GB2176654B - Method for optimising the decoupling of integrated circuit devices - Google Patents

Method for optimising the decoupling of integrated circuit devices

Info

Publication number
GB2176654B
GB2176654B GB08609059A GB8609059A GB2176654B GB 2176654 B GB2176654 B GB 2176654B GB 08609059 A GB08609059 A GB 08609059A GB 8609059 A GB8609059 A GB 8609059A GB 2176654 B GB2176654 B GB 2176654B
Authority
GB
United Kingdom
Prior art keywords
optimising
decoupling
integrated circuit
circuit devices
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08609059A
Other versions
GB8609059D0 (en
GB2176654A (en
Inventor
John A Maxwell
Lonnie Hopkins
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Avx Components Corp
Original Assignee
AVX Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AVX Corp filed Critical AVX Corp
Publication of GB8609059D0 publication Critical patent/GB8609059D0/en
Publication of GB2176654A publication Critical patent/GB2176654A/en
Application granted granted Critical
Publication of GB2176654B publication Critical patent/GB2176654B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
GB08609059A 1985-06-11 1986-04-14 Method for optimising the decoupling of integrated circuit devices Expired GB2176654B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US74297485A 1985-06-11 1985-06-11

Publications (3)

Publication Number Publication Date
GB8609059D0 GB8609059D0 (en) 1986-05-21
GB2176654A GB2176654A (en) 1986-12-31
GB2176654B true GB2176654B (en) 1988-08-10

Family

ID=24986997

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08609059A Expired GB2176654B (en) 1985-06-11 1986-04-14 Method for optimising the decoupling of integrated circuit devices

Country Status (6)

Country Link
JP (1) JPS61287292A (en)
KR (1) KR900003311B1 (en)
CN (1) CN86103388A (en)
DE (1) DE3618590A1 (en)
FR (1) FR2583251A1 (en)
GB (1) GB2176654B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6232693A (en) * 1985-08-03 1987-02-12 株式会社　ニフコ Mounting of circuit part to printed circuit board
US4882656A (en) * 1986-12-12 1989-11-21 Menzies Jr L William Surface mounted decoupling capacitor
FR2622346B1 (en) * 1987-10-23 1993-05-28 Eurofarad CAPACITOR FOR ELECTRONIC MICRO-CIRCUIT AND MOUNTING INCORPORATING SUCH A CAPACITOR
KR100277314B1 (en) 1996-11-08 2001-01-15 모기 쥰이찌 Thin film capacitor and semiconductor device equipped with it
US6408090B1 (en) * 1998-09-28 2002-06-18 Siemens Production And Logistics System Aktiengesellschaft Method for position recognition of components equipped on a substrate in an automatic equipping unit
US6404649B1 (en) * 2000-03-03 2002-06-11 Advanced Micro Devices, Inc. Printed circuit board assembly with improved bypass decoupling for BGA packages
JP4186589B2 (en) * 2002-10-30 2008-11-26 松下電器産業株式会社 Sheet-type electronic component module
CN1589093A (en) * 2004-08-13 2005-03-02 广州金升阳科技有限公司 Method for improving fine enamelled wire spot welding strengh in spot welding

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4502101A (en) * 1982-07-30 1985-02-26 Rogers Corporation Decoupled integrated circuit package
FR2576448B1 (en) * 1985-01-22 1989-04-14 Rogers Corp DECOUPLING CAPACITOR FOR ASSEMBLY WITH A PIN GRID ARRANGEMENT

Also Published As

Publication number Publication date
CN86103388A (en) 1986-12-10
GB8609059D0 (en) 1986-05-21
FR2583251A1 (en) 1986-12-12
DE3618590A1 (en) 1986-12-11
GB2176654A (en) 1986-12-31
KR900003311B1 (en) 1990-05-14
JPS61287292A (en) 1986-12-17
KR870000849A (en) 1987-02-20

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee