KR102177372B1 - 광전자 모듈, 특히 플래시 모듈, 및 그것을 제조하기 위한 방법 - Google Patents

광전자 모듈, 특히 플래시 모듈, 및 그것을 제조하기 위한 방법 Download PDF

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KR102177372B1
KR102177372B1 KR1020147018646A KR20147018646A KR102177372B1 KR 102177372 B1 KR102177372 B1 KR 102177372B1 KR 1020147018646 A KR1020147018646 A KR 1020147018646A KR 20147018646 A KR20147018646 A KR 20147018646A KR 102177372 B1 KR102177372 B1 KR 102177372B1
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optical
light
substrate
wafer
members
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KR20140121398A (ko
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하르트무트 루드만
마르쿠스 로시
레네 크롬호프
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헵타곤 마이크로 옵틱스 피티이. 리미티드
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    • H—ELECTRICITY
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    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, the devices being individual devices of subclass H10D or integrated devices of class H10
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
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    • H01L2224/13101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/732—Location after the connecting process
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    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Stroboscope Apparatuses (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
  • Exposure Control For Cameras (AREA)
KR1020147018646A 2011-12-22 2012-12-18 광전자 모듈, 특히 플래시 모듈, 및 그것을 제조하기 위한 방법 Active KR102177372B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161579293P 2011-12-22 2011-12-22
US61/579,293 2011-12-22
PCT/EP2012/005223 WO2013091829A1 (en) 2011-12-22 2012-12-18 Opto-electronic modules, in particular flash modules, and method for manufacturing the same

Publications (2)

Publication Number Publication Date
KR20140121398A KR20140121398A (ko) 2014-10-15
KR102177372B1 true KR102177372B1 (ko) 2020-11-12

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KR1020147018646A Active KR102177372B1 (ko) 2011-12-22 2012-12-18 광전자 모듈, 특히 플래시 모듈, 및 그것을 제조하기 위한 방법

Country Status (8)

Country Link
US (1) US10431571B2 (enExample)
EP (1) EP2795674B1 (enExample)
JP (1) JP6338533B2 (enExample)
KR (1) KR102177372B1 (enExample)
CN (1) CN104106135B (enExample)
SG (2) SG10201605065QA (enExample)
TW (1) TWI590415B (enExample)
WO (1) WO2013091829A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
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KR20190038934A (ko) * 2016-08-29 2019-04-09 케이엘에이-텐코 코포레이션 고속 이미징 센서 데이터 전송을 위한 장치

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2870240B2 (ja) 1991-08-09 1999-03-17 株式会社デンソー 内燃機関の空燃比制御装置
TWI481496B (zh) * 2007-12-19 2015-04-21 Heptagon Micro Optics Pte Ltd 製造光學元件的方法
DE102011113483B4 (de) * 2011-09-13 2023-10-19 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen einer Mehrzahl von optoelektronischen Bauelementen und optoelektronisches Bauelement
KR101888447B1 (ko) * 2012-05-22 2018-08-16 엘지디스플레이 주식회사 유기 전계 발광 표시 패널의 제조 방법
WO2014098768A1 (en) * 2012-12-20 2014-06-26 Heptagon Micro Optics Pte. Ltd. Opto-electronic modules with masking feature for reducing the visibility of interior components
CN104123179A (zh) * 2013-04-29 2014-10-29 敦南科技股份有限公司 中断控制方法及其电子系统
TWI527166B (zh) * 2013-07-25 2016-03-21 菱生精密工業股份有限公司 The package structure of the optical module
US9496247B2 (en) * 2013-08-26 2016-11-15 Optiz, Inc. Integrated camera module and method of making same
KR102138510B1 (ko) * 2013-08-27 2020-07-28 엘지전자 주식회사 근접 터치 기능을 구비한 전자 장치 및 그 제어 방법
US9746349B2 (en) * 2013-09-02 2017-08-29 Heptagon Micro Optics Pte. Ltd. Opto-electronic module including a non-transparent separation member between a light emitting element and a light detecting element
US10403671B2 (en) 2013-12-10 2019-09-03 Ams Sensors Singapore Pte. Ltd. Wafer-level optical modules and methods for manufacturing the same
EP2955759B1 (en) 2014-06-11 2018-09-05 ams AG Semiconductor device comprising an emitter of radiation and a photosensor and appertaining production method
US9711552B2 (en) 2014-08-19 2017-07-18 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules having a silicon substrate, and fabrication methods for such modules
KR102309671B1 (ko) * 2015-01-30 2021-10-07 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지 및 조명 장치
US9606308B2 (en) 2015-02-27 2017-03-28 International Business Machines Corporation Three dimensional self-alignment of flip chip assembly using solder surface tension during solder reflow
CN104916627B (zh) * 2015-05-29 2019-05-03 鸿利智汇集团股份有限公司 一种手机拍照闪光灯
CN106200212A (zh) * 2015-05-29 2016-12-07 高准精密工业股份有限公司 闪光灯装置
US20170047362A1 (en) * 2015-08-13 2017-02-16 Heptagon Micro Optics Pte. Ltd. Optoelectronic module with customizable spacers
WO2017073776A1 (ja) * 2015-10-29 2017-05-04 京セラ株式会社 光照射装置および光照射システム
CN108886065B (zh) * 2016-01-20 2021-11-16 赫普塔冈微光有限公司 具有流体可渗透通道的光电子模块和用于制造所述光电子模块的方法
KR102473668B1 (ko) 2016-03-02 2022-12-01 삼성전자주식회사 발광 소자 실장 기판 및 이를 이용한 발광 패키지
JP2017175004A (ja) 2016-03-24 2017-09-28 ソニー株式会社 チップサイズパッケージ、製造方法、電子機器、および内視鏡
TWI735562B (zh) * 2016-04-08 2021-08-11 新加坡商新加坡恒立私人有限公司 具有孔徑之薄光電模組及其製造
US10461066B2 (en) * 2016-06-29 2019-10-29 Maxim Integrated Products, Inc. Structure and method for hybrid optical package with glass top cover
US10551596B2 (en) 2016-06-29 2020-02-04 Ams Sensors Singapore Pte. Ltd. Optical and optoelectronic assemblies including micro-spacers, and methods of manufacturing the same
JP2018060989A (ja) * 2016-10-04 2018-04-12 日本特殊陶業株式会社 枠体部材、発光装置、およびこれらの製造方法
JP2018085368A (ja) * 2016-11-21 2018-05-31 日本特殊陶業株式会社 蓋部材、該蓋部材を用いた発光装置、およびこれらの製造方法
CN106764558A (zh) * 2016-12-07 2017-05-31 东莞中之光电股份有限公司 一种csp照明闪光模组生产工艺
EP3605620B1 (en) 2017-03-21 2024-05-29 LG Innotek Co., Ltd. Semiconductor element package
DE102017109079B4 (de) * 2017-04-27 2024-02-22 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Bauteil mit solch einem Bauelement
CN107845627B (zh) * 2017-09-29 2020-02-18 深圳奥比中光科技有限公司 多接近度检测光传感器
FR3073120A1 (fr) * 2017-11-02 2019-05-03 Stmicroelectronics (Grenoble 2) Sas Capot d'encapsulation pour boitier electronique
FR3075466B1 (fr) 2017-12-15 2020-05-29 Stmicroelectronics (Grenoble 2) Sas Couvercle de boitier de circuit electronique
FR3075465B1 (fr) 2017-12-15 2020-03-27 Stmicroelectronics (Grenoble 2) Sas Couvercle de boitier de circuit electronique
FR3075467B1 (fr) * 2017-12-15 2020-03-27 Stmicroelectronics (Grenoble 2) Sas Couvercle de boitier de circuit electronique
WO2019132777A1 (en) * 2017-12-27 2019-07-04 Ams Sensors Singapore Pte. Ltd. Optoelectronic modules and methods for operating the same
CN108364909B (zh) * 2018-01-19 2021-01-26 西安中为光电科技有限公司 一种具有发射和接收光信号功能的芯片及其制作方法
EP3840546A4 (en) * 2018-08-24 2021-10-06 Ningbo Sunny Opotech Co., Ltd. PRINTED CIRCUIT BOARD AND ITS SEMI-FINISHED PRODUCT, FLOOD LAMP, SHOOTING MODULE AND ITS APPLICATION
CN109887421A (zh) * 2018-12-27 2019-06-14 李宗杰 距离传感器放置于电子显示器下的应用
JP6951644B2 (ja) * 2019-04-23 2021-10-20 日亜化学工業株式会社 発光モジュール及びその製造方法
KR102721974B1 (ko) * 2019-08-07 2024-10-28 삼성전자주식회사 광 센서 일체형 플래시 led 패키지
JP7558777B2 (ja) * 2020-12-02 2024-10-01 シャープ福山レーザー株式会社 画像表示素子
JP7381903B2 (ja) * 2021-03-31 2023-11-16 日亜化学工業株式会社 発光装置
US12222240B2 (en) 2021-06-02 2025-02-11 Luminar Technologies, Inc. Protective mask for an optical receiver
US11953722B2 (en) * 2021-06-02 2024-04-09 Luminar Technologies, Inc. Protective mask for an optical receiver
US20240102852A1 (en) * 2022-09-22 2024-03-28 Apple Inc. Optical Proximity Sensor

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011507219A (ja) * 2007-11-27 2011-03-03 ヘプタゴン・オサケ・ユキチュア 封止レンズスタック
JP2011204659A (ja) * 2009-04-27 2011-10-13 Toshiba Lighting & Technology Corp 照明装置

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6550949B1 (en) * 1996-06-13 2003-04-22 Gentex Corporation Systems and components for enhancing rear vision from a vehicle
JP4050802B2 (ja) * 1996-08-02 2008-02-20 シチズン電子株式会社 カラー表示装置
US5912872A (en) 1996-09-27 1999-06-15 Digital Optics Corporation Integrated optical apparatus providing separated beams on a detector and associated methods
US20080136955A1 (en) * 1996-09-27 2008-06-12 Tessera North America. Integrated camera and associated methods
JP4288553B2 (ja) * 2000-07-25 2009-07-01 富士フイルム株式会社 カメラのストロボ装置
US20020113281A1 (en) 2000-12-19 2002-08-22 Cunningham Shawn Jay MEMS device having an actuator with curved electrodes
US6617795B2 (en) 2001-07-26 2003-09-09 Koninklijke Philips Electronics N.V. Multichip LED package with in-package quantitative and spectral sensing capability and digital signal output
JP4750983B2 (ja) * 2001-09-21 2011-08-17 シチズン電子株式会社 双方向光伝送デバイス
US6764158B2 (en) 2001-10-02 2004-07-20 Hewlett-Packard Development Company, L.P. Compact optical sensing system
US7224856B2 (en) * 2001-10-23 2007-05-29 Digital Optics Corporation Wafer based optical chassis and associated methods
US7002546B1 (en) 2002-05-15 2006-02-21 Rockwell Collins, Inc. Luminance and chromaticity control of an LCD backlight
JP4504662B2 (ja) 2003-04-09 2010-07-14 シチズン電子株式会社 Ｌｅｄランプ
US7667766B2 (en) 2003-12-18 2010-02-23 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Adjustable spectrum flash lighting for image acquisition
JP2005241340A (ja) 2004-02-25 2005-09-08 Sharp Corp マルチ測距装置
EP1569276A1 (en) 2004-02-27 2005-08-31 Heptagon OY Micro-optics on optoelectronics
JP2006038572A (ja) * 2004-07-26 2006-02-09 Sharp Corp 反射型エンコーダおよびこの反射型エンコーダを用いた電子機器
JP2006049657A (ja) * 2004-08-06 2006-02-16 Citizen Electronics Co Ltd Ｌｅｄランプ
US7474294B2 (en) * 2004-09-07 2009-01-06 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Use of a plurality of light sensors to regulate a direct-firing backlight for a display
US7679672B2 (en) * 2004-10-14 2010-03-16 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Electronic flash, imaging device and method for producing a flash of light having a wavelength spectrum in the visible range and the infrared range using a fluorescent material
US7259853B2 (en) * 2004-12-22 2007-08-21 Xerox Corporation Systems and methods for augmenting spectral range of an LED spectrophotometer
JP4955953B2 (ja) 2005-07-28 2012-06-20 シャープ株式会社 光半導体装置および電子機器
US7385178B2 (en) * 2005-10-26 2008-06-10 Avago Technologies Ecbu Ip Pte Ltd Reflective encoders with various emitter-detector configurations
US7646974B2 (en) * 2006-09-22 2010-01-12 Sony Ericsson Mobile Communications Ab Color adjustment for camera
EP2017890B1 (en) 2007-06-07 2015-10-07 Cfg S.A. White-light LED-based device
ES2556264T3 (es) 2007-10-09 2016-01-14 Philips Lighting North America Corporation Luminaria basada en unos LED integrados para iluminación general
TW200937642A (en) 2007-12-19 2009-09-01 Heptagon Oy Wafer stack, integrated optical device and method for fabricating the same
TWI505703B (zh) 2007-12-19 2015-10-21 新加坡恒立私人有限公司 光學模組，晶圓等級的封裝及其製造方法
TWI478808B (zh) 2007-12-19 2015-04-01 Heptagon Micro Optics Pte Ltd 製造光學元件的方法
TW201000819A (en) 2008-06-30 2010-01-01 Create Electronic Optical Co Ltd LED illumination device
US8324602B2 (en) * 2009-04-14 2012-12-04 Intersil Americas Inc. Optical sensors that reduce specular reflections
EP2287640B1 (en) * 2009-05-25 2014-08-20 LG Innotek Co., Ltd. Gap member, lens and lighting device having the same
US8779361B2 (en) 2009-06-30 2014-07-15 Avago Technologies General Ip (Singapore) Pte. Ltd. Optical proximity sensor package with molded infrared light rejection barrier and infrared pass components
US8143608B2 (en) 2009-09-10 2012-03-27 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Package-on-package (POP) optical proximity sensor
US9293667B2 (en) * 2010-08-19 2016-03-22 Soraa, Inc. System and method for selected pump LEDs with multiple phosphors
JP2011204397A (ja) 2010-03-24 2011-10-13 Sony Corp 照明装置
US8866064B2 (en) * 2011-07-26 2014-10-21 Avago Technologies General Ip (Singapore) Pte. Ltd. Multi-directional proximity sensor
TWI567953B (zh) * 2011-12-20 2017-01-21 新加坡恒立私人有限公司 光電模組及包含該模組之裝置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011507219A (ja) * 2007-11-27 2011-03-03 ヘプタゴン・オサケ・ユキチュア 封止レンズスタック
JP2011204659A (ja) * 2009-04-27 2011-10-13 Toshiba Lighting & Technology Corp 照明装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190038934A (ko) * 2016-08-29 2019-04-09 케이엘에이-텐코 코포레이션 고속 이미징 센서 데이터 전송을 위한 장치
KR102253085B1 (ko) 2016-08-29 2021-05-14 케이엘에이 코포레이션 고속 이미징 센서 데이터 전송을 위한 장치

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