JP2015508509A5 - - Google Patents
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- Publication number
- JP2015508509A5 JP2015508509A5 JP2014547757A JP2014547757A JP2015508509A5 JP 2015508509 A5 JP2015508509 A5 JP 2015508509A5 JP 2014547757 A JP2014547757 A JP 2014547757A JP 2014547757 A JP2014547757 A JP 2014547757A JP 2015508509 A5 JP2015508509 A5 JP 2015508509A5
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- optoelectronic module
- members
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005693 optoelectronics Effects 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 19
- 125000006850 spacer group Chemical group 0.000 claims description 10
- 238000001514 detection method Methods 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims 17
- 230000003595 spectral effect Effects 0.000 claims 4
- 239000000203 mixture Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161579293P | 2011-12-22 | 2011-12-22 | |
| US61/579,293 | 2011-12-22 | ||
| PCT/EP2012/005223 WO2013091829A1 (en) | 2011-12-22 | 2012-12-18 | Opto-electronic modules, in particular flash modules, and method for manufacturing the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015508509A JP2015508509A (ja) | 2015-03-19 |
| JP2015508509A5 true JP2015508509A5 (enExample) | 2016-02-12 |
| JP6338533B2 JP6338533B2 (ja) | 2018-06-06 |
Family
ID=47563330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014547757A Active JP6338533B2 (ja) | 2011-12-22 | 2012-12-18 | 光電子モジュール、特にフラッシュモジュールおよびそれらの製造方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10431571B2 (enExample) |
| EP (1) | EP2795674B1 (enExample) |
| JP (1) | JP6338533B2 (enExample) |
| KR (1) | KR102177372B1 (enExample) |
| CN (1) | CN104106135B (enExample) |
| SG (2) | SG10201605065QA (enExample) |
| TW (1) | TWI590415B (enExample) |
| WO (1) | WO2013091829A1 (enExample) |
Families Citing this family (47)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2870240B2 (ja) | 1991-08-09 | 1999-03-17 | 株式会社デンソー | 内燃機関の空燃比制御装置 |
| TWI481496B (zh) * | 2007-12-19 | 2015-04-21 | Heptagon Micro Optics Pte Ltd | 製造光學元件的方法 |
| DE102011113483B4 (de) * | 2011-09-13 | 2023-10-19 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen einer Mehrzahl von optoelektronischen Bauelementen und optoelektronisches Bauelement |
| KR101888447B1 (ko) * | 2012-05-22 | 2018-08-16 | 엘지디스플레이 주식회사 | 유기 전계 발광 표시 패널의 제조 방법 |
| WO2014098768A1 (en) * | 2012-12-20 | 2014-06-26 | Heptagon Micro Optics Pte. Ltd. | Opto-electronic modules with masking feature for reducing the visibility of interior components |
| CN104123179A (zh) * | 2013-04-29 | 2014-10-29 | 敦南科技股份有限公司 | 中断控制方法及其电子系统 |
| TWI527166B (zh) * | 2013-07-25 | 2016-03-21 | 菱生精密工業股份有限公司 | The package structure of the optical module |
| US9496247B2 (en) * | 2013-08-26 | 2016-11-15 | Optiz, Inc. | Integrated camera module and method of making same |
| KR102138510B1 (ko) * | 2013-08-27 | 2020-07-28 | 엘지전자 주식회사 | 근접 터치 기능을 구비한 전자 장치 및 그 제어 방법 |
| US9746349B2 (en) * | 2013-09-02 | 2017-08-29 | Heptagon Micro Optics Pte. Ltd. | Opto-electronic module including a non-transparent separation member between a light emitting element and a light detecting element |
| US10403671B2 (en) | 2013-12-10 | 2019-09-03 | Ams Sensors Singapore Pte. Ltd. | Wafer-level optical modules and methods for manufacturing the same |
| EP2955759B1 (en) | 2014-06-11 | 2018-09-05 | ams AG | Semiconductor device comprising an emitter of radiation and a photosensor and appertaining production method |
| US9711552B2 (en) | 2014-08-19 | 2017-07-18 | Heptagon Micro Optics Pte. Ltd. | Optoelectronic modules having a silicon substrate, and fabrication methods for such modules |
| KR102309671B1 (ko) * | 2015-01-30 | 2021-10-07 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광 소자 패키지 및 조명 장치 |
| US9606308B2 (en) | 2015-02-27 | 2017-03-28 | International Business Machines Corporation | Three dimensional self-alignment of flip chip assembly using solder surface tension during solder reflow |
| CN104916627B (zh) * | 2015-05-29 | 2019-05-03 | 鸿利智汇集团股份有限公司 | 一种手机拍照闪光灯 |
| CN106200212A (zh) * | 2015-05-29 | 2016-12-07 | 高准精密工业股份有限公司 | 闪光灯装置 |
| US20170047362A1 (en) * | 2015-08-13 | 2017-02-16 | Heptagon Micro Optics Pte. Ltd. | Optoelectronic module with customizable spacers |
| WO2017073776A1 (ja) * | 2015-10-29 | 2017-05-04 | 京セラ株式会社 | 光照射装置および光照射システム |
| CN108886065B (zh) * | 2016-01-20 | 2021-11-16 | 赫普塔冈微光有限公司 | 具有流体可渗透通道的光电子模块和用于制造所述光电子模块的方法 |
| KR102473668B1 (ko) | 2016-03-02 | 2022-12-01 | 삼성전자주식회사 | 발광 소자 실장 기판 및 이를 이용한 발광 패키지 |
| JP2017175004A (ja) | 2016-03-24 | 2017-09-28 | ソニー株式会社 | チップサイズパッケージ、製造方法、電子機器、および内視鏡 |
| TWI735562B (zh) * | 2016-04-08 | 2021-08-11 | 新加坡商新加坡恒立私人有限公司 | 具有孔徑之薄光電模組及其製造 |
| US10461066B2 (en) * | 2016-06-29 | 2019-10-29 | Maxim Integrated Products, Inc. | Structure and method for hybrid optical package with glass top cover |
| US10551596B2 (en) | 2016-06-29 | 2020-02-04 | Ams Sensors Singapore Pte. Ltd. | Optical and optoelectronic assemblies including micro-spacers, and methods of manufacturing the same |
| US10429321B2 (en) * | 2016-08-29 | 2019-10-01 | Kla-Tencor Corporation | Apparatus for high-speed imaging sensor data transfer |
| JP2018060989A (ja) * | 2016-10-04 | 2018-04-12 | 日本特殊陶業株式会社 | 枠体部材、発光装置、およびこれらの製造方法 |
| JP2018085368A (ja) * | 2016-11-21 | 2018-05-31 | 日本特殊陶業株式会社 | 蓋部材、該蓋部材を用いた発光装置、およびこれらの製造方法 |
| CN106764558A (zh) * | 2016-12-07 | 2017-05-31 | 东莞中之光电股份有限公司 | 一种csp照明闪光模组生产工艺 |
| EP3605620B1 (en) | 2017-03-21 | 2024-05-29 | LG Innotek Co., Ltd. | Semiconductor element package |
| DE102017109079B4 (de) * | 2017-04-27 | 2024-02-22 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement und Bauteil mit solch einem Bauelement |
| CN107845627B (zh) * | 2017-09-29 | 2020-02-18 | 深圳奥比中光科技有限公司 | 多接近度检测光传感器 |
| FR3073120A1 (fr) * | 2017-11-02 | 2019-05-03 | Stmicroelectronics (Grenoble 2) Sas | Capot d'encapsulation pour boitier electronique |
| FR3075466B1 (fr) | 2017-12-15 | 2020-05-29 | Stmicroelectronics (Grenoble 2) Sas | Couvercle de boitier de circuit electronique |
| FR3075465B1 (fr) | 2017-12-15 | 2020-03-27 | Stmicroelectronics (Grenoble 2) Sas | Couvercle de boitier de circuit electronique |
| FR3075467B1 (fr) * | 2017-12-15 | 2020-03-27 | Stmicroelectronics (Grenoble 2) Sas | Couvercle de boitier de circuit electronique |
| WO2019132777A1 (en) * | 2017-12-27 | 2019-07-04 | Ams Sensors Singapore Pte. Ltd. | Optoelectronic modules and methods for operating the same |
| CN108364909B (zh) * | 2018-01-19 | 2021-01-26 | 西安中为光电科技有限公司 | 一种具有发射和接收光信号功能的芯片及其制作方法 |
| EP3840546A4 (en) * | 2018-08-24 | 2021-10-06 | Ningbo Sunny Opotech Co., Ltd. | PRINTED CIRCUIT BOARD AND ITS SEMI-FINISHED PRODUCT, FLOOD LAMP, SHOOTING MODULE AND ITS APPLICATION |
| CN109887421A (zh) * | 2018-12-27 | 2019-06-14 | 李宗杰 | 距离传感器放置于电子显示器下的应用 |
| JP6951644B2 (ja) * | 2019-04-23 | 2021-10-20 | 日亜化学工業株式会社 | 発光モジュール及びその製造方法 |
| KR102721974B1 (ko) * | 2019-08-07 | 2024-10-28 | 삼성전자주식회사 | 광 센서 일체형 플래시 led 패키지 |
| JP7558777B2 (ja) * | 2020-12-02 | 2024-10-01 | シャープ福山レーザー株式会社 | 画像表示素子 |
| JP7381903B2 (ja) * | 2021-03-31 | 2023-11-16 | 日亜化学工業株式会社 | 発光装置 |
| US12222240B2 (en) | 2021-06-02 | 2025-02-11 | Luminar Technologies, Inc. | Protective mask for an optical receiver |
| US11953722B2 (en) * | 2021-06-02 | 2024-04-09 | Luminar Technologies, Inc. | Protective mask for an optical receiver |
| US20240102852A1 (en) * | 2022-09-22 | 2024-03-28 | Apple Inc. | Optical Proximity Sensor |
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| US6550949B1 (en) * | 1996-06-13 | 2003-04-22 | Gentex Corporation | Systems and components for enhancing rear vision from a vehicle |
| JP4050802B2 (ja) * | 1996-08-02 | 2008-02-20 | シチズン電子株式会社 | カラー表示装置 |
| US5912872A (en) | 1996-09-27 | 1999-06-15 | Digital Optics Corporation | Integrated optical apparatus providing separated beams on a detector and associated methods |
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| US6617795B2 (en) | 2001-07-26 | 2003-09-09 | Koninklijke Philips Electronics N.V. | Multichip LED package with in-package quantitative and spectral sensing capability and digital signal output |
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| US8779361B2 (en) | 2009-06-30 | 2014-07-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Optical proximity sensor package with molded infrared light rejection barrier and infrared pass components |
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| US9293667B2 (en) * | 2010-08-19 | 2016-03-22 | Soraa, Inc. | System and method for selected pump LEDs with multiple phosphors |
| JP2011204397A (ja) | 2010-03-24 | 2011-10-13 | Sony Corp | 照明装置 |
| US8866064B2 (en) * | 2011-07-26 | 2014-10-21 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Multi-directional proximity sensor |
| TWI567953B (zh) * | 2011-12-20 | 2017-01-21 | 新加坡恒立私人有限公司 | 光電模組及包含該模組之裝置 |
-
2012
- 2012-12-18 KR KR1020147018646A patent/KR102177372B1/ko active Active
- 2012-12-18 CN CN201280063999.3A patent/CN104106135B/zh active Active
- 2012-12-18 SG SG10201605065QA patent/SG10201605065QA/en unknown
- 2012-12-18 JP JP2014547757A patent/JP6338533B2/ja active Active
- 2012-12-18 WO PCT/EP2012/005223 patent/WO2013091829A1/en not_active Ceased
- 2012-12-18 EP EP12816240.1A patent/EP2795674B1/en active Active
- 2012-12-18 SG SG11201403240UA patent/SG11201403240UA/en unknown
- 2012-12-18 US US14/367,352 patent/US10431571B2/en active Active
- 2012-12-21 TW TW101148994A patent/TWI590415B/zh active
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