DE202006019817U1 - Abwinkelbare Leiterplattenstruktur aus zumindest zwei Leiterplattenabschnitten - Google Patents
Abwinkelbare Leiterplattenstruktur aus zumindest zwei Leiterplattenabschnitten Download PDFInfo
- Publication number
- DE202006019817U1 DE202006019817U1 DE202006019817U DE202006019817U DE202006019817U1 DE 202006019817 U1 DE202006019817 U1 DE 202006019817U1 DE 202006019817 U DE202006019817 U DE 202006019817U DE 202006019817 U DE202006019817 U DE 202006019817U DE 202006019817 U1 DE202006019817 U1 DE 202006019817U1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- printed circuit
- conductor
- embedded
- great extent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE202006019817U DE202006019817U1 (de) | 2005-01-24 | 2006-01-24 | Abwinkelbare Leiterplattenstruktur aus zumindest zwei Leiterplattenabschnitten |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200510003369 DE102005003369A1 (de) | 2005-01-24 | 2005-01-24 | Verfahren zur Herstellung einer räumlichen Leiterplattenstruktur aus wenigstens zwei zueinander winkelig angeordneten Leiterplattenabschnitten |
PCT/EP2006/000613 WO2006077164A2 (de) | 2005-01-24 | 2006-01-24 | Verfahren zur herstellung einer abwinkelbaren leiterplattenstruktur aus zumindest zwei leiterplattenabschnitten |
DE202006019817U DE202006019817U1 (de) | 2005-01-24 | 2006-01-24 | Abwinkelbare Leiterplattenstruktur aus zumindest zwei Leiterplattenabschnitten |
Publications (1)
Publication Number | Publication Date |
---|---|
DE202006019817U1 true DE202006019817U1 (de) | 2007-04-12 |
Family
ID=37983107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE202006019817U Expired - Lifetime DE202006019817U1 (de) | 2005-01-24 | 2006-01-24 | Abwinkelbare Leiterplattenstruktur aus zumindest zwei Leiterplattenabschnitten |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE202006019817U1 (de) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011109992A1 (de) * | 2011-08-11 | 2013-02-14 | Eppendorf Ag | Leiterplattenkabelvorrichtung für ein Laborprobengerät und Laborprobengerät |
DE102012216926A1 (de) * | 2012-09-20 | 2014-03-20 | Jumatech Gmbh | Verfahren zur Herstellung eines Leiterplattenelements sowie Leiterplattenelement |
CN109896278A (zh) * | 2019-04-02 | 2019-06-18 | 众联智能设备(深圳)有限公司 | 一种保护板去边料及上料机构 |
CN109896278B (zh) * | 2019-04-02 | 2024-05-10 | 汇美智能装备(深圳)有限公司 | 一种保护板去边料及上料机构 |
-
2006
- 2006-01-24 DE DE202006019817U patent/DE202006019817U1/de not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011109992A1 (de) * | 2011-08-11 | 2013-02-14 | Eppendorf Ag | Leiterplattenkabelvorrichtung für ein Laborprobengerät und Laborprobengerät |
US9011799B2 (en) | 2011-08-11 | 2015-04-21 | Eppendorf Ag | Laboratory sample instrument with printed circuit board cable device |
DE102012216926A1 (de) * | 2012-09-20 | 2014-03-20 | Jumatech Gmbh | Verfahren zur Herstellung eines Leiterplattenelements sowie Leiterplattenelement |
CN109896278A (zh) * | 2019-04-02 | 2019-06-18 | 众联智能设备(深圳)有限公司 | 一种保护板去边料及上料机构 |
CN109896278B (zh) * | 2019-04-02 | 2024-05-10 | 汇美智能装备(深圳)有限公司 | 一种保护板去边料及上料机构 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2006077164A3 (de) | Verfahren zur herstellung einer abwinkelbaren leiterplattenstruktur aus zumindest zwei leiterplattenabschnitten | |
EP1484950A3 (de) | Elektrisches Kontaktierungsverfahren | |
WO2007147602A3 (de) | Verfahren zur herstellung eines schaltungsteils auf einem substrat | |
WO2011064107A3 (de) | Verfahren zum kontaktieren einer beidseitig mit elektrischen kontakten versehenen leiterplatte und solche leiterplatte | |
WO2008102266A3 (en) | Method and apparatus for rapid fabrication of functional printed circuit board | |
EP1753277A3 (de) | Leiterplatte | |
WO2008003287A3 (de) | Elektrisches bauelement mit einem sensorelement, verfahren zur verkapselung eines sensorelements und verfahren zur herstellung einer plattenanordnung | |
TW200638145A (en) | Display apparatus and method of manufacturing the same | |
WO2009037523A8 (en) | An antenna arrangement, a method for manufacturing an antenna arrangement and a printed wiring board for use in an antenna arrangement | |
WO2008157143A3 (en) | Edge connection structure for printed circuit boards | |
TW200733843A (en) | Filter and its coils connecting frame | |
TW200629998A (en) | Printed circuit board and forming method thereof | |
TW200739754A (en) | Microelectronic component with photo-imageable substrate | |
EP1341264A3 (de) | Elektrischer Kontakt | |
TWI256128B (en) | Panel for electro-optical apparatus, method of manufacture thereof, electro-optical apparatus and electronic apparatus | |
WO2006105521A3 (en) | System and method for advanced mezzanine card connection | |
TW200642538A (en) | Printed circuit board attached with connecting plug terminals, electronic equipment and its manufacturing method | |
WO2008155967A1 (ja) | 部品内蔵基板及びその製造方法 | |
TW200723972A (en) | Circuit board module and forming method thereof | |
WO2009153129A3 (de) | Verfahren zur herstellung einer elektronischen baugruppe | |
WO2012064095A3 (ko) | 발광모듈 | |
DE202005001163U1 (de) | Leiterplatte oder Platine mit Heizdraht | |
WO2008135142A3 (de) | Verfahren zur herstellung einer leiterplatte mit einer kavität für die integration von bauteilen und leiterplatte und anwendung | |
ATE451706T1 (de) | Elektrisches/elektronisches installationsgerät | |
DE202006019817U1 (de) | Abwinkelbare Leiterplattenstruktur aus zumindest zwei Leiterplattenabschnitten |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R207 | Utility model specification |
Effective date: 20070516 |
|
R150 | Utility model maintained after payment of first maintenance fee after three years |
Effective date: 20090218 |
|
R151 | Utility model maintained after payment of second maintenance fee after six years |
Effective date: 20120314 |
|
R152 | Utility model maintained after payment of third maintenance fee after eight years | ||
R152 | Utility model maintained after payment of third maintenance fee after eight years |
Effective date: 20140203 |
|
R071 | Expiry of right |