CN102051645B - 无铅的锡合金电镀组合物及方法 - Google Patents

无铅的锡合金电镀组合物及方法 Download PDF

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Publication number
CN102051645B
CN102051645B CN2009102668168A CN200910266816A CN102051645B CN 102051645 B CN102051645 B CN 102051645B CN 2009102668168 A CN2009102668168 A CN 2009102668168A CN 200910266816 A CN200910266816 A CN 200910266816A CN 102051645 B CN102051645 B CN 102051645B
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China
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composition
tin
ion
interconnection
alloy
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CN102051645A (zh
Inventor
罗雨
N·D·布朗
M·P·托本
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DuPont Electronic Materials International LLC
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Rohm and Haas Electronic Materials LLC
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/34—Electroplating: Baths therefor from solutions of lead
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
CN2009102668168A 2008-12-31 2009-12-31 无铅的锡合金电镀组合物及方法 Active CN102051645B (zh)

Applications Claiming Priority (2)

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US20404408P 2008-12-31 2008-12-31
US61/204,044 2008-12-31

Publications (2)

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CN102051645A CN102051645A (zh) 2011-05-11
CN102051645B true CN102051645B (zh) 2013-05-08

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CN2009102668168A Active CN102051645B (zh) 2008-12-31 2009-12-31 无铅的锡合金电镀组合物及方法

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US (1) US7968444B2 (enExample)
EP (1) EP2221396A1 (enExample)
JP (3) JP2010174373A (enExample)
KR (1) KR101651920B1 (enExample)
CN (1) CN102051645B (enExample)
TW (2) TWI402380B (enExample)

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JP6048712B2 (ja) * 2014-08-08 2016-12-21 奥野製薬工業株式会社 銅−スズ合金めっき浴
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US9829448B2 (en) 2014-10-30 2017-11-28 Bruker Jv Israel Ltd. Measurement of small features using XRF
CN104593835B (zh) * 2015-02-04 2017-10-24 广东羚光新材料股份有限公司 用于片式元器件端电极电镀的中性镀锡液
US10053793B2 (en) 2015-07-09 2018-08-21 Lam Research Corporation Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
JP6432667B2 (ja) * 2017-01-31 2018-12-05 三菱マテリアル株式会社 錫合金めっき液
JP6555455B1 (ja) * 2017-11-01 2019-08-07 日本製鉄株式会社 電気Ｓｎめっき鋼板
CN107723760A (zh) * 2017-11-28 2018-02-23 江苏澳光电子有限公司 一种Au‑Ag合金表面电镀液及其应用
PT3578693T (pt) * 2018-06-08 2020-06-16 Atotech Deutschland Gmbh Composição aquosa para a deposição de uma liga de estanho e prata e método de deposição eletrolítica dessa liga
US20200032409A1 (en) * 2018-07-25 2020-01-30 The Boeing Company Compositions and Methods for Electrodepositing Tin-Bismuth Alloys on Metallic Substrates
JP2020050886A (ja) 2018-09-21 2020-04-02 上村工業株式会社 電解Ｓｎめっき液
JP2020063477A (ja) 2018-10-17 2020-04-23 上村工業株式会社 電解Ｓｎ合金めっき液
US11242609B2 (en) * 2019-10-15 2022-02-08 Rohm and Hass Electronic Materials LLC Acidic aqueous silver-nickel alloy electroplating compositions and methods
CN110760902B (zh) * 2019-11-29 2022-01-25 上海天承化学有限公司 一种锡电镀液及其制备方法和应用
CN114242640B (zh) * 2021-12-21 2024-08-09 淮安澳洋顺昌光电技术有限公司 一种Micro LED芯片的转移方法和显示设备
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Also Published As

Publication number Publication date
US7968444B2 (en) 2011-06-28
JP6169211B2 (ja) 2017-07-26
KR101651920B1 (ko) 2016-08-29
TWI402380B (zh) 2013-07-21
JP2010174373A (ja) 2010-08-12
JP2015045094A (ja) 2015-03-12
TW201037103A (en) 2010-10-16
KR20100080481A (ko) 2010-07-08
CN102051645A (zh) 2011-05-11
JP6140132B2 (ja) 2017-05-31
TWI579415B (zh) 2017-04-21
EP2221396A1 (en) 2010-08-25
US20100216302A1 (en) 2010-08-26
JP2016106181A (ja) 2016-06-16
TW201343981A (zh) 2013-11-01

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Address after: Massachusetts, USA

Patentee after: DuPont Electronic Materials International LLC

Country or region after: U.S.A.

Address before: Massachusetts, USA

Patentee before: ROHM AND HAAS ELECTRONIC MATERIALS, LLC

Country or region before: U.S.A.