JP5938032B2 - 混合合金はんだペースト - Google Patents
混合合金はんだペースト Download PDFInfo
- Publication number
- JP5938032B2 JP5938032B2 JP2013509074A JP2013509074A JP5938032B2 JP 5938032 B2 JP5938032 B2 JP 5938032B2 JP 2013509074 A JP2013509074 A JP 2013509074A JP 2013509074 A JP2013509074 A JP 2013509074A JP 5938032 B2 JP5938032 B2 JP 5938032B2
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- alloy
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K35/262—Sn as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K35/264—Bi as the principal constituent
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0133—Ternary Alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/772,897 | 2010-05-03 | ||
| US12/772,897 US9017446B2 (en) | 2010-05-03 | 2010-05-03 | Mixed alloy solder paste |
| PCT/US2011/031107 WO2011139454A1 (en) | 2010-05-03 | 2011-04-04 | Mixed alloy solder paste |
Publications (3)
| Publication Number | Publication Date |
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| JP2013525121A JP2013525121A (ja) | 2013-06-20 |
| JP2013525121A5 JP2013525121A5 (enExample) | 2014-05-22 |
| JP5938032B2 true JP5938032B2 (ja) | 2016-06-22 |
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| JP2013509074A Active JP5938032B2 (ja) | 2010-05-03 | 2011-04-04 | 混合合金はんだペースト |
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| DE (1) | DE112011101556B4 (enExample) |
| MY (1) | MY158123A (enExample) |
| WO (1) | WO2011139454A1 (enExample) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US9017446B2 (en) | 2010-05-03 | 2015-04-28 | Indium Corporation | Mixed alloy solder paste |
| US11189537B2 (en) * | 2012-03-21 | 2021-11-30 | Infineon Technologies Ag | Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit |
| JP5635561B2 (ja) * | 2012-06-21 | 2014-12-03 | 株式会社タムラ製作所 | はんだ組成物 |
| WO2014061085A1 (ja) * | 2012-10-15 | 2014-04-24 | 千住金属工業株式会社 | 低温ソルダペーストのはんだ付け方法 |
| US9272371B2 (en) * | 2013-05-30 | 2016-03-01 | Agc Automotive Americas R&D, Inc. | Solder joint for an electrical conductor and a window pane including same |
| US9656351B2 (en) * | 2013-12-03 | 2017-05-23 | Hiroshima University | Solder material and connected structure |
| US10376995B2 (en) | 2013-12-13 | 2019-08-13 | Schlumberger Technology Corporation | Tin-antimony-based high temperature solder for downhole components |
| CN104668810B (zh) * | 2015-01-29 | 2016-09-07 | 苏州天兼新材料科技有限公司 | 一种新型无铅焊接材料及其助焊剂的制备方法 |
| KR101913994B1 (ko) * | 2015-03-10 | 2018-12-28 | 인듐 코포레이션 | 혼합 합금 땜납 페이스트 |
| CN107405729A (zh) * | 2015-03-31 | 2017-11-28 | 住友金属矿山股份有限公司 | 焊膏 |
| CN107635716B (zh) * | 2015-05-05 | 2021-05-25 | 铟泰公司 | 用于严苛环境电子器件应用的高可靠性无铅焊料合金 |
| CN105140209A (zh) * | 2015-06-26 | 2015-12-09 | 江苏师范大学 | 一种用于3D封装芯片堆叠的In基互连材料 |
| CN105234579B (zh) * | 2015-10-21 | 2017-09-29 | 张家港市东大工业技术研究院 | 一种添加抗氧化颗粒的低熔点焊膏 |
| US10376997B2 (en) | 2016-06-23 | 2019-08-13 | Purdue Research Foundation | Transient liquid phase bonding process and assemblies formed thereby |
| TWI647316B (zh) * | 2016-07-15 | 2019-01-11 | Jx金屬股份有限公司 | Solder alloy |
| US10263362B2 (en) | 2017-03-29 | 2019-04-16 | Agc Automotive Americas R&D, Inc. | Fluidically sealed enclosure for window electrical connections |
| US10849192B2 (en) | 2017-04-26 | 2020-11-24 | Agc Automotive Americas R&D, Inc. | Enclosure assembly for window electrical connections |
| CN108857135A (zh) * | 2018-03-12 | 2018-11-23 | 深圳市鑫富锦新材料有限公司 | 一种混合合金焊料膏 |
| US10888958B2 (en) * | 2018-05-29 | 2021-01-12 | Indium Corporation | Hybrid high temperature lead-free solder preform |
| CN111132794B (zh) * | 2018-08-31 | 2021-08-17 | Jx金属株式会社 | 焊料合金 |
| WO2020089258A1 (en) * | 2018-10-31 | 2020-05-07 | Robert Bosch Gmbh | Mixed alloy solder paste, method of making the same and soldering method |
| US11267080B2 (en) | 2019-05-09 | 2022-03-08 | Indium Corporation | Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders |
| CN110936062A (zh) * | 2019-12-18 | 2020-03-31 | 陕西易莱德新材料科技有限公司 | 一种添加有铂金属的焊料及其制备方法 |
| JPWO2022153703A1 (enExample) * | 2021-01-18 | 2022-07-21 | ||
| US20230241725A1 (en) * | 2022-01-19 | 2023-08-03 | Ning-Cheng Lee | Solder pastes and methods of using the same |
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| US4767471A (en) * | 1986-10-03 | 1988-08-30 | Texas Instruments Incorporated | Delayed reflow alloy mix solder paste |
| JPH01266987A (ja) * | 1988-04-19 | 1989-10-24 | Senju Metal Ind Co Ltd | クリームはんだおよびクリームはんだのはんだ付け方法 |
| JP2539445Y2 (ja) * | 1990-08-09 | 1997-06-25 | アイワ株式会社 | プリント基板 |
| JPH11186712A (ja) | 1997-12-24 | 1999-07-09 | Nissan Motor Co Ltd | はんだペーストおよび接続方法 |
| JPH11347784A (ja) | 1998-06-01 | 1999-12-21 | Victor Co Of Japan Ltd | はんだペースト及びそれを用いた電子回路装置 |
| JP4389331B2 (ja) | 2000-03-23 | 2009-12-24 | ソニー株式会社 | ペーストはんだ |
| JP4438974B2 (ja) * | 2000-10-05 | 2010-03-24 | 千住金属工業株式会社 | ソルダペ−スト |
| JP2003211289A (ja) | 2002-01-21 | 2003-07-29 | Fujitsu Ltd | 導電性接合材料、それを用いた接合方法及び電子機器 |
| US7888411B2 (en) | 2003-04-01 | 2011-02-15 | Creative Electron, Inc. | Thermally conductive adhesive composition and process for device attachment |
| JP2005183903A (ja) | 2003-12-22 | 2005-07-07 | Rohm & Haas Electronic Materials Llc | 電子デバイスおよび電子デバイスを形成する方法 |
| DE102004034035A1 (de) * | 2004-07-13 | 2006-02-09 | W.C. Heraeus Gmbh | Bleifreie Lotpasten mit erhöhter Zuverlässigkeit |
| EP1864750B1 (en) * | 2005-04-01 | 2016-11-09 | Koki Company Limited | Conductive filler and solder material |
| TW200732082A (en) * | 2005-11-11 | 2007-09-01 | Senju Metal Industry Co | Soldering paste and solder joints |
| JP2007152418A (ja) * | 2005-12-08 | 2007-06-21 | Mitsui Mining & Smelting Co Ltd | 高温はんだおよびその製造方法 |
| US20070152026A1 (en) * | 2005-12-30 | 2007-07-05 | Daewoong Suh | Transient liquid phase bonding method |
| CN101500744B (zh) * | 2006-07-05 | 2011-11-30 | 富士电机株式会社 | 膏状钎焊料和电子部件的软钎焊方法 |
| CN101506906A (zh) * | 2006-08-28 | 2009-08-12 | 株式会社村田制作所 | 导电性接合材料及电子装置 |
| JP2010029868A (ja) | 2006-11-06 | 2010-02-12 | Victor Co Of Japan Ltd | 無鉛はんだペースト、それを用いた電子回路基板及びその製造方法 |
| CN101641176B (zh) * | 2007-01-22 | 2013-05-22 | 马里兰大学 | 高温焊接材料 |
| JP5373464B2 (ja) * | 2008-04-23 | 2013-12-18 | パナソニック株式会社 | 導電性ペーストおよびこれを用いた実装構造体 |
| JP5292977B2 (ja) * | 2008-08-01 | 2013-09-18 | 富士電機株式会社 | 接合材、半導体装置およびその製造方法 |
| JP5169871B2 (ja) | 2009-01-26 | 2013-03-27 | 富士通株式会社 | はんだ、はんだ付け方法及び半導体装置 |
| WO2010114874A2 (en) | 2009-04-02 | 2010-10-07 | Ormet Circuits Inc. | Conductive compositions containing blended alloy fillers |
| JP5698447B2 (ja) * | 2009-09-08 | 2015-04-08 | 株式会社タムラ製作所 | はんだ接合剤組成物 |
| JP5160576B2 (ja) * | 2010-02-22 | 2013-03-13 | 株式会社タムラ製作所 | ソルダペーストと、これを用いたピングリッドアレイパッケージ用基板及びピングリッドアレイパッケージ、並びにピングリッドアレイパッケージ用基板の製造方法 |
| US9017446B2 (en) | 2010-05-03 | 2015-04-28 | Indium Corporation | Mixed alloy solder paste |
| KR20140121211A (ko) | 2013-04-05 | 2014-10-15 | 부산대학교 산학협력단 | 고융점 무연 솔더 조성물, 고융점 무연 솔더 합금 제조방법 및 이의 용도 |
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2010
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2011
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- 2011-04-04 MY MYPI2012004531A patent/MY158123A/en unknown
- 2011-04-04 DE DE112011101556.9T patent/DE112011101556B4/de active Active
- 2011-04-04 WO PCT/US2011/031107 patent/WO2011139454A1/en not_active Ceased
- 2011-04-04 JP JP2013509074A patent/JP5938032B2/ja active Active
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2015
- 2015-02-23 US US14/629,139 patent/US10118260B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN102892549B (zh) | 2017-01-18 |
| DE112011101556B4 (de) | 2023-11-09 |
| US9017446B2 (en) | 2015-04-28 |
| DE112011101556T5 (de) | 2013-02-14 |
| US20150224602A1 (en) | 2015-08-13 |
| KR101820986B1 (ko) | 2018-01-22 |
| JP2013525121A (ja) | 2013-06-20 |
| CN102892549A (zh) | 2013-01-23 |
| US10118260B2 (en) | 2018-11-06 |
| US20110268985A1 (en) | 2011-11-03 |
| WO2011139454A1 (en) | 2011-11-10 |
| KR20130056235A (ko) | 2013-05-29 |
| MY158123A (en) | 2016-08-30 |
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