WO2011064107A3 - Verfahren zum kontaktieren einer beidseitig mit elektrischen kontakten versehenen leiterplatte und solche leiterplatte - Google Patents

Verfahren zum kontaktieren einer beidseitig mit elektrischen kontakten versehenen leiterplatte und solche leiterplatte Download PDF

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Publication number
WO2011064107A3
WO2011064107A3 PCT/EP2010/067356 EP2010067356W WO2011064107A3 WO 2011064107 A3 WO2011064107 A3 WO 2011064107A3 EP 2010067356 W EP2010067356 W EP 2010067356W WO 2011064107 A3 WO2011064107 A3 WO 2011064107A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
sides
electric contacts
contacting
Prior art date
Application number
PCT/EP2010/067356
Other languages
English (en)
French (fr)
Other versions
WO2011064107A2 (de
Inventor
Thomas Donauer
David Dussault
Harald Stoyan
Original Assignee
Osram Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Ag filed Critical Osram Ag
Priority to US13/512,573 priority Critical patent/US20120276758A1/en
Priority to CN201080053841.9A priority patent/CN102939799B/zh
Priority to EP10779001A priority patent/EP2505044A2/de
Publication of WO2011064107A2 publication Critical patent/WO2011064107A2/de
Publication of WO2011064107A3 publication Critical patent/WO2011064107A3/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Das Verfahren dient zum Kontaktieren einer auf beiden Seiten (2, 5) mit elektrischen Kontakten (8a-8d) versehenen Leiterplatte (1), wobei die elektrischen Kontakte (8a-8d) auf beiden Seiten (2, 5) der Leiterplatte (1) zumindest teilweise mittels mindestens eines ZIF-Steckers (10a, 10b) kontaktiert werden. Die Leiterplatte (1; 14) ist auf beiden Seiten (2, 5) mit elektrischen Kontakten (8a-8d) versehen, und die elektrischen Kontakte (8a-8d) auf den beiden Seiten der Leiterplatte sind zumindest teilweise mittels mindestens eines ZIF-Steckers (10a, 10b; 13) kontaktiert.
PCT/EP2010/067356 2009-11-26 2010-11-12 Verfahren zum kontaktieren einer beidseitig mit elektrischen kontakten versehenen leiterplatte und solche leiterplatte WO2011064107A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US13/512,573 US20120276758A1 (en) 2009-11-26 2010-11-12 Method for contacting a printed circuit board having electric contacts on both sides and such a printed circuit board
CN201080053841.9A CN102939799B (zh) 2009-11-26 2010-11-12 用于接触在两侧上设有电触点的印刷电路板的方法和这种印刷电路板
EP10779001A EP2505044A2 (de) 2009-11-26 2010-11-12 Verfahren zum kontaktieren einer beidseitig mit elektrischen kontakten versehenen leiterplatte und solche leiterplatte

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009055859A DE102009055859A1 (de) 2009-11-26 2009-11-26 Verfahren zum Kontaktieren einer beidseitig mit elektrischen Kontakten versehenen Leiterplatte und solche Leiterplatte
DE102009055859.4 2009-11-26

Publications (2)

Publication Number Publication Date
WO2011064107A2 WO2011064107A2 (de) 2011-06-03
WO2011064107A3 true WO2011064107A3 (de) 2013-03-07

Family

ID=43927097

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2010/067356 WO2011064107A2 (de) 2009-11-26 2010-11-12 Verfahren zum kontaktieren einer beidseitig mit elektrischen kontakten versehenen leiterplatte und solche leiterplatte

Country Status (5)

Country Link
US (1) US20120276758A1 (de)
EP (1) EP2505044A2 (de)
CN (1) CN102939799B (de)
DE (1) DE102009055859A1 (de)
WO (1) WO2011064107A2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9341355B2 (en) 2008-03-06 2016-05-17 Metrospec Technology, L.L.C. Layered structure for use with high power light emitting diode systems

Families Citing this family (13)

* Cited by examiner, † Cited by third party
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US8851356B1 (en) 2008-02-14 2014-10-07 Metrospec Technology, L.L.C. Flexible circuit board interconnection and methods
US10334735B2 (en) 2008-02-14 2019-06-25 Metrospec Technology, L.L.C. LED lighting systems and methods
US11266014B2 (en) 2008-02-14 2022-03-01 Metrospec Technology, L.L.C. LED lighting systems and method
US8007286B1 (en) 2008-03-18 2011-08-30 Metrospec Technology, Llc Circuit boards interconnected by overlapping plated through holes portions
ITTO20120376A1 (it) * 2012-04-30 2013-10-31 Osram Ag Procedimento di taglio, ad esempio per moduli led lineari flessibili, utensile di taglio ed elemento circuitale corrispondenti
EP2888517A1 (de) * 2012-08-22 2015-07-01 Metrospec Technology, L.L.C. Fahrradbeleuchtungssysteme und -verfahren
US9717141B1 (en) * 2013-01-03 2017-07-25 St. Jude Medical, Atrial Fibrillation Division, Inc. Flexible printed circuit with removable testing portion
DE102013005230A1 (de) * 2013-03-27 2014-10-02 Led-Linear Gmbh Biegbarer LED-Streifen
EP2910850A1 (de) * 2014-02-21 2015-08-26 A.A.G. Stucchi S.r.l. Halterung für LEDs, insbesondere für LED-Module
CN106051644A (zh) * 2015-04-10 2016-10-26 欧司朗股份有限公司 用于发光装置的支承结构及相应方法
DE202018104632U1 (de) * 2018-08-13 2019-11-14 Electro Terminal Gmbh & Co Kg Klemme zur rückseitigen Befestigung an einem LED-Modul
US10849200B2 (en) 2018-09-28 2020-11-24 Metrospec Technology, L.L.C. Solid state lighting circuit with current bias and method of controlling thereof
EP4179254A1 (de) * 2020-07-09 2023-05-17 Signify Holding B.V. Beleuchtungsstreifen

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US4575172A (en) * 1984-04-06 1986-03-11 Molex Incorporated Low insertion force electrical connector with stress controlled contacts
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9341355B2 (en) 2008-03-06 2016-05-17 Metrospec Technology, L.L.C. Layered structure for use with high power light emitting diode systems

Also Published As

Publication number Publication date
EP2505044A2 (de) 2012-10-03
CN102939799A (zh) 2013-02-20
US20120276758A1 (en) 2012-11-01
CN102939799B (zh) 2016-04-13
WO2011064107A2 (de) 2011-06-03
DE102009055859A1 (de) 2011-06-01

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