JP2013026178A5 - - Google Patents

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Publication number
JP2013026178A5
JP2013026178A5 JP2011162909A JP2011162909A JP2013026178A5 JP 2013026178 A5 JP2013026178 A5 JP 2013026178A5 JP 2011162909 A JP2011162909 A JP 2011162909A JP 2011162909 A JP2011162909 A JP 2011162909A JP 2013026178 A5 JP2013026178 A5 JP 2013026178A5
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JP
Japan
Prior art keywords
connection terminal
support
connection
spring
terminal structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011162909A
Other languages
English (en)
Japanese (ja)
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JP2013026178A (ja
JP5794850B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011162909A priority Critical patent/JP5794850B2/ja
Priority claimed from JP2011162909A external-priority patent/JP5794850B2/ja
Priority to US13/554,080 priority patent/US8784118B2/en
Publication of JP2013026178A publication Critical patent/JP2013026178A/ja
Publication of JP2013026178A5 publication Critical patent/JP2013026178A5/ja
Application granted granted Critical
Publication of JP5794850B2 publication Critical patent/JP5794850B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011162909A 2011-07-26 2011-07-26 接続端子構造の製造方法 Expired - Fee Related JP5794850B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011162909A JP5794850B2 (ja) 2011-07-26 2011-07-26 接続端子構造の製造方法
US13/554,080 US8784118B2 (en) 2011-07-26 2012-07-20 Connection terminal structure, method for manufacturing connection terminal structure, and connection terminal structure substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011162909A JP5794850B2 (ja) 2011-07-26 2011-07-26 接続端子構造の製造方法

Publications (3)

Publication Number Publication Date
JP2013026178A JP2013026178A (ja) 2013-02-04
JP2013026178A5 true JP2013026178A5 (enExample) 2014-07-24
JP5794850B2 JP5794850B2 (ja) 2015-10-14

Family

ID=47597568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011162909A Expired - Fee Related JP5794850B2 (ja) 2011-07-26 2011-07-26 接続端子構造の製造方法

Country Status (2)

Country Link
US (1) US8784118B2 (enExample)
JP (1) JP5794850B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014071964A (ja) * 2012-09-27 2014-04-21 Fujitsu Component Ltd コンタクト部材
EP3134945B1 (en) * 2014-04-23 2019-06-12 TE Connectivity Corporation Electrical connector with shield cap and shielded terminals
FR3021814B1 (fr) * 2014-08-08 2018-06-15 Commissariat Energie Atomique Connecteur pour la connexion en matrice entre un boitier et un support, comportant un corps principal plie
JP6330689B2 (ja) * 2015-02-19 2018-05-30 株式会社オートネットワーク技術研究所 電気接点対およびコネクタ用端子対
FR3038779A1 (fr) * 2015-07-07 2017-01-13 Ingenico Group Connecteur de carte a puce securise
JP2019029535A (ja) * 2017-07-31 2019-02-21 イビデン株式会社 フレキシブルプリント配線板、フレキシブルプリント配線板を備える電子デバイス、及び、フレキシブルプリント配線板を備える電子デバイスの製造方法
CN108258467B (zh) * 2017-12-01 2020-08-28 番禺得意精密电子工业有限公司 电连接器
US20230261408A1 (en) * 2023-04-24 2023-08-17 Google Llc Force Distributing Spring Contacts

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000091048A (ja) * 1998-09-16 2000-03-31 Ngk Insulators Ltd 導通補助材及びその製造方法
JP4303854B2 (ja) * 1999-11-11 2009-07-29 モレックス インコーポレイテド ランドグリッドアレイ型パッケージ用ソケット
US6827584B2 (en) * 1999-12-28 2004-12-07 Formfactor, Inc. Interconnect for microelectronic structures with enhanced spring characteristics
JP2003520454A (ja) * 2000-01-20 2003-07-02 グリフィクス インコーポレーティッド フレキシブルなコンプライアンス相互連結アセンブリ
JP4323055B2 (ja) * 2000-03-22 2009-09-02 富士通マイクロエレクトロニクス株式会社 半導体装置試験用コンタクタ及びその製造方法
US7458816B1 (en) * 2000-04-12 2008-12-02 Formfactor, Inc. Shaped spring
JP2004259530A (ja) * 2003-02-25 2004-09-16 Shinko Electric Ind Co Ltd 外部接触端子を有する半導体装置及びその使用方法
US7628617B2 (en) * 2003-06-11 2009-12-08 Neoconix, Inc. Structure and process for a contact grid array formed in a circuitized substrate
US7771803B2 (en) * 2004-10-27 2010-08-10 Palo Alto Research Center Incorporated Oblique parts or surfaces
JP4848752B2 (ja) * 2005-12-09 2011-12-28 イビデン株式会社 部品実装用ピンを有するプリント配線板及びこれを使用した電子機器
TWI336156B (en) * 2006-07-21 2011-01-11 Fujikura Ltd Ic socket and manufacturing method for the same
CN201725897U (zh) * 2010-01-29 2011-01-26 番禺得意精密电子工业有限公司 电连接装置
US8215966B2 (en) * 2010-04-20 2012-07-10 Tyco Electronics Corporation Interposer connector assembly
US8382487B2 (en) * 2010-12-20 2013-02-26 Tyco Electronics Corporation Land grid array interconnect

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