KR101651920B1 - 무납 주석 합금 전기도금 조성물 및 방법 - Google Patents
무납 주석 합금 전기도금 조성물 및 방법 Download PDFInfo
- Publication number
- KR101651920B1 KR101651920B1 KR1020090134621A KR20090134621A KR101651920B1 KR 101651920 B1 KR101651920 B1 KR 101651920B1 KR 1020090134621 A KR1020090134621 A KR 1020090134621A KR 20090134621 A KR20090134621 A KR 20090134621A KR 101651920 B1 KR101651920 B1 KR 101651920B1
- Authority
- KR
- South Korea
- Prior art keywords
- dithia
- tin
- composition
- silver
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000203 mixture Substances 0.000 title claims abstract description 116
- 238000000034 method Methods 0.000 title claims abstract description 46
- 229910001128 Sn alloy Inorganic materials 0.000 title abstract description 45
- 238000009713 electroplating Methods 0.000 title description 25
- -1 flavone compounds Chemical class 0.000 claims abstract description 26
- 239000004065 semiconductor Substances 0.000 claims abstract description 15
- 235000011949 flavones Nutrition 0.000 claims abstract description 12
- GAMYVSCDDLXAQW-AOIWZFSPSA-N Thermopsosid Natural products O(C)c1c(O)ccc(C=2Oc3c(c(O)cc(O[C@H]4[C@H](O)[C@@H](O)[C@H](O)[C@H](CO)O4)c3)C(=O)C=2)c1 GAMYVSCDDLXAQW-AOIWZFSPSA-N 0.000 claims abstract description 11
- 229930003944 flavone Natural products 0.000 claims abstract description 11
- VHBFFQKBGNRLFZ-UHFFFAOYSA-N vitamin p Natural products O1C2=CC=CC=C2C(=O)C=C1C1=CC=CC=C1 VHBFFQKBGNRLFZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910001432 tin ion Inorganic materials 0.000 claims abstract description 9
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims abstract description 6
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 claims description 35
- 229910052709 silver Inorganic materials 0.000 claims description 29
- 239000004332 silver Substances 0.000 claims description 28
- 239000002253 acid Substances 0.000 claims description 21
- 150000001875 compounds Chemical class 0.000 claims description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- PDHFSBXFZGYBIP-UHFFFAOYSA-N 2-[2-(2-hydroxyethylsulfanyl)ethylsulfanyl]ethanol Chemical compound OCCSCCSCCO PDHFSBXFZGYBIP-UHFFFAOYSA-N 0.000 claims description 7
- RNKSNQNKTRGJSZ-UHFFFAOYSA-N 3,5,6,7,8-pentahydroxy-2-phenylchromen-4-one Chemical compound OC=1C(O)=C(O)C(O)=C(C(C=2O)=O)C=1OC=2C1=CC=CC=C1 RNKSNQNKTRGJSZ-UHFFFAOYSA-N 0.000 claims description 7
- 150000002009 diols Chemical class 0.000 claims description 6
- REFJWTPEDVJJIY-UHFFFAOYSA-N Quercetin Chemical compound C=1C(O)=CC(O)=C(C(C=2O)=O)C=1OC=2C1=CC=C(O)C(O)=C1 REFJWTPEDVJJIY-UHFFFAOYSA-N 0.000 claims description 4
- RTIXKCRFFJGDFG-UHFFFAOYSA-N chrysin Chemical compound C=1C(O)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=CC=C1 RTIXKCRFFJGDFG-UHFFFAOYSA-N 0.000 claims description 4
- 239000003381 stabilizer Substances 0.000 claims description 3
- TVJMNKFRSJHLBL-UHFFFAOYSA-N 1-[2-(2-hydroxypropylsulfanyl)ethylsulfanyl]propan-2-ol Chemical compound CC(O)CSCCSCC(C)O TVJMNKFRSJHLBL-UHFFFAOYSA-N 0.000 claims description 2
- LUOIEXVCCJQBDI-UHFFFAOYSA-N 1-ethylsulfanyl-6-(2-hydroxyethylsulfanyl)hexan-2-ol Chemical compound CCSCC(O)CCCCSCCO LUOIEXVCCJQBDI-UHFFFAOYSA-N 0.000 claims description 2
- LYIMNUUCUIRRBX-UHFFFAOYSA-N 2-(hydroxymethylsulfanyl)ethylsulfanylmethanol Chemical compound OCSCCSCO LYIMNUUCUIRRBX-UHFFFAOYSA-N 0.000 claims description 2
- FORJWQPDKXQQOG-UHFFFAOYSA-N 2-[4-(2-hydroxyethylsulfanyl)butylsulfanyl]ethanol Chemical compound OCCSCCCCSCCO FORJWQPDKXQQOG-UHFFFAOYSA-N 0.000 claims description 2
- LTXRPFGDTYMYDS-UHFFFAOYSA-N 3-(3-hydroxypropylsulfanylmethylsulfanyl)propan-1-ol Chemical compound OCCCSCSCCCO LTXRPFGDTYMYDS-UHFFFAOYSA-N 0.000 claims description 2
- RFQANQVYZJBFKL-UHFFFAOYSA-N 3-(hydroxymethylsulfanyl)propylsulfanylmethanol Chemical compound OCSCCCSCO RFQANQVYZJBFKL-UHFFFAOYSA-N 0.000 claims description 2
- NSLRXAXIPBSNQO-UHFFFAOYSA-N 3-[6-(3-hydroxypropylsulfanyl)hexylsulfanyl]propan-1-ol Chemical compound OCCCSCCCCCCSCCCO NSLRXAXIPBSNQO-UHFFFAOYSA-N 0.000 claims description 2
- MFDGLFSVMAMZSZ-UHFFFAOYSA-N 4-[3-(4-hydroxybutylsulfanyl)propylsulfanyl]butan-1-ol Chemical compound OCCCCSCCCSCCCCO MFDGLFSVMAMZSZ-UHFFFAOYSA-N 0.000 claims description 2
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- JPMPXINPTWTIOI-UHFFFAOYSA-N 6-(hydroxymethylsulfanyl)hexylsulfanylmethanol Chemical compound OCSCCCCCCSCO JPMPXINPTWTIOI-UHFFFAOYSA-N 0.000 claims description 2
- YARQVXGXJGYNGD-UHFFFAOYSA-N 8-(hydroxymethylsulfanyl)octylsulfanylmethanol Chemical compound OCSCCCCCCCCSCO YARQVXGXJGYNGD-UHFFFAOYSA-N 0.000 claims description 2
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- ZVOLCUVKHLEPEV-UHFFFAOYSA-N Quercetagetin Natural products C1=C(O)C(O)=CC=C1C1=C(O)C(=O)C2=C(O)C(O)=C(O)C=C2O1 ZVOLCUVKHLEPEV-UHFFFAOYSA-N 0.000 claims description 2
- HWTZYBCRDDUBJY-UHFFFAOYSA-N Rhynchosin Natural products C1=C(O)C(O)=CC=C1C1=C(O)C(=O)C2=CC(O)=C(O)C=C2O1 HWTZYBCRDDUBJY-UHFFFAOYSA-N 0.000 claims description 2
- 235000015838 chrysin Nutrition 0.000 claims description 2
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- MWDZOUNAPSSOEL-UHFFFAOYSA-N kaempferol Natural products OC1=C(C(=O)c2cc(O)cc(O)c2O1)c3ccc(O)cc3 MWDZOUNAPSSOEL-UHFFFAOYSA-N 0.000 claims description 2
- 235000005875 quercetin Nutrition 0.000 claims description 2
- 229960001285 quercetin Drugs 0.000 claims description 2
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 claims 1
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- 235000012680 lutein Nutrition 0.000 claims 1
- 239000001656 lutein Substances 0.000 claims 1
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- ORAKUVXRZWMARG-WZLJTJAWSA-N lutein Natural products CC(=C/C=C/C=C(C)/C=C/C=C(C)/C=C/C1=C(C)CCCC1(C)C)C=CC=C(/C)C=CC2C(=CC(O)CC2(C)C)C ORAKUVXRZWMARG-WZLJTJAWSA-N 0.000 claims 1
- 229940105132 myristate Drugs 0.000 claims 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 claims 1
- TUNFSRHWOTWDNC-UHFFFAOYSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCCC(O)=O TUNFSRHWOTWDNC-UHFFFAOYSA-N 0.000 claims 1
- KBPHJBAIARWVSC-XQIHNALSSA-N trans-lutein Natural products CC(=C/C=C/C=C(C)/C=C/C=C(C)/C=C/C1=C(C)CC(O)CC1(C)C)C=CC=C(/C)C=CC2C(=CC(O)CC2(C)C)C KBPHJBAIARWVSC-XQIHNALSSA-N 0.000 claims 1
- FJHBOVDFOQMZRV-XQIHNALSSA-N xanthophyll Natural products CC(=C/C=C/C=C(C)/C=C/C=C(C)/C=C/C1=C(C)CC(O)CC1(C)C)C=CC=C(/C)C=CC2C=C(C)C(O)CC2(C)C FJHBOVDFOQMZRV-XQIHNALSSA-N 0.000 claims 1
- 239000003792 electrolyte Substances 0.000 abstract description 46
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- 239000000758 substrate Substances 0.000 abstract description 18
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- 239000010410 layer Substances 0.000 description 52
- 238000007747 plating Methods 0.000 description 44
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 26
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 21
- 229910052802 copper Inorganic materials 0.000 description 21
- 239000010949 copper Substances 0.000 description 21
- 239000000463 material Substances 0.000 description 20
- 235000012431 wafers Nutrition 0.000 description 18
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 17
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- AICMYQIGFPHNCY-UHFFFAOYSA-J methanesulfonate;tin(4+) Chemical compound [Sn+4].CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O AICMYQIGFPHNCY-UHFFFAOYSA-J 0.000 description 8
- 229940098779 methanesulfonic acid Drugs 0.000 description 8
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 7
- 125000004432 carbon atom Chemical group C* 0.000 description 7
- 239000008367 deionised water Substances 0.000 description 7
- 229910021641 deionized water Inorganic materials 0.000 description 7
- 150000003606 tin compounds Chemical class 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000001479 atomic absorption spectroscopy Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
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- VKDSBABHIXQFKH-UHFFFAOYSA-M potassium;4-hydroxy-3-sulfophenolate Chemical compound [K+].OC1=CC=C(O)C(S([O-])(=O)=O)=C1 VKDSBABHIXQFKH-UHFFFAOYSA-M 0.000 description 5
- 235000001674 Agaricus brunnescens Nutrition 0.000 description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 4
- YIKYNHJUKRTCJL-UHFFFAOYSA-N Ethyl maltol Chemical compound CCC=1OC=CC(=O)C=1O YIKYNHJUKRTCJL-UHFFFAOYSA-N 0.000 description 4
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- 150000001450 anions Chemical class 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
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- 238000001514 detection method Methods 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 1
- TVQLLNFANZSCGY-UHFFFAOYSA-N disodium;dioxido(oxo)tin Chemical compound [Na+].[Na+].[O-][Sn]([O-])=O TVQLLNFANZSCGY-UHFFFAOYSA-N 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- IVTMALDHFAHOGL-UHFFFAOYSA-N eriodictyol 7-O-rutinoside Natural products OC1C(O)C(O)C(C)OC1OCC1C(O)C(O)C(O)C(OC=2C=C3C(C(C(O)=C(O3)C=3C=C(O)C(O)=CC=3)=O)=C(O)C=2)O1 IVTMALDHFAHOGL-UHFFFAOYSA-N 0.000 description 1
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- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
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- 239000007789 gas Substances 0.000 description 1
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- 239000001257 hydrogen Substances 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- VMYAHWLKMIFKAL-UHFFFAOYSA-N hydroxymethylsulfanylmethylsulfanylmethanol Chemical compound OCSCSCO VMYAHWLKMIFKAL-UHFFFAOYSA-N 0.000 description 1
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- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- PHTQWCKDNZKARW-UHFFFAOYSA-N isoamylol Chemical compound CC(C)CCO PHTQWCKDNZKARW-UHFFFAOYSA-N 0.000 description 1
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- WZNJWVWKTVETCG-UHFFFAOYSA-N kojic acid Natural products OC(=O)C(N)CN1C=CC(=O)C(O)=C1 WZNJWVWKTVETCG-UHFFFAOYSA-N 0.000 description 1
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- 238000005086 pumping Methods 0.000 description 1
- UBQKCCHYAOITMY-UHFFFAOYSA-N pyridin-2-ol Chemical class OC1=CC=CC=N1 UBQKCCHYAOITMY-UHFFFAOYSA-N 0.000 description 1
- FDRQPMVGJOQVTL-UHFFFAOYSA-N quercetin rutinoside Natural products OC1C(O)C(O)C(CO)OC1OCC1C(O)C(O)C(O)C(OC=2C(C3=C(O)C=C(O)C=C3OC=2C=2C=C(O)C(O)=CC=2)=O)O1 FDRQPMVGJOQVTL-UHFFFAOYSA-N 0.000 description 1
- URKOMYMAXPYINW-UHFFFAOYSA-N quetiapine Chemical compound C1CN(CCOCCO)CCN1C1=NC2=CC=CC=C2SC2=CC=CC=C12 URKOMYMAXPYINW-UHFFFAOYSA-N 0.000 description 1
- 229960004431 quetiapine Drugs 0.000 description 1
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- IKGXIBQEEMLURG-BKUODXTLSA-N rutin Chemical compound O[C@H]1[C@H](O)[C@@H](O)[C@H](C)O[C@@H]1OC[C@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](OC=2C(C3=C(O)C=C(O)C=C3OC=2C=2C=C(O)C(O)=CC=2)=O)O1 IKGXIBQEEMLURG-BKUODXTLSA-N 0.000 description 1
- ALABRVAAKCSLSC-UHFFFAOYSA-N rutin Natural products CC1OC(OCC2OC(O)C(O)C(O)C2O)C(O)C(O)C1OC3=C(Oc4cc(O)cc(O)c4C3=O)c5ccc(O)c(O)c5 ALABRVAAKCSLSC-UHFFFAOYSA-N 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 1
- MLKQJVFHEUORBO-UHFFFAOYSA-M silver;methanesulfonate Chemical compound [Ag+].CS([O-])(=O)=O MLKQJVFHEUORBO-UHFFFAOYSA-M 0.000 description 1
- CMZUMMUJMWNLFH-UHFFFAOYSA-N sodium metavanadate Chemical compound [Na+].[O-][V](=O)=O CMZUMMUJMWNLFH-UHFFFAOYSA-N 0.000 description 1
- 229940079864 sodium stannate Drugs 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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- 125000001424 substituent group Chemical group 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 150000003585 thioureas Chemical class 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- VLOPEOIIELCUML-UHFFFAOYSA-L vanadium(2+);sulfate Chemical compound [V+2].[O-]S([O-])(=O)=O VLOPEOIIELCUML-UHFFFAOYSA-L 0.000 description 1
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- 229910052726 zirconium Inorganic materials 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/34—Electroplating: Baths therefor from solutions of lead
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Landscapes
- Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US20404408P | 2008-12-31 | 2008-12-31 | |
| US61/204,044 | 2008-12-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20100080481A KR20100080481A (ko) | 2010-07-08 |
| KR101651920B1 true KR101651920B1 (ko) | 2016-08-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020090134621A Active KR101651920B1 (ko) | 2008-12-31 | 2009-12-30 | 무납 주석 합금 전기도금 조성물 및 방법 |
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|---|---|
| US (1) | US7968444B2 (enExample) |
| EP (1) | EP2221396A1 (enExample) |
| JP (3) | JP2010174373A (enExample) |
| KR (1) | KR101651920B1 (enExample) |
| CN (1) | CN102051645B (enExample) |
| TW (2) | TWI402380B (enExample) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9221081B1 (en) | 2011-08-01 | 2015-12-29 | Novellus Systems, Inc. | Automated cleaning of wafer plating assembly |
| US9988734B2 (en) | 2011-08-15 | 2018-06-05 | Lam Research Corporation | Lipseals and contact elements for semiconductor electroplating apparatuses |
| US10066311B2 (en) | 2011-08-15 | 2018-09-04 | Lam Research Corporation | Multi-contact lipseals and associated electroplating methods |
| US9228270B2 (en) | 2011-08-15 | 2016-01-05 | Novellus Systems, Inc. | Lipseals and contact elements for semiconductor electroplating apparatuses |
| US9390984B2 (en) * | 2011-10-11 | 2016-07-12 | Bruker Jv Israel Ltd. | X-ray inspection of bumps on a semiconductor substrate |
| CN102517615A (zh) * | 2011-12-19 | 2012-06-27 | 张家港舒马克电梯安装维修服务有限公司镀锌分公司 | 一种Sn-Ag合金电镀液 |
| US8888984B2 (en) | 2012-02-09 | 2014-11-18 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| CN102605394B (zh) * | 2012-03-07 | 2015-02-18 | 深圳市华傲创表面技术有限公司 | 一种无氰酸性白铜锡电镀液 |
| CN104272438B (zh) * | 2012-03-28 | 2018-01-12 | 诺发系统公司 | 用于清洁电镀衬底保持器的方法和装置 |
| TWI609100B (zh) | 2012-03-30 | 2017-12-21 | 諾發系統有限公司 | 使用反向電流除鍍以清洗電鍍基板夾持具 |
| US8980077B2 (en) * | 2012-03-30 | 2015-03-17 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| EP2722419B1 (en) | 2012-10-19 | 2018-08-15 | Rohm and Haas Electronic Materials LLC | Thin-tin tinplate |
| JP6133056B2 (ja) * | 2012-12-27 | 2017-05-24 | ローム・アンド・ハース電子材料株式会社 | スズまたはスズ合金めっき液 |
| US10416092B2 (en) | 2013-02-15 | 2019-09-17 | Lam Research Corporation | Remote detection of plating on wafer holding apparatus |
| US9389192B2 (en) | 2013-03-24 | 2016-07-12 | Bruker Jv Israel Ltd. | Estimation of XRF intensity from an array of micro-bumps |
| US9512529B2 (en) * | 2013-06-04 | 2016-12-06 | Rohm And Haas Electronic Materials Llc | Electroplating baths of silver and tin alloys |
| JP2015036449A (ja) * | 2013-08-14 | 2015-02-23 | 石原ケミカル株式会社 | 電気高純度スズ又はスズ合金メッキ浴及び当該メッキ浴で形成した突起電極 |
| US8877630B1 (en) * | 2013-11-12 | 2014-11-04 | Chipmos Technologies Inc. | Semiconductor structure having a silver alloy bump body and manufacturing method thereof |
| US10889907B2 (en) * | 2014-02-21 | 2021-01-12 | Rohm And Haas Electronic Materials Llc | Cyanide-free acidic matte silver electroplating compositions and methods |
| US9632043B2 (en) | 2014-05-13 | 2017-04-25 | Bruker Jv Israel Ltd. | Method for accurately determining the thickness and/or elemental composition of small features on thin-substrates using micro-XRF |
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Also Published As
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| TW201343981A (zh) | 2013-11-01 |
| JP2015045094A (ja) | 2015-03-12 |
| US7968444B2 (en) | 2011-06-28 |
| TWI402380B (zh) | 2013-07-21 |
| EP2221396A1 (en) | 2010-08-25 |
| KR20100080481A (ko) | 2010-07-08 |
| TWI579415B (zh) | 2017-04-21 |
| JP2010174373A (ja) | 2010-08-12 |
| CN102051645B (zh) | 2013-05-08 |
| US20100216302A1 (en) | 2010-08-26 |
| CN102051645A (zh) | 2011-05-11 |
| JP6169211B2 (ja) | 2017-07-26 |
| JP6140132B2 (ja) | 2017-05-31 |
| JP2016106181A (ja) | 2016-06-16 |
| TW201037103A (en) | 2010-10-16 |
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