CN103930995B - 具有反向极化帽的增强模式iii‑n族高电子迁移率晶体管 - Google Patents

具有反向极化帽的增强模式iii‑n族高电子迁移率晶体管 Download PDF

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CN103930995B
CN103930995B CN201280055358.3A CN201280055358A CN103930995B CN 103930995 B CN103930995 B CN 103930995B CN 201280055358 A CN201280055358 A CN 201280055358A CN 103930995 B CN103930995 B CN 103930995B
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barrier layer
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CN103930995A (zh
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萨恩迪普·巴尔
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Texas Instruments Inc
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Texas Instruments Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/015—Manufacture or treatment of FETs having heterojunction interface channels or heterojunction gate electrodes, e.g. HEMT
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
    • H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
    • H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
    • H10D30/475—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/602—Heterojunction gate electrodes for FETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
    • H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN

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  • Junction Field-Effect Transistors (AREA)
CN201280055358.3A 2011-11-22 2012-11-21 具有反向极化帽的增强模式iii‑n族高电子迁移率晶体管 Active CN103930995B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/302,997 2011-11-22
US13/302,997 US8723226B2 (en) 2011-11-22 2011-11-22 Manufacturable enhancement-mode group III-N HEMT with a reverse polarization cap
PCT/US2012/066296 WO2013078341A1 (en) 2011-11-22 2012-11-21 Enhancement-mode group iii-n high electronic mobility transistor with reverse polarization cap

Publications (2)

Publication Number Publication Date
CN103930995A CN103930995A (zh) 2014-07-16
CN103930995B true CN103930995B (zh) 2018-03-20

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US (1) US8723226B2 (enExample)
JP (1) JP6134730B2 (enExample)
CN (1) CN103930995B (enExample)
WO (1) WO2013078341A1 (enExample)

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US9111904B2 (en) * 2011-11-29 2015-08-18 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate breakdown voltage improvement for group III-nitride on a silicon substrate
TWI566328B (zh) 2013-07-29 2017-01-11 高效電源轉換公司 具有用於產生附加構件之多晶矽層的氮化鎵電晶體
US9799524B2 (en) * 2015-07-17 2017-10-24 Avago Technologies General Ip (Singapore) Pte. Ltd. Extended drain MOS device for FDSOI devices
WO2017051530A1 (ja) * 2015-09-25 2017-03-30 パナソニックＩｐマネジメント株式会社 半導体装置
US9871067B2 (en) * 2015-11-17 2018-01-16 Taiwan Semiconductor Manufacturing Co., Ltd. Infrared image sensor component
CN105789296B (zh) * 2015-12-29 2019-01-25 中国电子科技集团公司第五十五研究所 一种铝镓氮化合物/氮化镓高电子迁移率晶体管
CN105789047B (zh) * 2016-05-13 2018-12-18 中国科学院半导体研究所 一种增强型AlGaN/GaN高电子迁移率晶体管的制备方法
US10270239B2 (en) 2016-06-15 2019-04-23 Texas Instruments Incorporated Overvoltage protection and short-circuit withstanding for gallium nitride devices
US10991817B2 (en) 2016-07-01 2021-04-27 Intel Corporation Group III-N transistors including source to channel heterostructure design
US10269947B1 (en) 2018-03-09 2019-04-23 Semiconductor Components Industries, Llc Electronic device including a transistor including III-V materials and a process of forming the same
US10680092B2 (en) 2018-10-01 2020-06-09 Semiconductor Components Industries, Llc Electronic device including a transistor with a non-uniform 2DEG
TWI685968B (zh) 2018-11-23 2020-02-21 財團法人工業技術研究院 增強型氮化鎵電晶體元件及其製造方法
WO2020118185A1 (en) * 2018-12-07 2020-06-11 Macom Technology Solutions Holdings, Inc. Gate metal formation on gallium nitride or aluminum gallium nitride
CN110429132B (zh) * 2019-08-16 2023-05-09 广东省半导体产业技术研究院 栅极结构、栅极结构的制造方法和增强型半导体器件
US10797168B1 (en) 2019-10-28 2020-10-06 Semiconductor Components Industries, Llc Electronic device including a high electron mobility transistor that includes a barrier layer having different portions
JP7609404B2 (ja) * 2020-12-03 2025-01-07 国立大学法人 名古屋工業大学 半導体デバイスおよび当該半導体デバイスの製造方法
CN115939200A (zh) * 2021-08-04 2023-04-07 中国科学院微电子研究所 GaN基增强型功率晶体管

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US6072203A (en) * 1997-03-25 2000-06-06 Kabushiki Kaisha Toshiba Semiconductor device
CN100388509C (zh) * 2003-01-29 2008-05-14 株式会社东芝 功率半导体器件
US20100270591A1 (en) * 2009-04-27 2010-10-28 University Of Seoul Industry Cooperation Foundation High-electron mobility transistor
US20110062438A1 (en) * 2007-08-29 2011-03-17 Sanken Electric Co., Ltd. Field-Effect Semiconductor Device

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JP4022708B2 (ja) * 2000-06-29 2007-12-19 日本電気株式会社 半導体装置
JP2004335960A (ja) * 2003-05-12 2004-11-25 Kri Inc 電界効果型トランジスタ
US7700973B2 (en) * 2003-10-10 2010-04-20 The Regents Of The University Of California GaN/AlGaN/GaN dispersion-free high electron mobility transistors
JP4041075B2 (ja) * 2004-02-27 2008-01-30 株式会社東芝 半導体装置
US20070018199A1 (en) * 2005-07-20 2007-01-25 Cree, Inc. Nitride-based transistors and fabrication methods with an etch stop layer
CA2622750C (en) 2005-09-16 2015-11-03 The Regents Of The University Of California N-polar aluminum gallium nitride/gallium nitride enhancement-mode field effect transistor
JP2007109830A (ja) * 2005-10-12 2007-04-26 Univ Nagoya 電界効果トランジスタ
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JP2009253126A (ja) * 2008-04-09 2009-10-29 Sanken Electric Co Ltd 半導体装置
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US6072203A (en) * 1997-03-25 2000-06-06 Kabushiki Kaisha Toshiba Semiconductor device
CN100388509C (zh) * 2003-01-29 2008-05-14 株式会社东芝 功率半导体器件
US20110062438A1 (en) * 2007-08-29 2011-03-17 Sanken Electric Co., Ltd. Field-Effect Semiconductor Device
US20100270591A1 (en) * 2009-04-27 2010-10-28 University Of Seoul Industry Cooperation Foundation High-electron mobility transistor

Also Published As

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JP6134730B2 (ja) 2017-05-24
US8723226B2 (en) 2014-05-13
CN103930995A (zh) 2014-07-16
JP2015502050A (ja) 2015-01-19
WO2013078341A1 (en) 2013-05-30
US20130126889A1 (en) 2013-05-23

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