头及其制备方法
CN101808461A (zh) * 2010-03-22 2010-08-18 北京巨数数字技术开发有限公司 一种电路板
CN101808461B (zh) * 2010-03-22 2015-05-27 深圳市中庆微科技开发有限公司 一种电路板
CN104772541A (zh) * 2015-04-10 2015-07-15 安徽铜峰电子股份有限公司 可增加电容器喷金端面与引线连接强度的焊接方法
CN111850780A (zh) * 2019-04-24 2020-10-30 株式会社丰田自动织机 织机的纬纱检测装置
CN114083166A (zh) * 2021-11-03 2022-02-25 湖南立方新能源科技有限责任公司 一种电芯极耳焊线工艺及电芯极耳焊线结构

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WO2006015528A1 (fr) 2006-02-16
US20080202795A1 (en) 2008-08-28

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