CN1462172A - 具固定防焊层的印刷电路板 - Google Patents
具固定防焊层的印刷电路板 Download PDFInfo
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Abstract
一种具固定防焊层的印刷电路板,该电路板具有一由玻璃纤维补强环氧树脂所制成的基板,该基板的顶底面各布设有一导电线路,一环氧树脂防焊层布设于该基板表面并覆盖其上的导电线路,该防焊层的厚度是介于2μm-200μm,在以每500mm为一量测长度单位下,其最大厚度与最小厚度的差额是小于或等于10μm,其表面粗糙度为Rz值介于0.5μm-10μm。
Description
技术领域
本发明是与印刷电路板的结构有关,特别是指一种具有固定防焊层(solder mask)的印刷电路板(Printed circuit board)。
背景技术
按,有关在印刷电路板上布设一层固定防焊层的技术,目前较为进步的是如美国第5,626,774号专利案所揭露的,该专利案主要在提供一种使用与印刷电路板所含树脂匹配的树脂为防焊层的材质,以及如何将该材质布设于印刷电路板成为一层固定防焊层的技术,虽然依该技术所制成的防焊层可以解决现有防焊层厚度不均匀,低玻璃转换温度(Tg)以及无法精确地显露出印刷电路板上需要焊接的线路部分等缺点,惟其对于如何的来选择防焊层的厚度,整层防焊层须具备何种厚度均匀性等均未提及。
因为防焊层的厚度如果厚度不均匀,在该印刷电路板在后续的封装制程中,该防焊罩表面会与封装压模间会产生间隙,致发生溢料的情形。另外,前述现有的印刷电路板具防焊层的表面粗糙度不足,致在后续的封装制程中,该防焊层表面与压模材料间无法牢固地结合,容易产生压模材料剥离的现象。
再者,该现有的印刷电路板其未被防焊层覆盖的线路,如布线过于紧密往往会发生离子迁移(ion migration)现象,换言之,会因而减低该电路板的布线密度。更且该现有印刷电路板用来导通上下层电路的空心镀通孔会因充填空气致使整体封装结构在后续的封装制程中,特别是加热过程,受到不良的影响。
发明内容
本发明的主要目的即在提供一种具固定防焊焊层的印刷电路板,其防焊层的厚度可配合不同方式的半导体晶片封装。
本发明的另一目的则在提供一种具固定防焊层的印刷电路板,其在作为半导体晶片封装的基材时,该防焊层可与用来覆盖整体封装的模塑材料紧密的结合,而且在模塑过程中不会产生溢料的问题。
本发明的又一目的乃在提供一种具固定防焊层的印刷电路板,其可提高导电线路的布设密度。
为达成上述的目的,本发明所提供的一种具固定防焊层的印刷电路板,其特征在于,包含有:一基板,是由包含有一第一树脂的材料所制成,该基板具有一顶表面及一底表面,其中该顶表面上布设有一第一导电线路,该线路具有一被遮蔽部份及一暴露部份;一第一防焊层,是由一第二树脂所制成,该第二树脂的热膨胀系数实质上与该第一树脂相同,该防焊层是以覆盖该第一导电线路的被遮蔽部分以及形成一平整外表面的方式布设于该基板的顶表面上;以及该防焊层在以每500mn为一量测长度单位下,其最大厚度与最小厚度的差额是小于或等于10μm。
其中,该基板的底面亦布设有一第二导电线路,该线路亦具有一被遮蔽部分及一暴露部分;一第二防焊层,是由与该第二树脂所制成,该防焊层同样地以覆盖该第二导电线路的被遮蔽部分以及形成一平整外表面的方式布设于该基板的底面上。
其中,该基板还包含有:复数个镀通孔,是贯穿该基板的顶,底表面,以电性导通该第一及第二导电线路,各该镀通孔内分别具有一填塞物,各该填塞物的材质与各该防焊层的材质相同。
其中,该防焊层的厚度是介于2μm-200μm。
其中,该防焊层外表面粗糙度为Rz值介于0.5μm-10μm。
其中,该第一及第二树脂是为环氧树脂。
其中,该第一及第二树脂是为聚醯胺树脂。
其中,该第一及第二树脂材料是为氰化树脂。
本发明一种具固定防焊层的印刷电路板,其特征在于,包含有:一基板,是由包含有一第一树脂的材料所制成,该基板具有一顶表面及一底表面,该顶表面上布设有一第一导电线路,该线路具有一被遮蔽部分及一暴露部分,该暴露部分的线路具有一根部及一顶部;一第一防焊层,是由一第二树脂所制成,该第二树脂的热膨胀系数实质上与该第一树脂相同,该防焊层具有一第一区域及第二区域,该第一区域是以覆盖该第一导电线路的被遮蔽部分以及形成一平整外表面的方式布设于该基板的顶表面上,该第二区域包覆住该导电线路暴露部分的线路根部。
其中,该第一防焊层的第一区域在以每500mm为一量测长度单位下,其最大厚度与最小厚度的差额是小于或等于10μm。
其中,该基板的底表面亦布设有一第二导电线路,该线路亦具有一被遮蔽部分及一暴露部分,该暴露部分的线路具有一根部及一顶部;一第二防焊层,是由该第二树脂所制成,该防焊层具有一第一区域及第二区域,该第一区域是以覆盖该第二导电线路的被遮蔽部分以及形成一平整外表面的方式布设于该基板的底表面上,该第二区域包覆住该导电线路暴露部分的线路根部。
其中,该基板还包含有:复数个镀通孔,是贯穿该项,底表面,以电性导通该第一及第二导电线路,各该镀通孔内分别具有一填塞物,各该填塞物的材质与各该防焊层的材质相同。
其中,该防焊层第一区域的厚度是介于2μm-200μm。
其中,该防焊层第一区域的外表面粗糙度为Rz值介于0.5μm-10μm。
其中,该第一及第二树脂是为环氧树脂。
其中,该第一及第二树脂是为聚醯胺树脂。
其中,该第一及第二树脂材料是为氰化树脂。
本发明一种具固定防焊层的印刷电路板,其特征在于,包含有:一基板,是由包含有一第一树脂的材料所制成,该基板具有一顶表面及一底表面,该顶表面上布设有一第一导电线路,该线路具有一被遮蔽部分及一暴露部分,该底表面布设有一第二导电线路,该线路具有一被遮蔽部分及一暴露部分;一第一防焊层,是由一第二树脂所制成,该第二树脂的热膨胀系数实质上与该第一树脂相同,该防焊层是以覆盖该第一导电线路的被遮蔽部分以及形成一平整外表面的方式布设于该基板的顶表面上;一第二防焊层,是由该第二树脂所制成,该防焊层是覆盖该第二导电线路的被遮蔽部分以及形成一平整外表面的方式布设于该基板的底表面上;以及复数个镀通孔,是贯穿该基板的顶,底表面,以电性导通该第一及第二导电线路,各该镀通孔内分别具有一填塞物,各该填塞物的材质与各该防焊层的材质相同。
附图说明
为了使审查员能更清楚地了解本发明的详细结构及功效,以下结合实施例并配合附图说明如后,其中:
图1是本发明一较佳实施例的断面示意图;
图2是本发明一较仕实施例将防焊层布设于基板上的制造流程图;
图3是本发明一较佳实施例于图1中A部份的放大示意图;
图4是本发明一较佳实施例配合覆片式晶片封装的断面示意图;
图5是本发明另一较佳实施例配合打线式晶片封装的断面示意图;以及
图6是显示本发明再一较佳实施例中其导电线路的暴露部份与防焊层间的关系的断面示意图。
具体实施方式
首先请参阅图1及图2,本发明一较佳实施例的印刷电路板10,包含有一基板20以及二防焊层40。
该基板20是由纤维材料含浸树脂材料所制成,该纤维材料为为玻璃纤维,而该树脂材料可选自环氧树脂(epoxy resin)、聚酰胺树脂(polyamide resin),氰化树脂(cyanoester resin)等树脂。该基板20具有一顶面22及一底面24,该顶、底面上分别布设有一呈预定图样的导电线路26,该铜导线电路26具有一被遮盖部分261以及一暴露部分263。各该导电线路是由复数个贯穿该基板20的镀通孔28连通。
各该防焊层40,是以热膨胀系数与该基板20所含树脂的热膨胀系数相近或相同的树脂材料所制成,该二防焊层40是贴附于该基板20的顶、底面22、24上,完全覆盖住各该导电线路26的被遮盖部分261,并填塞各该镀通孔28的中空部份,亦即,各该镀通孔28中心的填塞物281,是与该二防焊层40相同材质并一体成型。
该防焊层40在贴附于该基板的表面时,首先是取用一铝箔401,并于其一面上涂覆一半固化(B-staged)的环氧树脂层402,然后将该铝箔贴附于该基板的一表面上,使该环氧树脂层402介于该铝箔401与该基板20的表面间,并以10-40kgw/cm2的压力及140℃-185℃的温度对前述的组合物压叠1.5至3小时,用以使该环氧树脂层402固化,填塞各该镀通孔28以及紧贴于该基板20的表面(如图2A所示)。
继之,于该铝箔表面涂覆一光阻(photo-resist)层403,如图2B所示,随后配合一底片(图中未示)对该光阻层403进行光照曝光,使该光阻层403相对于该导电线路26的遮蔽部分上的位置处产生显影,再以适当的溶剂分别去除未显影处的光阻层及铝箔,使对应于该导电线路的暴露部分的防焊层露出于外,如图2C所示。而后,再以适当的化学溶剂去除剩余的光阻层,如图2D所示。
再继之,利用电浆蚀刻法或激光,将对应于该导电线路的暴露部分上方的防焊层去除,使该基板20上该导电线路26的暴露部分263得以外露,如图2E所示。
最后,则同样以适当的溶剂去除剩余的铝箔,而完成该防焊层40的制造作业,如图2F所示。
该防焊层40的厚度可使介与2μm-200μm,更且其亦具有一相当良好的平整度,进一步言之,该防焊层40可以控制在当以每500mm为一量测长度单位下,其最大厚度tmax与最小厚度tmin的差额是小于或等于10μm,如图3所示,再者,该防焊层亦具有相当良好的微观粗槌度(micro-roughncss),一般而言其Rz值是介于0,5μm-10μm。
由此,当该印刷电路板欲配合覆片式晶片封装时,可选用厚度较大的防焊层,如此可使晶片60紧密地贴附于该防焊层40表面,二者间不必再灌填任何物质,如图4所示。而当该印刷电路板欲配合打线式封装时,则可选用较薄的防焊层并以极少量的粘著剂70,即可将晶片牢固地贴附于印刷电路板上,如此可大大地降低整体封装的厚度,如图5所示。
另外,请再参阅图6,本发明的防焊层40在布设时,可使其具有二区域,其中第一区域401是用来完全覆盖导电线路的被遮盖部份261,而第二区域402则用来仅覆盖导电线路的暴露部份263的根部265,由此,可提升该导电线路暴露部份与该基板20的结合力。此外,由于该暴露部份66的根部661周缘,是被绝缘的防焊层402所包围,暴露的相邻线路间,下易发生离子迁移现象,因此,各线路的间距(Pitch)可进一步缩小,换言之,即可加大印刷电路板的布线密度。
Claims (18)
1.一种具固定防焊层的印刷电路板,其特征在于,包含有:
一基板,是由包含有一第一树脂的材料所制成,该基板具有一顶表面及一底表面,其中该顶表面上布设有一第一导电线路,该线路具有一被遮蔽部份及一暴露部份;
一第一防焊层,是由一第二树脂所制成,该第二树脂的热膨胀系数实质上与该第一树脂相同,该防焊层是以覆盖该第一导电线路的被遮蔽部分以及形成一平整外表面的方式布设于该基板的顶表面上;以及
该防焊层在以每500mn为一量测长度单位下,其最大厚度与最小厚度的差额是小于或等于10μm。
2.依据权利要求1所述的具固定防焊层的印刷电路板,其特征在于,其中,该基板的底面亦布设有一第二导电线路,该线路亦具有一被遮蔽部分及一暴露部分;
一第二防焊层,是由与该第二树脂所制成,该防焊层同样地以覆盖该第二导电线路的被遮蔽部分以及形成一平整外表面的方式布设于该基板的底面上。
3.依据权利要求2所述的具固定防焊层的印刷电路板,其特征在于,其中,该基板还包含有:
复数个镀通孔,是贯穿该基板的顶,底表面,以电性导通该第一及第二导电线路,各该镀通孔内分别具有一填塞物,各该填塞物的材质与各该防焊层的材质相同。
4.依据权利要求1所述的具固定防焊层的印刷电路板,其特征在于,其中,该防焊层的厚度是介于2μm-200μm。
5.依据权利要求1所述的具固定防焊层的印刷电路板,其特征在于,其中,该防焊层外表面粗糙度为Rz值介于0.5μm一10μm。
6.依据权利要求1所述的具固定防焊层的印刷电路板,其特征在于,其中,该第一及第二树脂是为环氧树脂。
7.依据权利要求1所述的具固定防焊层的印刷电路扳,其特征在于,其中,该第一及第二树脂是为聚醯胺树脂。
8.依据权利要求1所述的具固定防焊层的印刷电路板,其特征在于,其中,该第一及第二树脂材料是为氰化树脂。
9.一种具固定防焊层的印刷电路板,其特征在于,包含有:
一基板,是由包含有一第一树脂的材料所制成,该基板具有一顶表面及一底表面,该顶表面上布设有一第一导电线路,该线路具有一被遮蔽部分及一暴露部分,该暴露部分的线路具有一根部及一顶部;
一第一防焊层,是由一第二树脂所制成,该第二树脂的热膨胀系数实质上与该第一树脂相同,该防焊层具有一第一区域及第二区域,该第一区域是以覆盖该第一导电线路的被遮蔽部分以及形成一平整外表面的方式布设于该基板的顶表面上,该第二区域包覆住该导电线路暴露部分的线路根部。
10.依据权利要求9所述的具固定防焊层的印刷电路板,其特征在于,其中,该第一防焊层的第一区域在以每500mm为一量测长度单位下,其最大厚度与最小厚度的差额是小于或等于10μm。
11.依据权利要求9所述的具固定防焊层的印刷电路板,其特征在于,其中,该基板的底表面亦布设有一第二导电线路,该线路亦具有一被遮蔽部分及一暴露部分,该暴露部分的线路具有一根部及一顶部;
一第二防焊层,是由该第二树脂所制成,该防焊层具有一第一区域及第二区域,该第一区域是以覆盖该第二导电线路的被遮蔽部分以及形成一平整外表面的方式布设于该基板的底表面上,该第二区域包覆住该导电线路暴露部分的线路根部。
12.依据权利要求11所述的具固定防焊层的印刷电路板,其特征在于,其中,该基板还包含有:
复数个镀通孔,是贯穿该顶,底表面,以电性导通该第一及第二导电线路,各该镀通孔内分别具有一填塞物,各该填塞物的材质与各该防焊层的材质相同。
13.依据权利要求9所述的具固定防焊层的印刷电路板,其特征在于,其中,该防焊层第一区域的厚度是介于2μm-200μm。
14.依据权利要求9所述的具固定防焊层的印刷电路板,其特征在于,其中,该防焊层第一区域的外表面粗糙度为Rz值介于0.5μm-10μm。
15.依据权利要求9所述的具固定防焊层的印刷电路板,其特征在于,其中,该第一及第二树脂是为环氧树脂。
16.依据权利要求9所述的具固定防焊层的印刷电路板,其特征在于,其中,该第一及第二树脂是为聚醯胺树脂。
17.依据权利要求9所述的具固定防焊层的印刷电路板,其特征在于,其中,该第一及第二树脂材料是为氰化树脂。
18.一种具固定防焊层的印刷电路板,其特征在于,包含有:
一基板,是由包含有一第一树脂的材料所制成,该基板具有一顶表面及一底表面,该顶表面上布设有一第一导电线路,该线路具有一被遮蔽部分及一暴露部分,该底表面布设有一第二导电线路,该线路具有一被遮蔽部分及一暴露部分;
一第一防焊层,是由一第二树脂所制成,该第二树脂的热膨胀系数实质上与该第一树脂相同,该防焊层是以覆盖该第一导电线路的被遮蔽部分以及形成一平整外表面的方式布设于该基板的顶表面上;
一第二防焊层,是由该第二树脂所制成,该防焊层是覆盖该第二导电线路的被遮蔽部分以及形成一平整外表面的方式布设于该基板的底表面上;以及
复数个镀通孔,是贯穿该基板的顶,底表面,以电性导通该第一及第二导电线路,各该镀通孔内分别具有一填塞物,各该填塞物的材质与各该防焊层的材质相同。
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CN02121935A CN1462172A (zh) | 2002-05-27 | 2002-05-27 | 具固定防焊层的印刷电路板 |
EP02255658A EP1367874A3 (en) | 2002-05-27 | 2002-08-14 | Printed circuit board having permanent solder mask |
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CN02121935A CN1462172A (zh) | 2002-05-27 | 2002-05-27 | 具固定防焊层的印刷电路板 |
EP02255658A EP1367874A3 (en) | 2002-05-27 | 2002-08-14 | Printed circuit board having permanent solder mask |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2006015528A1 (fr) * | 2004-08-13 | 2006-02-16 | Mornsun Guangzhou Science & Technology Ltd. | Procede d’amelioration de la qualite de la soudure du petit cable emaille dans les soudures par points |
CN101442875B (zh) * | 2007-11-20 | 2010-09-22 | 英业达股份有限公司 | 具有两层防焊结构的线路板 |
CN101241994B (zh) * | 2004-09-14 | 2011-01-26 | 南亚电路板股份有限公司 | 改善平板式燃料电池的双极板与质子交换膜件接触的方法 |
CN104411087A (zh) * | 2014-11-28 | 2015-03-11 | 江门市宏丰电子科技有限公司 | 一种带台阶孔的pcb板 |
CN112055474A (zh) * | 2019-06-05 | 2020-12-08 | 鹰克国际股份有限公司 | 使用液态防焊材料制作电路板防焊层的方法 |
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TW200533692A (en) * | 2003-11-06 | 2005-10-16 | Showa Denko Kk | Curable polyester having an oxetanyl group at end and process for preparing the same, resist composition, jet printing ink composition, curing methods and uses thereof |
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Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US5626774A (en) * | 1995-12-11 | 1997-05-06 | Alliedsignal Inc. | Solder mask for manufacture of printed circuit boards |
JP3224731B2 (ja) * | 1996-02-05 | 2001-11-05 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 高密度パターンを有する層を形成する方法 |
US5811883A (en) * | 1996-09-30 | 1998-09-22 | Intel Corporation | Design for flip chip joint pad/LGA pad |
JP3346263B2 (ja) * | 1997-04-11 | 2002-11-18 | イビデン株式会社 | プリント配線板及びその製造方法 |
EP1369919A1 (en) * | 2002-05-24 | 2003-12-10 | Ultratera Corporation | Flip chip package |
EP1365450A1 (en) * | 2002-05-24 | 2003-11-26 | Ultratera Corporation | An improved wire-bonded chip on board package |
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2002
- 2002-05-27 CN CN02121935A patent/CN1462172A/zh active Pending
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2006015528A1 (fr) * | 2004-08-13 | 2006-02-16 | Mornsun Guangzhou Science & Technology Ltd. | Procede d’amelioration de la qualite de la soudure du petit cable emaille dans les soudures par points |
CN101241994B (zh) * | 2004-09-14 | 2011-01-26 | 南亚电路板股份有限公司 | 改善平板式燃料电池的双极板与质子交换膜件接触的方法 |
CN101442875B (zh) * | 2007-11-20 | 2010-09-22 | 英业达股份有限公司 | 具有两层防焊结构的线路板 |
CN104411087A (zh) * | 2014-11-28 | 2015-03-11 | 江门市宏丰电子科技有限公司 | 一种带台阶孔的pcb板 |
CN112055474A (zh) * | 2019-06-05 | 2020-12-08 | 鹰克国际股份有限公司 | 使用液态防焊材料制作电路板防焊层的方法 |
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