JP2015502050A5 - - Google Patents

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Publication number
JP2015502050A5
JP2015502050A5 JP2014543563A JP2014543563A JP2015502050A5 JP 2015502050 A5 JP2015502050 A5 JP 2015502050A5 JP 2014543563 A JP2014543563 A JP 2014543563A JP 2014543563 A JP2014543563 A JP 2014543563A JP 2015502050 A5 JP2015502050 A5 JP 2015502050A5
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JP
Japan
Prior art keywords
layer
top surface
group iii
metal
contact
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JP2014543563A
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English (en)
Japanese (ja)
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JP6134730B2 (ja
JP2015502050A (ja
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Priority claimed from US13/302,997 external-priority patent/US8723226B2/en
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Publication of JP2015502050A publication Critical patent/JP2015502050A/ja
Publication of JP2015502050A5 publication Critical patent/JP2015502050A5/ja
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Publication of JP6134730B2 publication Critical patent/JP6134730B2/ja
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JP2014543563A 2011-11-22 2012-11-21 逆分極キャップを備えたエンハンスメントモードｉｉｉ族‐ｎ高電子移動度トランジスタ Active JP6134730B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/302,997 2011-11-22
US13/302,997 US8723226B2 (en) 2011-11-22 2011-11-22 Manufacturable enhancement-mode group III-N HEMT with a reverse polarization cap
PCT/US2012/066296 WO2013078341A1 (en) 2011-11-22 2012-11-21 Enhancement-mode group iii-n high electronic mobility transistor with reverse polarization cap

Publications (3)

Publication Number Publication Date
JP2015502050A JP2015502050A (ja) 2015-01-19
JP2015502050A5 true JP2015502050A5 (enExample) 2016-01-14
JP6134730B2 JP6134730B2 (ja) 2017-05-24

Family

ID=48425951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014543563A Active JP6134730B2 (ja) 2011-11-22 2012-11-21 逆分極キャップを備えたエンハンスメントモードｉｉｉ族‐ｎ高電子移動度トランジスタ

Country Status (4)

Country Link
US (1) US8723226B2 (enExample)
JP (1) JP6134730B2 (enExample)
CN (1) CN103930995B (enExample)
WO (1) WO2013078341A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9111904B2 (en) * 2011-11-29 2015-08-18 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate breakdown voltage improvement for group III-nitride on a silicon substrate
TWI566328B (zh) * 2013-07-29 2017-01-11 高效電源轉換公司 具有用於產生附加構件之多晶矽層的氮化鎵電晶體
US9799524B2 (en) * 2015-07-17 2017-10-24 Avago Technologies General Ip (Singapore) Pte. Ltd. Extended drain MOS device for FDSOI devices
WO2017051530A1 (ja) * 2015-09-25 2017-03-30 パナソニックＩｐマネジメント株式会社 半導体装置
US9871067B2 (en) * 2015-11-17 2018-01-16 Taiwan Semiconductor Manufacturing Co., Ltd. Infrared image sensor component
CN105789296B (zh) * 2015-12-29 2019-01-25 中国电子科技集团公司第五十五研究所 一种铝镓氮化合物/氮化镓高电子迁移率晶体管
CN105789047B (zh) * 2016-05-13 2018-12-18 中国科学院半导体研究所 一种增强型AlGaN/GaN高电子迁移率晶体管的制备方法
US10270239B2 (en) 2016-06-15 2019-04-23 Texas Instruments Incorporated Overvoltage protection and short-circuit withstanding for gallium nitride devices
WO2018004654A1 (en) * 2016-07-01 2018-01-04 Intel Corporation Group iii-n transistors including source to channel heterostructure design
US10269947B1 (en) 2018-03-09 2019-04-23 Semiconductor Components Industries, Llc Electronic device including a transistor including III-V materials and a process of forming the same
US10680092B2 (en) 2018-10-01 2020-06-09 Semiconductor Components Industries, Llc Electronic device including a transistor with a non-uniform 2DEG
TWI685968B (zh) 2018-11-23 2020-02-21 財團法人工業技術研究院 增強型氮化鎵電晶體元件及其製造方法
EP3891814A1 (en) * 2018-12-07 2021-10-13 MACOM Technology Solutions Holdings, Inc. Gate metal formation on gallium nitride or aluminum gallium nitride
CN110429132B (zh) * 2019-08-16 2023-05-09 广东省半导体产业技术研究院 栅极结构、栅极结构的制造方法和增强型半导体器件
US10797168B1 (en) 2019-10-28 2020-10-06 Semiconductor Components Industries, Llc Electronic device including a high electron mobility transistor that includes a barrier layer having different portions
JP7609404B2 (ja) * 2020-12-03 2025-01-07 国立大学法人 名古屋工業大学 半導体デバイスおよび当該半導体デバイスの製造方法
CN115939200A (zh) * 2021-08-04 2023-04-07 中国科学院微电子研究所 GaN基增强型功率晶体管

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3272259B2 (ja) * 1997-03-25 2002-04-08 株式会社東芝 半導体装置
JP4022708B2 (ja) * 2000-06-29 2007-12-19 日本電気株式会社 半導体装置
CN100388509C (zh) * 2003-01-29 2008-05-14 株式会社东芝 功率半导体器件
JP2004335960A (ja) * 2003-05-12 2004-11-25 Kri Inc 電界効果型トランジスタ
US7700973B2 (en) * 2003-10-10 2010-04-20 The Regents Of The University Of California GaN/AlGaN/GaN dispersion-free high electron mobility transistors
JP4041075B2 (ja) * 2004-02-27 2008-01-30 株式会社東芝 半導体装置
US20070018199A1 (en) * 2005-07-20 2007-01-25 Cree, Inc. Nitride-based transistors and fabrication methods with an etch stop layer
EP1932181A4 (en) 2005-09-16 2009-06-17 Univ California N-polar aluminum gallium nitride/gallium nitride enhancement-mode field effect transistor
JP2007109830A (ja) * 2005-10-12 2007-04-26 Univ Nagoya 電界効果トランジスタ
JP2007165719A (ja) * 2005-12-15 2007-06-28 Nippon Telegr & Teleph Corp <Ntt> 窒化物半導体素子
US7728356B2 (en) 2007-06-01 2010-06-01 The Regents Of The University Of California P-GaN/AlGaN/AlN/GaN enhancement-mode field effect transistor
US7859021B2 (en) * 2007-08-29 2010-12-28 Sanken Electric Co., Ltd. Field-effect semiconductor device
US7915643B2 (en) * 2007-09-17 2011-03-29 Transphorm Inc. Enhancement mode gallium nitride power devices
WO2009076076A2 (en) 2007-12-10 2009-06-18 Transphorm Inc. Insulated gate e-mode transistors
US8076699B2 (en) 2008-04-02 2011-12-13 The Hong Kong Univ. Of Science And Technology Integrated HEMT and lateral field-effect rectifier combinations, methods, and systems
JP2009253126A (ja) * 2008-04-09 2009-10-29 Sanken Electric Co Ltd 半導体装置
JP2010103425A (ja) 2008-10-27 2010-05-06 Sanken Electric Co Ltd 窒化物半導体装置
US20100270591A1 (en) * 2009-04-27 2010-10-28 University Of Seoul Industry Cooperation Foundation High-electron mobility transistor

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