SG11201403240UA - Opto-electronic modules, in particular flash modules, and method for manufacturing the same - Google Patents

Opto-electronic modules, in particular flash modules, and method for manufacturing the same

Info

Publication number
SG11201403240UA
SG11201403240UA SG11201403240UA SG11201403240UA SG11201403240UA SG 11201403240U A SG11201403240U A SG 11201403240UA SG 11201403240U A SG11201403240U A SG 11201403240UA SG 11201403240U A SG11201403240U A SG 11201403240UA SG 11201403240U A SG11201403240U A SG 11201403240UA
Authority
SG
Singapore
Prior art keywords
modules
opto
manufacturing
same
particular flash
Prior art date
Application number
SG11201403240UA
Inventor
Hartmut Rudmann
Markus Rossi
René Kromhof
Original Assignee
Heptagon Micro Optics Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heptagon Micro Optics Pte Ltd filed Critical Heptagon Micro Optics Pte Ltd
Publication of SG11201403240UA publication Critical patent/SG11201403240UA/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
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    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L2924/30—Technical effects
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    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
SG11201403240UA 2011-12-22 2012-12-18 Opto-electronic modules, in particular flash modules, and method for manufacturing the same SG11201403240UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161579293P 2011-12-22 2011-12-22
PCT/EP2012/005223 WO2013091829A1 (en) 2011-12-22 2012-12-18 Opto-electronic modules, in particular flash modules, and method for manufacturing the same

Publications (1)

Publication Number Publication Date
SG11201403240UA true SG11201403240UA (en) 2014-07-30

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201605065QA SG10201605065QA (en) 2011-12-22 2012-12-18 Opto-electronic modules, in particular flash modules, and method for manufacturing the same
SG11201403240UA SG11201403240UA (en) 2011-12-22 2012-12-18 Opto-electronic modules, in particular flash modules, and method for manufacturing the same

Family Applications Before (1)

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SG10201605065QA SG10201605065QA (en) 2011-12-22 2012-12-18 Opto-electronic modules, in particular flash modules, and method for manufacturing the same

Country Status (8)

Country Link
US (1) US10431571B2 (en)
EP (1) EP2795674B1 (en)
JP (1) JP6338533B2 (en)
KR (1) KR102177372B1 (en)
CN (1) CN104106135B (en)
SG (2) SG10201605065QA (en)
TW (1) TWI590415B (en)
WO (1) WO2013091829A1 (en)

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