JP2018518368A5 - - Google Patents

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Publication number
JP2018518368A5
JP2018518368A5 JP2017557168A JP2017557168A JP2018518368A5 JP 2018518368 A5 JP2018518368 A5 JP 2018518368A5 JP 2017557168 A JP2017557168 A JP 2017557168A JP 2017557168 A JP2017557168 A JP 2017557168A JP 2018518368 A5 JP2018518368 A5 JP 2018518368A5
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JP
Japan
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weight
residual
solder alloy
solder
optionally
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JP2017557168A
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English (en)
Japanese (ja)
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JP2018518368A (ja
JP6730999B2 (ja
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Priority claimed from PCT/US2016/030915 external-priority patent/WO2016179358A1/en
Publication of JP2018518368A publication Critical patent/JP2018518368A/ja
Publication of JP2018518368A5 publication Critical patent/JP2018518368A5/ja
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JP2017557168A 2015-05-05 2016-05-05 過酷な環境での電子機器用途のための高信頼性無鉛はんだ合金 Active JP6730999B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562157302P 2015-05-05 2015-05-05
US62/157,302 2015-05-05
PCT/US2016/030915 WO2016179358A1 (en) 2015-05-05 2016-05-05 High reliability lead-free solder alloys for harsh environment electronics applications
US15/147,137 2016-05-05
US15/147,137 US11229979B2 (en) 2015-05-05 2016-05-05 High reliability lead-free solder alloys for harsh environment electronics applications

Publications (3)

Publication Number Publication Date
JP2018518368A JP2018518368A (ja) 2018-07-12
JP2018518368A5 true JP2018518368A5 (enExample) 2019-05-30
JP6730999B2 JP6730999B2 (ja) 2020-07-29

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Family Applications (1)

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JP2017557168A Active JP6730999B2 (ja) 2015-05-05 2016-05-05 過酷な環境での電子機器用途のための高信頼性無鉛はんだ合金

Country Status (5)

Country Link
US (4) US11229979B2 (enExample)
JP (1) JP6730999B2 (enExample)
KR (2) KR102685941B1 (enExample)
MY (2) MY186064A (enExample)
WO (1) WO2016179358A1 (enExample)

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KR102187085B1 (ko) * 2019-01-24 2020-12-04 주식회사 경동엠텍 고온 및 진동환경에 적합한 무연솔더 합금 조성물 및 그 제조방법
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TWI742813B (zh) 2019-09-02 2021-10-11 美商阿爾發金屬化工公司 高溫超高可靠性合金
KR20240019350A (ko) * 2021-06-11 2024-02-14 인듐 코포레이션 혼합 땜납 합금 분말을 갖는 고 신뢰성 무연 땜납 페이스트
JP7079889B1 (ja) 2021-11-30 2022-06-02 株式会社タムラ製作所 はんだ合金、はんだ接合材、ソルダペースト及び半導体パッケージ
JP7133739B1 (ja) 2021-11-30 2022-09-08 株式会社タムラ製作所 接合部、電子回路基板及び半導体パッケージ
WO2024034689A1 (ja) 2022-08-12 2024-02-15 千住金属工業株式会社 はんだ合金、はんだペースト及びはんだ継手
CN119677613A (zh) * 2022-08-12 2025-03-21 千住金属工业株式会社 软钎料合金、焊膏和钎焊接头
DE112023001173T5 (de) * 2022-11-07 2024-12-19 Fuji Electric Co., Ltd. Lötmaterial
WO2025131329A1 (en) 2023-12-20 2025-06-26 Alpha Assembly Solutions Inc. Solder joint comprising a tin alloy and an encapsulant comprising silica particles in an epoxy resin, and electronic device
JP7640921B1 (ja) * 2024-07-23 2025-03-06 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置
JP7810934B1 (ja) * 2025-07-25 2026-02-04 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、はんだボール、はんだプリフォーム、及びはんだ継手

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