JP2015045094A5 - - Google Patents

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Publication number
JP2015045094A5
JP2015045094A5 JP2014243538A JP2014243538A JP2015045094A5 JP 2015045094 A5 JP2015045094 A5 JP 2015045094A5 JP 2014243538 A JP2014243538 A JP 2014243538A JP 2014243538 A JP2014243538 A JP 2014243538A JP 2015045094 A5 JP2015045094 A5 JP 2015045094A5
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tin alloy
free
alloy composition
interconnect bumps
tin
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JP2014243538A
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English (en)
Japanese (ja)
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JP2015045094A (ja
JP6140132B2 (ja
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JP2014243538A 2008-12-31 2014-12-01 鉛を含まないスズ合金電気めっき組成物および方法 Active JP6140132B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US20404408P 2008-12-31 2008-12-31
US61/204,044 2008-12-31

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2010000141A Division JP2010174373A (ja) 2008-12-31 2010-01-04 鉛を含まないスズ合金電気めっき組成物および方法

Related Child Applications (1)

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JP2016052176A Division JP6169211B2 (ja) 2008-12-31 2016-03-16 鉛を含まないスズ合金電気めっき組成物および方法

Publications (3)

Publication Number Publication Date
JP2015045094A JP2015045094A (ja) 2015-03-12
JP2015045094A5 true JP2015045094A5 (enExample) 2017-01-12
JP6140132B2 JP6140132B2 (ja) 2017-05-31

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Family Applications (3)

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JP2010000141A Pending JP2010174373A (ja) 2008-12-31 2010-01-04 鉛を含まないスズ合金電気めっき組成物および方法
JP2014243538A Active JP6140132B2 (ja) 2008-12-31 2014-12-01 鉛を含まないスズ合金電気めっき組成物および方法
JP2016052176A Active JP6169211B2 (ja) 2008-12-31 2016-03-16 鉛を含まないスズ合金電気めっき組成物および方法

Family Applications Before (1)

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JP2010000141A Pending JP2010174373A (ja) 2008-12-31 2010-01-04 鉛を含まないスズ合金電気めっき組成物および方法

Family Applications After (1)

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JP2016052176A Active JP6169211B2 (ja) 2008-12-31 2016-03-16 鉛を含まないスズ合金電気めっき組成物および方法

Country Status (6)

Country Link
US (1) US7968444B2 (enExample)
EP (1) EP2221396A1 (enExample)
JP (3) JP2010174373A (enExample)
KR (1) KR101651920B1 (enExample)
CN (1) CN102051645B (enExample)
TW (2) TWI402380B (enExample)

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US20160298249A1 (en) * 2014-09-30 2016-10-13 Rohm And Haas Electronic Materials Llc Cyanide-free electroplating baths for white bronze based on copper (i) ions
US9829448B2 (en) 2014-10-30 2017-11-28 Bruker Jv Israel Ltd. Measurement of small features using XRF
CN104593835B (zh) * 2015-02-04 2017-10-24 广东羚光新材料股份有限公司 用于片式元器件端电极电镀的中性镀锡液
US10053793B2 (en) 2015-07-09 2018-08-21 Lam Research Corporation Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
JP6432667B2 (ja) * 2017-01-31 2018-12-05 三菱マテリアル株式会社 錫合金めっき液
JP6555455B1 (ja) * 2017-11-01 2019-08-07 日本製鉄株式会社 電気Ｓｎめっき鋼板
CN107723760A (zh) * 2017-11-28 2018-02-23 江苏澳光电子有限公司 一种Au‑Ag合金表面电镀液及其应用
PT3578693T (pt) * 2018-06-08 2020-06-16 Atotech Deutschland Gmbh Composição aquosa para a deposição de uma liga de estanho e prata e método de deposição eletrolítica dessa liga
US20200032409A1 (en) * 2018-07-25 2020-01-30 The Boeing Company Compositions and Methods for Electrodepositing Tin-Bismuth Alloys on Metallic Substrates
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