JP2013525121A5 - - Google Patents
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- Publication number
- JP2013525121A5 JP2013525121A5 JP2013509074A JP2013509074A JP2013525121A5 JP 2013525121 A5 JP2013525121 A5 JP 2013525121A5 JP 2013509074 A JP2013509074 A JP 2013509074A JP 2013509074 A JP2013509074 A JP 2013509074A JP 2013525121 A5 JP2013525121 A5 JP 2013525121A5
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- solder
- solder alloy
- compound layer
- interface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910045601 alloy Inorganic materials 0.000 claims 67
- 239000000956 alloy Substances 0.000 claims 67
- 229910000679 solder Inorganic materials 0.000 claims 63
- 229910000765 intermetallic Inorganic materials 0.000 claims 20
- 229910052802 copper Inorganic materials 0.000 claims 13
- 238000000034 method Methods 0.000 claims 12
- 239000000843 powder Substances 0.000 claims 10
- 229910052709 silver Inorganic materials 0.000 claims 10
- 239000007790 solid phase Substances 0.000 claims 5
- 229910052782 aluminium Inorganic materials 0.000 claims 4
- 229910052733 gallium Inorganic materials 0.000 claims 4
- 229910052732 germanium Inorganic materials 0.000 claims 4
- 229910052737 gold Inorganic materials 0.000 claims 4
- 229910052738 indium Inorganic materials 0.000 claims 4
- 229910052748 manganese Inorganic materials 0.000 claims 4
- 229910052759 nickel Inorganic materials 0.000 claims 4
- 229910052763 palladium Inorganic materials 0.000 claims 4
- 229910052698 phosphorus Inorganic materials 0.000 claims 4
- 229910052697 platinum Inorganic materials 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 229910017944 Ag—Cu Inorganic materials 0.000 claims 2
- 229910016331 Bi—Ag Inorganic materials 0.000 claims 2
- 229910016334 Bi—In Inorganic materials 0.000 claims 2
- 229910001128 Sn alloy Inorganic materials 0.000 claims 2
- 229910020836 Sn-Ag Inorganic materials 0.000 claims 2
- 229910020830 Sn-Bi Inorganic materials 0.000 claims 2
- 229910020888 Sn-Cu Inorganic materials 0.000 claims 2
- 229910020935 Sn-Sb Inorganic materials 0.000 claims 2
- 229910020994 Sn-Zn Inorganic materials 0.000 claims 2
- 229910020988 Sn—Ag Inorganic materials 0.000 claims 2
- 229910018728 Sn—Bi Inorganic materials 0.000 claims 2
- 229910019204 Sn—Cu Inorganic materials 0.000 claims 2
- 229910018956 Sn—In Inorganic materials 0.000 claims 2
- 229910008757 Sn—Sb Inorganic materials 0.000 claims 2
- 229910009069 Sn—Zn Inorganic materials 0.000 claims 2
- 229910052787 antimony Inorganic materials 0.000 claims 2
- 229910052797 bismuth Inorganic materials 0.000 claims 2
- 230000004907 flux Effects 0.000 claims 2
- 239000004615 ingredient Substances 0.000 claims 2
- 229910052725 zinc Inorganic materials 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/772,897 | 2010-05-03 | ||
| US12/772,897 US9017446B2 (en) | 2010-05-03 | 2010-05-03 | Mixed alloy solder paste |
| PCT/US2011/031107 WO2011139454A1 (en) | 2010-05-03 | 2011-04-04 | Mixed alloy solder paste |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013525121A JP2013525121A (ja) | 2013-06-20 |
| JP2013525121A5 true JP2013525121A5 (enExample) | 2014-05-22 |
| JP5938032B2 JP5938032B2 (ja) | 2016-06-22 |
Family
ID=44259596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013509074A Active JP5938032B2 (ja) | 2010-05-03 | 2011-04-04 | 混合合金はんだペースト |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US9017446B2 (enExample) |
| JP (1) | JP5938032B2 (enExample) |
| KR (1) | KR101820986B1 (enExample) |
| CN (1) | CN102892549B (enExample) |
| DE (1) | DE112011101556B4 (enExample) |
| MY (1) | MY158123A (enExample) |
| WO (1) | WO2011139454A1 (enExample) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9017446B2 (en) | 2010-05-03 | 2015-04-28 | Indium Corporation | Mixed alloy solder paste |
| US11189537B2 (en) * | 2012-03-21 | 2021-11-30 | Infineon Technologies Ag | Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit |
| JP5635561B2 (ja) * | 2012-06-21 | 2014-12-03 | 株式会社タムラ製作所 | はんだ組成物 |
| US9402321B2 (en) * | 2012-10-15 | 2016-07-26 | Senju Metal Industry Co., Ltd. | Soldering method using a low-temperature solder paste |
| US9272371B2 (en) * | 2013-05-30 | 2016-03-01 | Agc Automotive Americas R&D, Inc. | Solder joint for an electrical conductor and a window pane including same |
| EP3078446B1 (en) * | 2013-12-03 | 2020-02-05 | Hiroshima University | Method of manufacturing a solder material and joining structure |
| US10376995B2 (en) | 2013-12-13 | 2019-08-13 | Schlumberger Technology Corporation | Tin-antimony-based high temperature solder for downhole components |
| CN104668810B (zh) * | 2015-01-29 | 2016-09-07 | 苏州天兼新材料科技有限公司 | 一种新型无铅焊接材料及其助焊剂的制备方法 |
| CN107530834A (zh) * | 2015-03-10 | 2018-01-02 | 铟泰公司 | 混合合金焊料膏 |
| CN107405729A (zh) * | 2015-03-31 | 2017-11-28 | 住友金属矿山股份有限公司 | 焊膏 |
| EP3291942B1 (en) * | 2015-05-05 | 2021-03-24 | Indium Corporation | High reliability lead-free solder alloys for harsh environment electronics applications |
| CN105140209A (zh) * | 2015-06-26 | 2015-12-09 | 江苏师范大学 | 一种用于3D封装芯片堆叠的In基互连材料 |
| CN105234579B (zh) * | 2015-10-21 | 2017-09-29 | 张家港市东大工业技术研究院 | 一种添加抗氧化颗粒的低熔点焊膏 |
| US10376997B2 (en) | 2016-06-23 | 2019-08-13 | Purdue Research Foundation | Transient liquid phase bonding process and assemblies formed thereby |
| TWI647316B (zh) * | 2016-07-15 | 2019-01-11 | Ｊｘ金屬股份有限公司 | Solder alloy |
| US10263362B2 (en) | 2017-03-29 | 2019-04-16 | Agc Automotive Americas R&D, Inc. | Fluidically sealed enclosure for window electrical connections |
| US10849192B2 (en) | 2017-04-26 | 2020-11-24 | Agc Automotive Americas R&D, Inc. | Enclosure assembly for window electrical connections |
| CN108857135A (zh) * | 2018-03-12 | 2018-11-23 | 深圳市鑫富锦新材料有限公司 | 一种混合合金焊料膏 |
| US10888958B2 (en) * | 2018-05-29 | 2021-01-12 | Indium Corporation | Hybrid high temperature lead-free solder preform |
| CN111132794B (zh) * | 2018-08-31 | 2021-08-17 | Ｊｘ金属株式会社 | 焊料合金 |
| US12030139B2 (en) | 2018-10-31 | 2024-07-09 | Robert Bosch Gmbh | Sn—Cu mixed alloy solder paste, method of making the same and soldering method |
| US11267080B2 (en) * | 2019-05-09 | 2022-03-08 | Indium Corporation | Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders |
| CN110936062A (zh) * | 2019-12-18 | 2020-03-31 | 陕西易莱德新材料科技有限公司 | 一种添加有铂金属的焊料及其制备方法 |
| JPWO2022153703A1 (enExample) * | 2021-01-18 | 2022-07-21 | ||
| US20230241725A1 (en) * | 2022-01-19 | 2023-08-03 | Ning-Cheng Lee | Solder pastes and methods of using the same |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4767471A (en) * | 1986-10-03 | 1988-08-30 | Texas Instruments Incorporated | Delayed reflow alloy mix solder paste |
| JPH01266987A (ja) * | 1988-04-19 | 1989-10-24 | Senju Metal Ind Co Ltd | クリームはんだおよびクリームはんだのはんだ付け方法 |
| JP2539445Y2 (ja) * | 1990-08-09 | 1997-06-25 | アイワ株式会社 | プリント基板 |
| JPH11186712A (ja) | 1997-12-24 | 1999-07-09 | Nissan Motor Co Ltd | はんだペーストおよび接続方法 |
| JPH11347784A (ja) | 1998-06-01 | 1999-12-21 | Victor Co Of Japan Ltd | はんだペースト及びそれを用いた電子回路装置 |
| JP4389331B2 (ja) | 2000-03-23 | 2009-12-24 | ソニー株式会社 | ペーストはんだ |
| JP4438974B2 (ja) * | 2000-10-05 | 2010-03-24 | 千住金属工業株式会社 | ソルダペ−スト |
| JP2003211289A (ja) | 2002-01-21 | 2003-07-29 | Fujitsu Ltd | 導電性接合材料、それを用いた接合方法及び電子機器 |
| US7888411B2 (en) | 2003-04-01 | 2011-02-15 | Creative Electron, Inc. | Thermally conductive adhesive composition and process for device attachment |
| JP2005183903A (ja) | 2003-12-22 | 2005-07-07 | Rohm & Haas Electronic Materials Llc | 電子デバイスおよび電子デバイスを形成する方法 |
| DE102004034035A1 (de) * | 2004-07-13 | 2006-02-09 | W.C. Heraeus Gmbh | Bleifreie Lotpasten mit erhöhter Zuverlässigkeit |
| US8241436B2 (en) * | 2005-04-01 | 2012-08-14 | Asahi Kasei Emd Corporation | Conductive filler and solder material |
| KR101088658B1 (ko) | 2005-11-11 | 2011-12-01 | 가부시키가이샤 무라타 세이사쿠쇼 | 솔더 페이스트와 땜납 이음매 |
| JP2007152418A (ja) * | 2005-12-08 | 2007-06-21 | Mitsui Mining & Smelting Co Ltd | 高温はんだおよびその製造方法 |
| US20070152026A1 (en) * | 2005-12-30 | 2007-07-05 | Daewoong Suh | Transient liquid phase bonding method |
| CN101500744B (zh) * | 2006-07-05 | 2011-11-30 | 富士电机株式会社 | 膏状钎焊料和电子部件的软钎焊方法 |
| CN101506906A (zh) * | 2006-08-28 | 2009-08-12 | 株式会社村田制作所 | 导电性接合材料及电子装置 |
| JP2010029868A (ja) | 2006-11-06 | 2010-02-12 | Victor Co Of Japan Ltd | 無鉛はんだペースト、それを用いた電子回路基板及びその製造方法 |
| WO2008091825A2 (en) * | 2007-01-22 | 2008-07-31 | University Of Maryland | High temperature solder materials |
| JP5373464B2 (ja) * | 2008-04-23 | 2013-12-18 | パナソニック株式会社 | 導電性ペーストおよびこれを用いた実装構造体 |
| JP5292977B2 (ja) * | 2008-08-01 | 2013-09-18 | 富士電機株式会社 | 接合材、半導体装置およびその製造方法 |
| JP5169871B2 (ja) | 2009-01-26 | 2013-03-27 | 富士通株式会社 | はんだ、はんだ付け方法及び半導体装置 |
| KR102089843B1 (ko) | 2009-04-02 | 2020-03-17 | 오르멧 서키츠 인코퍼레이티드 | 혼합된 합금 충전재를 함유하는 전도성 조성물 |
| JP5698447B2 (ja) * | 2009-09-08 | 2015-04-08 | 株式会社タムラ製作所 | はんだ接合剤組成物 |
| JP5160576B2 (ja) * | 2010-02-22 | 2013-03-13 | 株式会社タムラ製作所 | ソルダペーストと、これを用いたピングリッドアレイパッケージ用基板及びピングリッドアレイパッケージ、並びにピングリッドアレイパッケージ用基板の製造方法 |
| US9017446B2 (en) | 2010-05-03 | 2015-04-28 | Indium Corporation | Mixed alloy solder paste |
| KR20140121211A (ko) | 2013-04-05 | 2014-10-15 | 부산대학교 산학협력단 | 고융점 무연 솔더 조성물, 고융점 무연 솔더 합금 제조방법 및 이의 용도 |
-
2010
- 2010-05-03 US US12/772,897 patent/US9017446B2/en active Active
-
2011
- 2011-04-04 KR KR1020127028941A patent/KR101820986B1/ko active Active
- 2011-04-04 CN CN201180022297.6A patent/CN102892549B/zh active Active
- 2011-04-04 WO PCT/US2011/031107 patent/WO2011139454A1/en not_active Ceased
- 2011-04-04 DE DE112011101556.9T patent/DE112011101556B4/de active Active
- 2011-04-04 MY MYPI2012004531A patent/MY158123A/en unknown
- 2011-04-04 JP JP2013509074A patent/JP5938032B2/ja active Active
-
2015
- 2015-02-23 US US14/629,139 patent/US10118260B2/en active Active
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