PT3578693T - Composição aquosa para a deposição de uma liga de estanho e prata e método de deposição eletrolítica dessa liga - Google Patents

Composição aquosa para a deposição de uma liga de estanho e prata e método de deposição eletrolítica dessa liga

Info

Publication number
PT3578693T
PT3578693T PT181767880T PT18176788T PT3578693T PT 3578693 T PT3578693 T PT 3578693T PT 181767880 T PT181767880 T PT 181767880T PT 18176788 T PT18176788 T PT 18176788T PT 3578693 T PT3578693 T PT 3578693T
Authority
PT
Portugal
Prior art keywords
depositing
alloy
aqueous composition
tin silver
electrolytically
Prior art date
Application number
PT181767880T
Other languages
English (en)
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of PT3578693T publication Critical patent/PT3578693T/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
PT181767880T 2018-06-08 2018-06-08 Composição aquosa para a deposição de uma liga de estanho e prata e método de deposição eletrolítica dessa liga PT3578693T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP18176788.0A EP3578693B1 (en) 2018-06-08 2018-06-08 Aqueous composition for depositing a tin silver alloy and method for electrolytically depositing such an alloy

Publications (1)

Publication Number Publication Date
PT3578693T true PT3578693T (pt) 2020-06-16

Family

ID=62705384

Family Applications (1)

Application Number Title Priority Date Filing Date
PT181767880T PT3578693T (pt) 2018-06-08 2018-06-08 Composição aquosa para a deposição de uma liga de estanho e prata e método de deposição eletrolítica dessa liga

Country Status (4)

Country Link
EP (1) EP3578693B1 (pt)
PT (1) PT3578693T (pt)
TW (1) TWI715991B (pt)
WO (1) WO2019234088A1 (pt)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3301707B2 (ja) 1997-01-20 2002-07-15 ディップソール株式会社 錫−銀合金酸性電気めっき浴
JP3433291B2 (ja) * 1999-09-27 2003-08-04 石原薬品株式会社 スズ−銅含有合金メッキ浴、スズ−銅含有合金メッキ方法及びスズ−銅含有合金メッキ皮膜が形成された物品
DE10158227A1 (de) 2001-11-15 2003-06-05 Siemens Ag Elektrolysebad zum galvanischen Abscheiden von Silber-Zinn-Legierungen
CN1662679B (zh) * 2002-07-25 2010-06-16 株式会社新菱 含有锡－银－铜的电镀液、电镀覆膜及电镀方法
JP4756887B2 (ja) 2005-03-22 2011-08-24 石原薬品株式会社 非シアン系のスズ−銀合金電気メッキ浴
EP2221396A1 (en) * 2008-12-31 2010-08-25 Rohm and Haas Electronic Materials LLC Lead-Free Tin Alloy Electroplating Compositions and Methods
JP6088295B2 (ja) 2013-03-07 2017-03-01 ローム・アンド・ハース電子材料株式会社 スズ合金めっき液
JP6210148B2 (ja) * 2015-12-28 2017-10-11 三菱マテリアル株式会社 ＳｎＡｇ合金めっき液
JP6834070B2 (ja) * 2016-06-13 2021-02-24 石原ケミカル株式会社 電気スズ及びスズ合金メッキ浴、当該メッキ浴を用いて電着物を形成した電子部品の製造方法

Also Published As

Publication number Publication date
TWI715991B (zh) 2021-01-11
WO2019234088A1 (en) 2019-12-12
EP3578693A1 (en) 2019-12-11
EP3578693B1 (en) 2020-04-15
TW202000999A (zh) 2020-01-01

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