JP2015526905A - マルチダイ集積回路に使用するための柔軟なサイズのダイ - Google Patents
マルチダイ集積回路に使用するための柔軟なサイズのダイ Download PDFInfo
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Abstract
Description
本開示は、集積回路(IC)に関する。より特定的には、本開示は、複数のダイを用いて形成された集積回路に関する。
マルチダイ集積回路(IC)は、複数のダイを単一のパッケージ内に配置したICの種別である。マルチダイICは、「システムインパッケージ」または「SiP」と呼ばれることもできる。マルチダイICは、マルチダイが個別のICとして、またはプリント回路基板上に実装された個々のICパッケージとして実現されるとした場合に得ることができる速度よりも、ダイが単一のパッケージ内でより早い速度で別のダイと通信できるようにする回路構成を含むことができる。
集積回路(IC)構造体は、第1のダイと第2のダイとを含むことができる。第2のダイは、第1ベースユニットと第2ベースユニットとを含むことができる。第1のベースユニットと第2のベースユニットとの各々は、自己完結型である。いかなる信号も第2のダイ内の第1のベースユニットと前記第2ベースユニットとの間を通過しない。IC構造は、また、インターポーザを含むことができる。インターポーザは、第1のダイを第1のベースユニットに結合する第1の複数のダイ間配線と、第1のダイを第2のベースユニットに結合する第2の複数のダイ間配線と、第2のベースユニットを第1のベースユニットに結合する第3の複数のダイ間配線と、を含むことができる。
明細書は、新規とみなされる1つまたは複数の実施形態の特徴を規定する特許請求の範囲をもって完了するが、1つまたは複数の実施形態は、図面と併せた説明の考慮からよりよく理解されるであろう。必要に応じて、一つあるいは複数の詳細な実施形態が、本明細書に開示される。しかしながら、1つまたは複数の実施形態は単なる例示であることが、理解されるべきである。したがって、本明細書中に開示される特定の構造および機能の詳細は、限定としてではなく、単に特許請求の範囲の基礎として、そして、種々に1つまたは複数の実施形態を、実質的にいずれの適切な詳細な構造にも採用するために、当業者に教示するための代表的な基礎として解釈されるべきである。さらに、本明細書で使用される用語および語句は、限定を意図するものではなく、むしろ本明細書に開示された一つ以上の実施形態の理解可能な説明を提供することを意図する。
Claims (12)
- 第1のダイと、
第1のベースユニットと第2のベースユニットとを備える第2のダイとを備え、
第1のベースユニットと第2のベースユニットのそれぞれは自己完結であり、第2のダイ内において第1のベースユニットと第2のベースユニットとの間をいかなる信号も通過せず、
第1のダイを第1のベースユニットに結合する第1の複数のダイ間配線と、第1のダイを第2のベースユニットに結合する第2の複数のダイ間配線と、第1のベースユニットを第2のベースユニットに結合する第3の複数のダイ間配線とを備えるインポーザをさらに備える、集積回路構造。 - 第1のベースユニットと第2のベースユニットとが同一である、請求項1に記載の集積回路構造。
- 第1のベースユニットと第2のベースユニットとが、回路要素を含まないスクライブ領域によって分離されている、請求項1または2に記載の集積回路構造。
- 第1のダイが第1のジョイント・テスト・アクション・グループ(JTAG)インターフェースを備え、
第1のベースユニットが第2のJTAGインターフェースを備え、
第2のベースユニットが第3のJTAGインターフェースとを備える、請求項1から請求項3のいずれか1項に記載の集積回路構造。 - 第2のJTAGインターフェースが、第2のJTAGインターフェースのテストデータ入力信号が保存されている第1の動作モードと、第2のJTAGインターフェースのテストデータ入力信号が保存されていない第2の動作モードと、を提供する、請求項4に記載の集積回路構造。
- 第3のJTAGインターフェースが、第3のJTAGインターフェースのテストデータ入力信号が保存されている第1の動作モードと、第3のJTAGインターフェースのテストデータ入力信号が保存されていない第2の動作モードと、を提供する、請求項5に記載の集積回路構造。
- 第2のJTAGインターフェースが、
JTAG信号を受信し、出力として、JTAG信号のバッファされたバージョンを生成するように構成されたバッファを備える、請求項4に記載の集積回路構造。 - インターポーザが、第1のベースユニットのテストデータ入力端子を第2のベースユニットのフィードスルーバイパス端子に結合するダイ間配線を備え、前記ダイ間配線は、第1のベースユニットと第2のベースユニットとの間に保存されていない信号パスを形成する、請求項4に記載の集積回路構造。
- 第3のJTAGインターフェースが、
インターポーザのダイ間配線を介して、第2のJTAGインターフェースのテストデータ出力端子に結合された、テストデータ入力端子と、
テストデータ入力端子に結合されており、第3のJTAGインターフェースのための第1の中間テストデータ出力信号として、テストデータ入力端子で受け取った信号の保存されたバージョンの信号を生成するように構成されたレジスタと、
第3のJTAGインターフェースの動作モードに応じて、第2のベースユニットのテストデータ出力端子に、第1の中間テストデータ出力信号、または保存されていない第2の中間テストデータ出力信号を渡すように構成されたセレクタ回路と、を備える、請求項8に記載の集積回路構造。 - 各ベースユニットがジョイント・テスト・アクション・グループ(JTAG)インターフェスを備え、JTAGインターフェースは、
テストデータ入力信号を受け取り、第1の中間テストデータ出力信号として、保存されたバージョンのテストデータ入力信号を生成するJTAGコントローラと、
JTAGコントローラの制御の下で、第2の中間テストデータ出力信号として、フィードスルーバイパス信号あるいはテストデータ入力信号を渡すように構成された第1のセレクタと、
JTAGコントローラの制御の下で、第1の中間テストデータ入力信号あるいは第2の中間テストデータ出力信号を渡すように構成された第2のセレクタと、を備える、請求項1から3のいずれか1項に記載の集積回路構造。 - 第1のベースユニットが、第2の複数のダイ間配線を介して第1のダイに結合された動的構成ポートを備え、
第2のベースユニットが、第3の複数のダイ間配線を介して第2のダイに結合された動的構成ポートとを備える、請求項1から請求項10のいずれか1項に記載の集積回路構造。 - 第1のベースユニットが、複数の動作モードのうちの1つを実施するように構成可能であり、
第2のベースユニットが、第1のベースユニットの動作モードとは独立に、複数の動作モードのうちの1つを実施するように構成可能である、請求項11に記載の集積回路構造。
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