JP2015008179A5 - - Google Patents

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Publication number
JP2015008179A5
JP2015008179A5 JP2013132029A JP2013132029A JP2015008179A5 JP 2015008179 A5 JP2015008179 A5 JP 2015008179A5 JP 2013132029 A JP2013132029 A JP 2013132029A JP 2013132029 A JP2013132029 A JP 2013132029A JP 2015008179 A5 JP2015008179 A5 JP 2015008179A5
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JP
Japan
Prior art keywords
layer
metal layer
metal
tin
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013132029A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015008179A (ja
JP6181441B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2013132029A priority Critical patent/JP6181441B2/ja
Priority claimed from JP2013132029A external-priority patent/JP6181441B2/ja
Priority to US14/303,790 priority patent/US9392703B2/en
Publication of JP2015008179A publication Critical patent/JP2015008179A/ja
Publication of JP2015008179A5 publication Critical patent/JP2015008179A5/ja
Application granted granted Critical
Publication of JP6181441B2 publication Critical patent/JP6181441B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013132029A 2013-06-24 2013-06-24 パッド構造、実装構造、及び、製造方法 Active JP6181441B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013132029A JP6181441B2 (ja) 2013-06-24 2013-06-24 パッド構造、実装構造、及び、製造方法
US14/303,790 US9392703B2 (en) 2013-06-24 2014-06-13 Pad structure and mounted structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013132029A JP6181441B2 (ja) 2013-06-24 2013-06-24 パッド構造、実装構造、及び、製造方法

Publications (3)

Publication Number Publication Date
JP2015008179A JP2015008179A (ja) 2015-01-15
JP2015008179A5 true JP2015008179A5 (enExample) 2016-05-26
JP6181441B2 JP6181441B2 (ja) 2017-08-16

Family

ID=52109972

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013132029A Active JP6181441B2 (ja) 2013-06-24 2013-06-24 パッド構造、実装構造、及び、製造方法

Country Status (2)

Country Link
US (1) US9392703B2 (enExample)
JP (1) JP6181441B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016103585B4 (de) 2016-02-29 2022-01-13 Infineon Technologies Ag Verfahren zum Herstellen eines Package mit lötbarem elektrischen Kontakt
US9685408B1 (en) * 2016-04-14 2017-06-20 Macronix International Co., Ltd. Contact pad structure and method for fabricating the same
US9508645B1 (en) * 2016-04-14 2016-11-29 Macronix International Co., Ltd. Contact pad structure
US10453816B2 (en) * 2016-09-28 2019-10-22 Rohm Co., Ltd. Semiconductor device
JP6357271B1 (ja) * 2017-10-25 2018-07-11 有限会社 ナプラ 柱状導体構造
US10418316B1 (en) * 2018-04-04 2019-09-17 Advanced Semiconductor Engineering, Inc. Semiconductor substrate, semiconductor package structure and method of manufacturing a semiconductor device
TWI804122B (zh) * 2021-12-21 2023-06-01 友達光電股份有限公司 顯示裝置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005142338A (ja) 2003-11-06 2005-06-02 Hitachi Chem Co Ltd プリント配線板の製造方法およびプリント配線板
JP4817418B2 (ja) * 2005-01-31 2011-11-16 オンセミコンダクター・トレーディング・リミテッド 回路装置の製造方法
JP2007237252A (ja) * 2006-03-09 2007-09-20 Nippon Steel Materials Co Ltd 自動車搭載電子部材用鉛フリーハンダ合金、ハンダボール及び電子部材
JP2009054790A (ja) * 2007-08-27 2009-03-12 Oki Electric Ind Co Ltd 半導体装置
US7807572B2 (en) * 2008-01-04 2010-10-05 Freescale Semiconductor, Inc. Micropad formation for a semiconductor
JP2011044624A (ja) * 2009-08-24 2011-03-03 Hitachi Ltd 半導体装置および車載用交流発電機
US20130105329A1 (en) * 2010-08-02 2013-05-02 Atotech Deutschland Gmbh Method to form solder deposits and non-melting bump structures on substrates
US8901431B2 (en) * 2010-12-16 2014-12-02 Ibiden Co., Ltd. Printed wiring board and method for manufacturing printed wiring board
JP2012204476A (ja) * 2011-03-24 2012-10-22 Toppan Printing Co Ltd 配線基板およびその製造方法
EP2894951B1 (en) * 2012-09-07 2018-07-04 Ngk Spark Plug Co., Ltd. Wiring substrate and production method therefor

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