JP2013525121A - 混合合金はんだペースト - Google Patents
混合合金はんだペースト Download PDFInfo
- Publication number
- JP2013525121A JP2013525121A JP2013509074A JP2013509074A JP2013525121A JP 2013525121 A JP2013525121 A JP 2013525121A JP 2013509074 A JP2013509074 A JP 2013509074A JP 2013509074 A JP2013509074 A JP 2013509074A JP 2013525121 A JP2013525121 A JP 2013525121A
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- JP
- Japan
- Prior art keywords
- alloy
- solder
- remaining
- paste
- solid phase
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
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- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
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Abstract
Description
ここに説明した範囲に亘る様々な混合合金パウダーペーストでは、はんだ性能の試験された。
Claims (29)
- 約60重量%〜約92重量%の第1はんだ合金パウダーと、
0重量%よりも多いが約12重量%よりも少ない第2はんだ合金パウダーと、
フラックスと、を含み、
前記第1はんだ合金パウダーが、約260℃を超える固相温度を有する第1はんだ合金を含み、
前記第2はんだ合金パウダーが、約250℃よりも小さい固相温度を有する第2はんだ合金を含むことを特徴とする、はんだペースト。 - 前記第2はんだ合金は、約230℃〜約250℃の固相温度を有することを特徴とする請求項1に記載のはんだペースト。
- 前記第2はんだ合金は、Sn合金、Sn−Sb合金、又は、Sn−Sb−X(X=Ag、Al、Au、Co、Cu、Ga、Ge、In、Mn、Ni、P、Pd、Pt又はZn)合金を含むことを特徴とする請求項2に記載のはんだペースト。
- 前記第2はんだ合金は、約200℃〜約230℃の固相温度を有することを特徴とする請求項1に記載のはんだペースト。
- 前記第2はんだは、Sn−Ag合金、Sn−Cu合金、Sn−Ag−X(X=Al、Au、Co、Cu、Ga、Ge、In、Mn、Ni、P、Pd、Pt、Sb又はZn)合金又はSn−Zn合金を含むことを特徴とする請求項1に記載のはんだペースト。
- 前記第2はんだ合金は約200℃以下の固相温度を有することを特徴とする請求項1に記載のはんだペースト。
- 前記第2はんだは、Sn−Bi合金、Sn−In合金又はBi−In合金を含むことを特徴とする請求項6に記載のはんだペースト。
- 前記第2はんだ合金パウダーの量は約2重量%〜10重量%であることを特徴とする請求項1に記載のはんだペースト。
- 前記第1はんだ合金は、Bi−Ag、Bi−Cu又はBi−Ag−Cu合金を含むことを特徴とする請求項1に記載のはんだペースト。
- 前記第1はんだ合金は、0〜20重量%のAg及び残りのBi、0〜5重量%のCu及び残りのBi、あるいは、0〜20重量%のAg、0〜5重量%のCu及び残りのBiを含むことを特徴とする請求項1に記載のはんだペースト。
- 前記第1はんだ合金は、2.6〜15重量%のAg及び残りのBi、0.2〜1.5重量%のCu及び残りのBi、あるいは、2.6〜15重量%のAg、0.2〜1.5重量%のCu及び残りのBiを含むことを特徴とする請求項1に記載のはんだペースト。
- 約60重量%〜約92重量%の第1はんだ合金パウダーと、
0重量%よりも多いが約12重量%よりも少ない第2はんだ合金パウダーと、
フラックスと、
を組み合わせることを含み、
前記第1はんだ合金パウダーが、約260℃を超える固相温度を有する第1はんだ合金を含み、
前記第2はんだ合金パウダーが、約250℃よりも小さい固相温度を有する第2はんだ合金を含むことを特徴とする、はんだペーストを作成する方法。 - 前記第2はんだ合金は、Sn合金、Sn−Sb合金、Sn−Sb−X(X=Ag、Al、Au、Co、Cu、Ga、Ge、In、Mn、Ni、P、Pd、Pt又はZn)合金、Sn−Ag合金、Sn−Cu合金、Sn−Ag−X(X=Al、Au、Co、Cu、Ga、Ge、In、Mn、Ni、P、Pd、Pt、Sb又はZn)合金、Sn−Zn合金、Sn−Bi合金、Sn−In合金又はBi−In合金を含むことを特徴とする請求項1に記載の方法。
- 前記第2はんだ合金パウダーの量は、約2重量%〜10重量%であることを特徴とする請求項1に記載の方法。
- 前記第1はんだ合金は、Bi−Ag、Bi−Cu又はBi−Ag−Cu合金を含むことを特徴とする請求項1に記載の方法。
- 前記第1はんだ合金は、0〜20重量%のAg及び残りのBi、0〜5重量%のCu及び残りのBi、あるいは、0〜20重量%のAg、0〜5重量%のCu及び残りのBiを含むことを特徴とする請求項1に記載の方法。
- 前記第1はんだ合金は、2.6〜15重量%のAg及び残りのBi、0.2〜1.5重量%のCu及び残りのBi、あるいは、2.6〜15重量%のAg、0.2〜1.5重量%のCu及び残りのBiを含むことを特徴とする請求項1に記載の方法。
- 基板と装置との間にはんだペーストを適用してアセンブリを形成するステップと、
リフロープロファイルを使用して前記アセンブリをリフローはんだ付けして、はんだ接合を形成するステップと、含み、
前記はんだペーストは、
約60重量%〜約92重量%の第1はんだ合金パウダーと、
0重量%よりも多いが約12重量%よりも少ない第2はんだ合金パウダーと、
フラックスと、を含み、
前記第1はんだ合金パウダーが、約260℃を超える固相温度を有する第1はんだ合金を含み、
前記第2はんだ合金パウダーが、約250℃よりも小さい固相温度を有する第2はんだ合金を含むことを特徴とする、はんだ付けの方法。 - 前記第2はんだ合金は、Sn合金、Sn−Sb合金、Sn−Sb−X(X=Ag、Al、Au、Co、Cu、Ga、Ge、In、Mn、Ni、P、Pd、Pt又はZn)合金、Sn−Ag合金、Sn−Cu合金、Sn−Ag−X(X=Al、Au、Co、Cu、Ga、Ge、In、Mn、Ni、P、Pd、Pt、Sb又はZn)合金、Sn−Zn合金、Sn−Bi合金、Sn−In合金又はBi−In合金を含むことを特徴とする請求項1に記載の方法。
- 前記第2はんだ合金パウダーの量は、約2重量%〜10重量%であることを特徴とする請求項1に記載の方法。
- 前記第1はんだ合金は、Bi−Ag、Bi−Cu又はBi−Ag−Cu合金を含むことを特徴とする請求項1に記載の方法。
- 前記第1はんだ合金は、0〜20重量%のAg及び残りのBi、0〜5重量%のCu及び残りのBi、あるいは、0〜20重量%のAg、0〜5重量%のCu及び残りのBiを含むことを特徴とする請求項1に記載の方法。
- 前記第1はんだ合金は、2.6〜15重量%のAg及び残りのBi、0.2〜1.5重量%のCu及び残りのBi、あるいは、2.6〜15重量%のAg、0.2〜1.5重量%のCu及び残りのBiを含むことを特徴とする請求項1に記載の方法。
- 基板と装置との間にはんだペーストを適用してアセンブリを形成するステップと、
リフロープロファイルを使用して前記アセンブリをリフローはんだ付けして、はんだ接合を形成するステップと、含むプロセスによって形成されたはんだ接合であって、
前記はんだペーストは、
約60重量%〜約92重量%の第1はんだ合金パウダーと、
0重量%よりも多いが約12重量%よりも少ない第2はんだ合金パウダーと、
フラックスと、を含み、
前記第1はんだ合金パウダーが、約260℃を超える固相温度を有する第1はんだ合金を含み、
前記第2はんだ合金パウダーが、約250℃よりも小さい固相温度を有する第2はんだ合金を含むことを特徴とする、はんだ接合。 - 前記第2はんだ合金は、Sn合金、Sn−Sb合金、Sn−Sb−X(X=Ag、Al、Au、Co、Cu、Ga、Ge、In、Mn、Ni、P、Pd、Pt又はZn)合金、Sn−Ag合金、Sn−Cu合金、Sn−Ag−X(X=Al、Au、Co、Cu、Ga、Ge、In、Mn、Ni、P、Pd、Pt、Sb又はZn)合金、Sn−Zn合金、Sn−Bi合金、Sn−In合金又はBi−In合金を含むことを特徴とする請求項1に記載のはんだ接合。
- 前記第2はんだ合金パウダーの量は、約2重量%〜10重量%であることを特徴とする請求項1に記載のはんだ接合。
- 前記第1はんだ合金は、Bi−Ag、Bi−Cu又はBi−Ag−Cu合金を含むことを特徴とする請求項1に記載のはんだ接合。
- 前記第1はんだ合金は、0〜20重量%のAg及び残りのBi、0〜5重量%のCu及び残りのBi、あるいは、0〜20重量%のAg、0〜5重量%のCu及び残りのBiを含むことを特徴とする請求項1に記載のはんだ接合。
- 前記第1はんだ合金は、2.6〜15重量%のAg及び残りのBi、0.2〜1.5重量%のCu及び残りのBi、あるいは、2.6〜15重量%のAg、0.2〜1.5重量%のCu及び残りのBiを含むことを特徴とする請求項1に記載のはんだ接合。
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Also Published As
Publication number | Publication date |
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CN102892549A (zh) | 2013-01-23 |
US20150224602A1 (en) | 2015-08-13 |
US20110268985A1 (en) | 2011-11-03 |
US9017446B2 (en) | 2015-04-28 |
WO2011139454A1 (en) | 2011-11-10 |
DE112011101556T5 (de) | 2013-02-14 |
JP5938032B2 (ja) | 2016-06-22 |
DE112011101556B4 (de) | 2023-11-09 |
KR20130056235A (ko) | 2013-05-29 |
MY158123A (en) | 2016-08-30 |
US10118260B2 (en) | 2018-11-06 |
CN102892549B (zh) | 2017-01-18 |
KR101820986B1 (ko) | 2018-01-22 |
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