JP5938032B2 - 混合合金はんだペースト - Google Patents

混合合金はんだペースト Download PDF

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Publication number
JP5938032B2
JP5938032B2 JP2013509074A JP2013509074A JP5938032B2 JP 5938032 B2 JP5938032 B2 JP 5938032B2 JP 2013509074 A JP2013509074 A JP 2013509074A JP 2013509074 A JP2013509074 A JP 2013509074A JP 5938032 B2 JP5938032 B2 JP 5938032B2
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Japan
Prior art keywords
alloy
solder
solder alloy
remaining
weight
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English (en)
Japanese (ja)
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JP2013525121A (ja
JP2013525121A5 (enExample
Inventor
ザン，ホンウェン
リー，ニンチェン
Original Assignee
インディウム コーポレーション
インディウム コーポレーション
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Publication of JP2013525121A5 publication Critical patent/JP2013525121A5/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01321—Manufacture or treatment of die-attach connectors using local deposition
    • H10W72/01325—Manufacture or treatment of die-attach connectors using local deposition in solid form
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01361—Chemical or physical modification, e.g. by sintering or anodisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP2013509074A 2010-05-03 2011-04-04 混合合金はんだペースト Active JP5938032B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/772,897 US9017446B2 (en) 2010-05-03 2010-05-03 Mixed alloy solder paste
US12/772,897 2010-05-03
PCT/US2011/031107 WO2011139454A1 (en) 2010-05-03 2011-04-04 Mixed alloy solder paste

Publications (3)

Publication Number Publication Date
JP2013525121A JP2013525121A (ja) 2013-06-20
JP2013525121A5 JP2013525121A5 (enExample) 2014-05-22
JP5938032B2 true JP5938032B2 (ja) 2016-06-22

Family

ID=44259596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013509074A Active JP5938032B2 (ja) 2010-05-03 2011-04-04 混合合金はんだペースト

Country Status (7)

Country Link
US (2) US9017446B2 (enExample)
JP (1) JP5938032B2 (enExample)
KR (1) KR101820986B1 (enExample)
CN (1) CN102892549B (enExample)
DE (1) DE112011101556B4 (enExample)
MY (1) MY158123A (enExample)
WO (1) WO2011139454A1 (enExample)

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US9017446B2 (en) 2010-05-03 2015-04-28 Indium Corporation Mixed alloy solder paste
US11189537B2 (en) * 2012-03-21 2021-11-30 Infineon Technologies Ag Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit
JP5635561B2 (ja) * 2012-06-21 2014-12-03 株式会社タムラ製作所 はんだ組成物
US9402321B2 (en) * 2012-10-15 2016-07-26 Senju Metal Industry Co., Ltd. Soldering method using a low-temperature solder paste
US9272371B2 (en) * 2013-05-30 2016-03-01 Agc Automotive Americas R&D, Inc. Solder joint for an electrical conductor and a window pane including same
WO2015083661A1 (ja) * 2013-12-03 2015-06-11 国立大学法人広島大学 はんだ材料および接合構造体
US10376995B2 (en) 2013-12-13 2019-08-13 Schlumberger Technology Corporation Tin-antimony-based high temperature solder for downhole components
CN104668810B (zh) * 2015-01-29 2016-09-07 苏州天兼新材料科技有限公司 一种新型无铅焊接材料及其助焊剂的制备方法
JP2018511482A (ja) * 2015-03-10 2018-04-26 インディウム コーポレーション 混成合金ソルダペースト
WO2016157971A1 (ja) * 2015-03-31 2016-10-06 住友金属鉱山株式会社 はんだペースト
CN113146093A (zh) * 2015-05-05 2021-07-23 铟泰公司 用于严苛环境电子器件应用的高可靠性无铅焊料合金
CN116393868B (zh) * 2015-05-15 2026-05-08 安波福技术股份公司 基于铟-锡-银的无铅焊料
CN105140209A (zh) * 2015-06-26 2015-12-09 江苏师范大学 一种用于3D封装芯片堆叠的In基互连材料
CN105234579B (zh) * 2015-10-21 2017-09-29 张家港市东大工业技术研究院 一种添加抗氧化颗粒的低熔点焊膏
US10376997B2 (en) 2016-06-23 2019-08-13 Purdue Research Foundation Transient liquid phase bonding process and assemblies formed thereby
TWI647316B (zh) * 2016-07-15 2019-01-11 Ｊｘ金屬股份有限公司 Solder alloy
US10263362B2 (en) 2017-03-29 2019-04-16 Agc Automotive Americas R&D, Inc. Fluidically sealed enclosure for window electrical connections
US10849192B2 (en) 2017-04-26 2020-11-24 Agc Automotive Americas R&D, Inc. Enclosure assembly for window electrical connections
CN108857135A (zh) * 2018-03-12 2018-11-23 深圳市鑫富锦新材料有限公司 一种混合合金焊料膏
US10888958B2 (en) 2018-05-29 2021-01-12 Indium Corporation Hybrid high temperature lead-free solder preform
WO2020044650A1 (ja) * 2018-08-31 2020-03-05 Ｊｘ金属株式会社 はんだ合金
DE112019005431T5 (de) * 2018-10-31 2021-07-15 Robert Bosch Gmbh Mischlegierungslotpaste, verfahren zur herstellung derselben und lötverfahren
US11267080B2 (en) * 2019-05-09 2022-03-08 Indium Corporation Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders
CN110936062A (zh) * 2019-12-18 2020-03-31 陕西易莱德新材料科技有限公司 一种添加有铂金属的焊料及其制备方法
WO2022153703A1 (ja) * 2021-01-18 2022-07-21 パナソニックＩｐマネジメント株式会社 はんだペースト及び接合構造体
WO2022261130A1 (en) * 2021-06-11 2022-12-15 Indium Corporation High reliability lead-free solder pastes with mixed solder alloy powders
US20230241725A1 (en) * 2022-01-19 2023-08-03 Ning-Cheng Lee Solder pastes and methods of using the same
US12583061B2 (en) 2022-08-12 2026-03-24 Senju Metal Industry Co., Ltd. Solder alloy, solder paste, and solder joint

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JP5292977B2 (ja) * 2008-08-01 2013-09-18 富士電機株式会社 接合材、半導体装置およびその製造方法
JP5169871B2 (ja) 2009-01-26 2013-03-27 富士通株式会社 はんだ、はんだ付け方法及び半導体装置
JP2012523091A (ja) 2009-04-02 2012-09-27 オーメット サーキッツ インク 混合された合金フィラーを含む伝導性組成物
JP5698447B2 (ja) * 2009-09-08 2015-04-08 株式会社タムラ製作所 はんだ接合剤組成物
JP5160576B2 (ja) * 2010-02-22 2013-03-13 株式会社タムラ製作所 ソルダペーストと、これを用いたピングリッドアレイパッケージ用基板及びピングリッドアレイパッケージ、並びにピングリッドアレイパッケージ用基板の製造方法
US9017446B2 (en) 2010-05-03 2015-04-28 Indium Corporation Mixed alloy solder paste
KR20140121211A (ko) 2013-04-05 2014-10-15 부산대학교 산학협력단 고융점 무연 솔더 조성물, 고융점 무연 솔더 합금 제조방법 및 이의 용도

Also Published As

Publication number Publication date
US20110268985A1 (en) 2011-11-03
US20150224602A1 (en) 2015-08-13
CN102892549B (zh) 2017-01-18
DE112011101556T5 (de) 2013-02-14
MY158123A (en) 2016-08-30
JP2013525121A (ja) 2013-06-20
US10118260B2 (en) 2018-11-06
DE112011101556B4 (de) 2023-11-09
CN102892549A (zh) 2013-01-23
KR20130056235A (ko) 2013-05-29
KR101820986B1 (ko) 2018-01-22
US9017446B2 (en) 2015-04-28
WO2011139454A1 (en) 2011-11-10

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