CN86103388A - The decoupling of printed circuit constitutes and method - Google Patents
The decoupling of printed circuit constitutes and method Download PDFInfo
- Publication number
- CN86103388A CN86103388A CN198686103388A CN86103388A CN86103388A CN 86103388 A CN86103388 A CN 86103388A CN 198686103388 A CN198686103388 A CN 198686103388A CN 86103388 A CN86103388 A CN 86103388A CN 86103388 A CN86103388 A CN 86103388A
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- Prior art keywords
- circuit board
- layer ceramic
- integrated circuit
- solder joint
- ceramic capacitance
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- 238000000034 method Methods 0.000 title claims description 11
- 239000000919 ceramic Substances 0.000 claims abstract description 60
- 230000000694 effects Effects 0.000 claims abstract description 11
- 239000000203 mixture Substances 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 claims description 30
- 239000003989 dielectric material Substances 0.000 claims description 5
- 239000003985 ceramic capacitor Substances 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims 4
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 229910010293 ceramic material Inorganic materials 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 238000009434 installation Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 239000003990 capacitor Substances 0.000 abstract description 20
- 238000011430 maximum method Methods 0.000 abstract 1
- 230000005764 inhibitory process Effects 0.000 description 7
- 230000001629 suppression Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011469 building brick Substances 0.000 description 1
- 238000004883 computer application Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/642—Capacitive arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A kind of PBA printed board arrangement, it comprises the integrated circuit (IC)-components that keeps a determining deviation to install with printed circuit board (PCB), places the multi-layer ceramic capacitance in the space between circuit board and this device lower surface.The power end of this electric capacity and device is in parallel, and according to placing with the heat exchange relationship of integrated circuit.Select the ceramic component of electric capacity, maximum is arranged when making it be in the operating temperature range in above-mentioned space.The disclosure and then at making multi-layer ceramic capacitance reach the maximum method that effectively suppresses effect.Determine the working temperature in above-mentioned space earlier, the ceramic composition of selected electric capacity makes it that maximum capacitor value be arranged in the said temperature scope subsequently.
Description
The present invention relates to a kind of combined electronical assembly, this assembly comprises printed circuit (PC) plate, integrated circuit (IC) assembly and suppression capacitor.
The present invention and then be the method for making the above-mentioned type device at a kind of, this device can reach maximum current densities and high inhibition efficient.
The practice that includes, but is not limited to computer industry according to present normally comes mounting electronic device with printed circuit board (PCB).Printed panel generally includes an insulated substrate, on outer surface of substrate or the internal base plate that encases with the insulating barrier on both sides many conductive paths is arranged.The point that printed circuit board (PCB) is used for cancelling in the past now has been to be bordering on method in common with putting connection technology.
In order to obtain maximum current densities, use the silicon that includes usually together with printed circuit board (PCB), perhaps itself can form the integrated circuit (IC)-components of the chip of a large amount of circuit and electronic circuit exactly.Integrated circuit (IC) chip can comprise hole on many and the printed circuit board (PCB) or solder joint on the position corresponding certain intervals arranged contact fin or terminals.By the terminals of integrated circuit (IC)-components being passed the hole on the corresponding circuit board at regular intervals; Perhaps the solder joint of these terminals and circuit board is alignd, welding between terminals and corresponding conductive path (under the situation of having used through hole type printed circuit board (PCB)) or terminals and the solder joint (under the situation of using non through hole type printed circuit board (PCB)), can install to integrated circuit (IC)-components on the printed circuit board (PCB) then.
In computer application, use a suppression capacitor to be connected across the power line two ends of integrated circuit (IC)-components usually especially.The function of this capacitor is to suppress the pulse or the spark that produce in the power supply, otherwise these pulses or spark may be scurried into system and be created in industrial " the soft error " that is called.
So far, insert the necessary usual method that is used for inhibiting capacitor and be the lead-in wire of suppression capacitor is soldered to the suitably grommets or the solder joint of arrangement on the printed circuit board (PCB), these eyelets or solder joint are linked to the both ends of power of integrated circuit by the conductive path on the printed circuit board (PCB).Secondly, present technology confirms that the conductive path of the equivalent length that exists can produce big inductance value between capacitor and integrated circuit (IC) chip power line.Because the existence of this inductance must utilize sizable capacitance to reach desirable inhibition power supply effects of jamming.Obviously, the application of large value capacitor has not only increased the cost of electronic building brick but also has reduced to provide the ability of high-density circuit because of the full size of necessary high capacity capacitor.
According to nearest technology, for example United States Patent (USP) 3,617, and 817 and 4,249,196, a kind of scheme that directly comprises multilayer ceramic capacitor in integrated circuit (IC)-components has been proposed.By incorporate multi-layer ceramic capacitance in ic shell, the lead-in wire of the both ends of power connection suppression capacitor of integrated circuit will be very short.The angle that inductance value is reduced from having utilized short leg was compared with former method, might use numerical value obviously less, thereby the also less capacitor of full size was obtained gratifying inhibition effect.Encapsulated capacitor also provides the additional benefit that current densities is increased in the integrated circuit housing.
From the negative side, in the integrated circuit housing, wrap into multi-layer ceramic capacitance and can produce many manufacturings and adaptability problem.From the viewpoint of making, in a shell, put into certain integrity problem that the different element of thermal coefficient of expansion can produce electricity and engineering properties.From the adaptability viewpoint, under various circuit arrangement, use and Power Supplies Condition, use given ic core sector-meeting to produce such situation, promptly the capacitance that is had just is similar to the ideal capacitance value that is used for suppressing.So, in concept,, multi-layer ceramic capacitance showing tangible benefit in the technology at present in the integrated circuit packing though being housed, and this multiple device also is not used widely so far.
Consider aforementioned background, a target of the present invention provides a kind of desirable circuit of printed circuit board (PCB), integrated circuit (IC)-components and multi-layer ceramic capacitance that comprised and constitutes, they combine by this way, best multi-layer ceramic capacitance inhibition effect is promptly arranged in specific circuit application and do not reduce current densities.
Further object of the present invention is to make common mass-produced integrated circuit (IC)-components can and suppress with printed circuit board (PCB) to be joined together in this way with multi-layer ceramic capacitance, be that it makes the inhibition effect of multi-layer capacity reach best and not make the manufacturing of integrated circuit complicated because of the adding of multi-layer ceramic capacitance, and between multi-layer ceramic capacitance and integrated circuit, do not need to use long lead.
More particularly, the present invention can directly be summarised as a printed circuit board (PCB), integrated circuit and ceramic multilayer circuit and make up by mode like this, promptly uses capacitor most effectively and density that can sacrifice circuit.
Further specifically, according to the present invention, provide a kind of printed circuit board (PCB), it has common inner conductive path, and a series of solder joints that the integrated circuit terminals are fixed in are arranged on its surface of exposing.Printed circuit board (PCB) provides a kind of self-characteristic known integrated circuit (IC)-components together therewith, and wherein, terminals have comprised the corresponding wiring leg that stretches out under the lower surface by integrated circuit.The aspect of innovation of the present invention comprises: a pair of solder joint that is set directly under the space that the integrated circuit body occupies is provided, and solder joint has comprised the conductive path of guiding to printed circuit board power end (these end points will be connected to the power end of integrated circuit).
Before inserting integrated circuit, multi-layer ceramic capacitance is connected on the solder joint under the space that occupies by integrated circuit.Identical with the space in the zone on the printed circuit board (PCB) upper surface under the thickness that makes multi-layer ceramic capacitance and the integrated circuit lower surface, this space is provided by the length of the terminals that extend under the integrated circuit (IC)-components.
An important feature of the present invention is to derive from following understanding, will work in when promptly each integrated circuit (IC)-components is worked under the application-specific of its expection within a specific temperature or the specific temperature range.We and then affirmation, the working temperature of a given integrated circuit will change with different application.Also confirmed, be operated in what temperature or what temperature range, just can make the composition of the dielectric material that is used for making multi-layer ceramic capacitance be suitable for providing a maximum dielectric constant if know multi-layer ceramic capacitance.
In view of the above, we have found such ability, promptly multi-layer ceramic capacitance directly is set below integrated circuit and realizes that best circuit constitutes according to heat exchange relationship, thereby, the heat that integrated circuit produces multi-layer ceramic capacitance will be remained under the specific working temperature or one can predetermined operating temperature range in.Therefore, by measuring the working temperature in the space between printed circuit board (PCB) and the integrated circuit, perhaps under a specific circuit arrangement, estimate this specific character by the known running parameter of integrated circuit, and by the multi-layer ceramic capacitance that heat exchange relationship is arranged with integrated circuit is set in above-mentioned space, just might make the dielectric composition of multi-layer ceramic capacitance be suitable for such situation, promptly the numerical value of multi-layer ceramic capacitance will remain on the best numerical value to obtain desirable inhibition effect.
More specifically, if a given integrated circuit is used for a kind of like this circuit and constitutes, wherein, make the space between the lower surface of printed circuit board (PCB) and integrated circuit (IC)-components remain on a temperature range, such as about 65 ° to about 70 ℃, then might form such dielectric material, make that promptly the dielectric constant of this material remains on peak in described scope.In this case, the size of capacitor can remain on to obtaining on the necessary minimum value of required capacitance.
By very clear in the general introduction of front, the invention belongs to the standard of making a product, this product comprises that one has the printed circuit board (PCB) of suitable connection pad and inner wire, an integrated circuit (IC)-components that comprises terminals, these terminals at the lower surface of integrated circuit (IC)-components from separately preset distance and the multi-layer ceramic capacitance that places between integrated circuit (IC)-components and the printed circuit board (PCB) in parallel with the power end of integrated circuit (IC)-components on the circuit board.This multi-layer ceramic capacitance is according to placing with the heat exchange relationship of integrated circuit (IC)-components, thereby integrated circuit (IC)-components and multi-layer ceramic capacitance mutual effect are so that the capacity of multi-layer ceramic capacitance remains on the numerical value of a hope or within the scope of a hope.
With so aware and the objective of the invention is to obtain the method that a desirable inhibition circuit constitutes, the method comprises the steps, promptly measures the temperature by the occupied zone of multi-layer ceramic capacitance; Insert multi-layer ceramic capacitance in described zone; And be provided with the source element by the heat exchange relationship printed circuit board (PCB).The temperature in the shared zone of multi-layer ceramic capacitance is subjected to the integrated circuit influence of thermal effect of (and remaining adjacent circuit exists), and the dielectric numerical value of the dielectric material of formation multi-layer ceramic capacitance reaches optimum value corresponding to the working temperature of expecting.
In order to reach these targets noted here and the following other further target that will point out, will make narration with reference to the accompanying drawings.
Fig. 1 is the top view of the part of printed circuit board (PCB), has wherein dotted out by integrated circuit (IC)-components and multi-layer ceramic capacitance position occupied.
Fig. 2 is the partial vertical sectional view according to printed circuit board (PCB) of the present invention, integrated circuit (IC)-components and multi-layer ceramic capacitance.
Fig. 3 is similar to view Fig. 2, that represented the embodiment of the invention.
Fig. 4 is the view of the minification of integrated circuit (IC)-components commonly used, and this integrated circuit (IC)-components is suitable for device of the present invention.
Fig. 5 is a curve, has shown the variation from the capacity of the about 50 ℃ multi-layer ceramic capacitances of realizing best dielectric effect in about 70 ℃ temperature range.
Description, Fig. 1 has shown printed circuit board (PCB) cross section 10, this circuit board has typically comprised glass fiber material or the analog that polymer is reinforced.Circuit board 10 can comprise many inside (sub-surface) conductive path, and these conductive paths end on one group of surface that solder joint 11 is installed.
Any skilled person for this area, clearly, the cross section of printed circuit board (PCB) as shown in Figure 1 or section have been represented the segment or the cross section of a big board structure of circuit, and this structure can comprise the many repetitions and the variation of many wirings of only representing with way of example.Solder joint 11 is suitable for constituting the tie point of terminals 12, and these terminals are from integrated circuit (IC)-components 13(detailed icon in Fig. 2) stretch out.Because the performance of the integrated circuit (IC)-components that shows among Fig. 2 is very clear, to the description of its CONSTRUCTED SPECIFICATION only by the present invention is made an appraisal the degree that reaches of necessity.
More specifically, integrated circuit (IC)-components 13 typically includes a silicon, has on the chip to corrode thereon in a large number and limits and the circuit that obtains, and is encapsulated in epoxy resin or the similar polymeric shells 14.Terminals 12 extend through housing and contact with the circuit of the silicon that encapsulates.The housing 14 of integrated circuit (IC)-components 13 comprises a downward lower surface.
Checking Fig. 2 can find out, the lower surface 15 of housing 14 places a certain height on the bottom 16 of terminals 12.So, when integrated circuit is in rigging position, between the lower surface 15 of the upper surface 18 of printed circuit board (PCB) and housing 14, limit a space 17.Within the space 17 that will limit, be equipped with earlier,, wish that the height of electric capacity is remained on about 0.022 inch to be arrived within about 0.026 inch scope for the application such as being multi-layer ceramic capacitance 19.Multi-layer ceramic capacitance 19 comprises the terminals 20,21 that are connected in the opposite interior electrode of polarity of capacitor in due form, terminals 20,21 preferably cover the edge with the form of metal strip, and, cover the overlapping part of multi-layer ceramic capacitance body near the end.Terminals 20,21 are welded to solder joint 22,23, and solder joint 22,23 is respectively formed in the zone under the lower surface 15 that is sitting at housing 14 on the printed circuit board (PCB).Printed circuit board (PCB) comprise inner conductive path 22 ', 23 ', they are used for the terminals of multi-layer ceramic capacitance 19 electrically are connected to solder joint 24,25, as shown in the figure, solder joint 24,25 is used as the power end of multi-layer ceramic capacitance.
By the discussion of front as can be known, after having used capacitor 19 and having inserted integrated circuit 13 subsequently with solder technology, multi-layer ceramic capacitance 19 will with the solder joint 24 of the power end that is connected to this integrated circuit, 25 one-tenth relations in parallel.By feat of with the hithermost relation of lower surface 15, multi-layer ceramic capacitance 19 also will be provided with according to the heat exchange relationship with integrated circuit (IC)-components 13.
Relate to the heat exchange relationship of multi-layer ceramic capacitance and integrated circuit (IC)-components, might make the dielectric constant of the dielectric material of electric capacity be suitable for providing maximum capacitance under the operating temperature range in particular device.
With reference to figure 5, a curve is disclosed, it has shown the variation of the dielectric dielectric constant of barium titanate.In curve, Y-axis has been represented the rate of change that capacitance produces with the variations in temperature of X-axis.By curve as can be known, when capacitor worked in about 55 ℃ to 60 ℃ temperature range, the numerical value during with 25 ℃ was reference, and capacitance increases by 20%.Because might easily estimate the temperature of given integrated circuit when in a specific circuit, using, the temperature of promptly measuring under the integrated circuit to be reached, just might select a kind of dielectric capacitor, it is maximum that its dielectric constant reaches in the said temperature scope.So, by selected best dielectric, might produce compacter capacitor, and/or obtain maximum capacitance, thereby have maximum pulse to suppress effect selected electric capacity.With reference now to Fig. 3,, it discloses one embodiment of the present of invention, and the embodiment that it and Fig. 2 show is that similarly different is in all respects, shell 14 ' a downward groove 30 of lower surface 15 ' comprise, its size is for encasing the part of multi-layer ceramic capacitance 19.By this arrangement, the heat exchange relationship of capacitor and integrated circuit (IC)-components has been reinforced, and has guaranteed maximum heat transfer.In addition, by on integrated circuit (IC)-components, slotting and inserting multi-layer ceramic capacitance therein, provide maximum compactedness and current densities.
Very clear by the front discussion, the present invention is the device of an innovation, and it comprises printed circuit board (PCB), integrated circuit (IC)-components and is placed in the multi-layer ceramic capacitance that heat exchange relationship is arranged under the integrated circuit (IC)-components and with it.And then confirm that this has openly implemented a kind of method of innovation, its feasible space that can use most effectively under the integrated circuit (IC)-components.
More specifically, the step that the method comprises is: determine the operating temperature range under integrated circuit (IC)-components, and select dielectric used in the multi-layer ceramic capacitance according to the temperature range that cause in the space under integrated circuit (IC)-components.The rate of change of dielectric constant is that the function of temperature is a well known phenomenon in the ceramic capacitor industry, therefore, in a single day skilled worker author in ceramic industry is after having known specific working temperature, just can easily adjust or revise known ceramic component, in selected scope, to obtain the maximum dielectric constant.
For the expert of this area be familiar with the people of present disclosure, many variations of CONSTRUCTED SPECIFICATION will be tangible.Therefore, the present invention should obtain the explanation of broad sense in the scope of appended claim.
Claims (5)
1, a kind of knockdown printed circuit board (PCB), it has one group of conductive path; Lip-deep one group of conductivity at said circuit board is installed solder joint, and one that selectes in said solder joint and the said solder joint has the conductivity relation; Include many circuit chip assemblies that are installed in the internal circuit device on the said circuit board, said assembly comprises an insulation crust and corresponding extraction elements, said extraction elements stretches out by said shell and extends to a position under the lower surface of shell, said extraction elements also electrically and mechanically is fixed on selected in the said solder joint of the said circuit board solder joint, condition of contact according to said extraction elements and solder joint, the said surface of said shell places the certain spacing of being separated by of the said surface with said circuit board, said circuit board comprises at least one pair of installation solder joint, these are installed solder joints and place space between the said surface of the said lower surface of said integrated circuit package and said circuit board, the conductor means on said circuit board to leave said surface one that selectes in said solder joint pair and said all the other solder joints is electrically connected; And a pair of multi-layer ceramic capacitance that exposes terminals arranged, the interval of these terminals is corresponding to the right interval of said solder joint, said multi-layer ceramic capacitance places the space between the said lower surface of said circuit board and said shell, and said each terminals of said multi-layer ceramic capacitance electrically and are mechanically linked a right corresponding solder joint of said solder joint.
2, according to the assembly of claim 1, wherein, the lower surface of said shell comprises a upwardly extending groove, and said multi-layer ceramic capacitance places in the middle of the said groove at least in part.
3, according to the device of claim 1, wherein, the upper surface of said multi-layer ceramic capacitance is according to placing with the hithermost space of the said lower surface heat exchange relationship of said shell.
4, according to the device of claim 1, wherein, said multi-layer ceramic capacitance according to and the space of heat exchange relationship between said assembly and said circuit board of said integrated circuit package in place said multilayer ceramic capacitor, and the dielectric constant that constitutes the ceramic material of said multi-layer ceramic capacitance has maximum in normal operating temperature range, and this operating temperature range is to come across between the lower surface of the said surface of said printed circuit board (PCB) and said integrated circuit package.
5, make that be installed in the multi-layer ceramic capacitance of the integrated circuit (IC)-components power end of close printed circuit board (PCB) reaches the method that maximum effective impulse suppresses effect and may further comprise the steps: determine in the lower surface of said integrated circuit (IC)-components and the average normal working temperature scope at place, the space between the said printed circuit board (PCB) upper surface; A multi-layer ceramic capacitance that the ceramic dielectric composition is arranged is provided, and the dielectric constant of this dielectric material has maximum in said normal working temperature scope; The terminals of said multi-layer ceramic capacitance are received on the contact on the printed circuit board surface; And subsequently according to the added space heat exchange relationship of said multi-layer ceramic capacitance is fixed on integrated circuit (IC)-components on the printed circuit board (PCB), and the power end of said integrated circuit (IC)-components is connected on the contact that becomes parallel connection with said multi-layer ceramic capacitance on the said circuit board.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US74297485A | 1985-06-11 | 1985-06-11 | |
| US742,774 | 1985-06-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN86103388A true CN86103388A (en) | 1986-12-10 |
Family
ID=24986997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN198686103388A Pending CN86103388A (en) | 1985-06-11 | 1986-05-17 | The decoupling of printed circuit constitutes and method |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS61287292A (en) |
| KR (1) | KR900003311B1 (en) |
| CN (1) | CN86103388A (en) |
| DE (1) | DE3618590A1 (en) |
| FR (1) | FR2583251A1 (en) |
| GB (1) | GB2176654B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006015528A1 (en) * | 2004-08-13 | 2006-02-16 | Mornsun Guangzhou Science & Technology Ltd. | Method of improving soldered joint strengh of the tiny enameled wire in sw |
| CN1975942B (en) * | 2002-10-30 | 2010-05-19 | 松下电器产业株式会社 | Sheet capacitor |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6232693A (en) * | 1985-08-03 | 1987-02-12 | 株式会社 ニフコ | Mounting of circuit part to printed circuit board |
| US4882656A (en) * | 1986-12-12 | 1989-11-21 | Menzies Jr L William | Surface mounted decoupling capacitor |
| FR2622346B1 (en) * | 1987-10-23 | 1993-05-28 | Eurofarad | CAPACITOR FOR ELECTRONIC MICRO-CIRCUIT AND MOUNTING INCORPORATING SUCH A CAPACITOR |
| KR100277314B1 (en) * | 1996-11-08 | 2001-01-15 | 모기 쥰이찌 | Thin film capacitor and semiconductor device equipped with it |
| US6408090B1 (en) * | 1998-09-28 | 2002-06-18 | Siemens Production And Logistics System Aktiengesellschaft | Method for position recognition of components equipped on a substrate in an automatic equipping unit |
| US6404649B1 (en) * | 2000-03-03 | 2002-06-11 | Advanced Micro Devices, Inc. | Printed circuit board assembly with improved bypass decoupling for BGA packages |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4502101A (en) * | 1982-07-30 | 1985-02-26 | Rogers Corporation | Decoupled integrated circuit package |
| FR2576448B1 (en) * | 1985-01-22 | 1989-04-14 | Rogers Corp | DECOUPLING CAPACITOR FOR ASSEMBLY WITH A PIN GRID ARRANGEMENT |
-
1986
- 1986-04-14 GB GB08609059A patent/GB2176654B/en not_active Expired
- 1986-05-13 KR KR1019860003693A patent/KR900003311B1/en active IP Right Grant
- 1986-05-17 CN CN198686103388A patent/CN86103388A/en active Pending
- 1986-06-03 DE DE19863618590 patent/DE3618590A1/en not_active Withdrawn
- 1986-06-04 JP JP61130025A patent/JPS61287292A/en active Pending
- 1986-06-11 FR FR8608455A patent/FR2583251A1/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1975942B (en) * | 2002-10-30 | 2010-05-19 | 松下电器产业株式会社 | Sheet capacitor |
| WO2006015528A1 (en) * | 2004-08-13 | 2006-02-16 | Mornsun Guangzhou Science & Technology Ltd. | Method of improving soldered joint strengh of the tiny enameled wire in sw |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61287292A (en) | 1986-12-17 |
| KR870000849A (en) | 1987-02-20 |
| GB2176654B (en) | 1988-08-10 |
| GB2176654A (en) | 1986-12-31 |
| DE3618590A1 (en) | 1986-12-11 |
| KR900003311B1 (en) | 1990-05-14 |
| FR2583251A1 (en) | 1986-12-12 |
| GB8609059D0 (en) | 1986-05-21 |
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|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |