FR3021814B1 - Connecteur pour la connexion en matrice entre un boitier et un support, comportant un corps principal plie - Google Patents

Connecteur pour la connexion en matrice entre un boitier et un support, comportant un corps principal plie

Info

Publication number
FR3021814B1
FR3021814B1 FR1457692A FR1457692A FR3021814B1 FR 3021814 B1 FR3021814 B1 FR 3021814B1 FR 1457692 A FR1457692 A FR 1457692A FR 1457692 A FR1457692 A FR 1457692A FR 3021814 B1 FR3021814 B1 FR 3021814B1
Authority
FR
France
Prior art keywords
connector
housing
support
main body
matrix connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1457692A
Other languages
English (en)
Other versions
FR3021814A1 (fr
Inventor
Crecy Francois De
Bernard Diem
Christine Ferrandon
Thierry Hilt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA, Commissariat a lEnergie Atomique et aux Energies Alternatives CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR1457692A priority Critical patent/FR3021814B1/fr
Priority to FR1462584A priority patent/FR3021815A1/fr
Priority to EP15744953.9A priority patent/EP3178134A1/fr
Priority to US15/501,686 priority patent/US10320097B2/en
Priority to PCT/EP2015/068073 priority patent/WO2016020445A1/fr
Publication of FR3021814A1 publication Critical patent/FR3021814A1/fr
Application granted granted Critical
Publication of FR3021814B1 publication Critical patent/FR3021814B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/63—Connectors not provided for in any of the groups H01L24/10 - H01L24/50 and subgroups; Manufacturing methods related thereto
    • H01L24/65—Structure, shape, material or disposition of the connectors prior to the connecting process
    • H01L24/67—Structure, shape, material or disposition of the connectors prior to the connecting process of a plurality of connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2435—Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/63—Connectors not provided for in any of the groups H01L2224/10 - H01L2224/50 and subgroups; Manufacturing methods related thereto
    • H01L2224/65—Structure, shape, material or disposition of the connectors prior to the connecting process
    • H01L2224/67—Structure, shape, material or disposition of the connectors prior to the connecting process of a plurality of connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
FR1457692A 2014-08-08 2014-08-08 Connecteur pour la connexion en matrice entre un boitier et un support, comportant un corps principal plie Expired - Fee Related FR3021814B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR1457692A FR3021814B1 (fr) 2014-08-08 2014-08-08 Connecteur pour la connexion en matrice entre un boitier et un support, comportant un corps principal plie
FR1462584A FR3021815A1 (fr) 2014-08-08 2014-12-17 Procede de fabrication d'une matrice de connecteurs electriques
EP15744953.9A EP3178134A1 (fr) 2014-08-08 2015-08-05 Connecteur pour la connexion en matrice entre un boîtier et un support, comportant un corps principal plié
US15/501,686 US10320097B2 (en) 2014-08-08 2015-08-05 Electrical connectors having a bent main body for electrical connection between a housing and a support, and being disposed as a grid array or network
PCT/EP2015/068073 WO2016020445A1 (fr) 2014-08-08 2015-08-05 Connecteur pour la connexion en matrice entre un boîtier et un support, comportant un corps principal plié

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1457692A FR3021814B1 (fr) 2014-08-08 2014-08-08 Connecteur pour la connexion en matrice entre un boitier et un support, comportant un corps principal plie

Publications (2)

Publication Number Publication Date
FR3021814A1 FR3021814A1 (fr) 2015-12-04
FR3021814B1 true FR3021814B1 (fr) 2018-06-15

Family

ID=51688305

Family Applications (2)

Application Number Title Priority Date Filing Date
FR1457692A Expired - Fee Related FR3021814B1 (fr) 2014-08-08 2014-08-08 Connecteur pour la connexion en matrice entre un boitier et un support, comportant un corps principal plie
FR1462584A Pending FR3021815A1 (fr) 2014-08-08 2014-12-17 Procede de fabrication d'une matrice de connecteurs electriques

Family Applications After (1)

Application Number Title Priority Date Filing Date
FR1462584A Pending FR3021815A1 (fr) 2014-08-08 2014-12-17 Procede de fabrication d'une matrice de connecteurs electriques

Country Status (4)

Country Link
US (1) US10320097B2 (fr)
EP (1) EP3178134A1 (fr)
FR (2) FR3021814B1 (fr)
WO (1) WO2016020445A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016006774A1 (de) * 2016-06-02 2017-12-07 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Kontaktierungsanordnung
CN108682980B (zh) * 2018-04-24 2024-03-19 深圳市信维通信股份有限公司 零位移弹片连接器
CN113783066B (zh) * 2021-08-09 2023-10-24 番禺得意精密电子工业有限公司 电连接器及其制造方法

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2740097A (en) * 1951-04-19 1956-03-27 Hughes Aircraft Co Electrical hinge connector for circuit boards
US3391456A (en) * 1965-04-30 1968-07-09 Sylvania Electric Prod Multiple segment array making
US4827611A (en) * 1988-03-28 1989-05-09 Control Data Corporation Compliant S-leads for chip carriers
US5101553A (en) * 1991-04-29 1992-04-07 Microelectronics And Computer Technology Corporation Method of making a metal-on-elastomer pressure contact connector
AU661867B2 (en) * 1991-09-30 1995-08-10 General Dynamics Information Systems, Inc. Plated compliant lead
US5184962A (en) * 1991-12-05 1993-02-09 Burndy Corporation Electrical spring contact
DE4320527A1 (de) * 1992-06-22 1993-12-23 Whitaker Corp Elektrisch leitfähiges Gel
US6835898B2 (en) * 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
JP4025885B2 (ja) * 1998-02-06 2007-12-26 協伸工業株式会社 コネクタチップ及びテーピングコネクタチップ
US6116921A (en) * 1998-02-16 2000-09-12 The Whitaker Corporation Electrical connector having recessed solderball foot
US6888362B2 (en) * 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
US6280224B1 (en) * 2000-01-05 2001-08-28 Hon Hai Precision Ind. Co., Ltd. Electrical connector having a metallic inserted plate
US6957963B2 (en) * 2000-01-20 2005-10-25 Gryphics, Inc. Compliant interconnect assembly
US6532654B2 (en) * 2001-01-12 2003-03-18 International Business Machines Corporation Method of forming an electrical connector
US6530798B1 (en) * 2001-10-24 2003-03-11 Hon Hai Precision Ind. Co., Ltd. Ball grid array socket connector
US6948949B1 (en) * 2004-05-19 2005-09-27 Btx Technologies, Inc. Electrical connector with an improved terminal block
FR2872572B1 (fr) 2004-06-30 2006-09-22 Commissariat Energie Atomique Test de l'etancheite de mems ou de petits composants encapsules
US7422447B2 (en) * 2004-08-19 2008-09-09 Fci Americas Technology, Inc. Electrical connector with stepped housing
FR2888832B1 (fr) 2005-07-22 2007-08-24 Commissariat Energie Atomique Conditionnement d'un composant electronique
FR2910456B1 (fr) 2006-12-21 2018-02-09 Commissariat A L'energie Atomique Procede de realisation de microfils et/ou de nanofils
FR2910455B1 (fr) 2006-12-21 2009-04-03 Commissariat Energie Atomique Procede de realisation de micro-cavites non alignees et a differentes profondeurs
US7445460B1 (en) * 2007-06-07 2008-11-04 Hon Hai Precision Ind. Co., Ltd. Electrical connector with contact fall-out preventing arrangement
FR2941561B1 (fr) 2009-01-28 2011-05-13 Commissariat Energie Atomique Procede de fermeture de cavite pour au moins un dispositif microelectronique
FR2948928B1 (fr) 2009-08-06 2012-02-24 Commissariat Energie Atomique Structure a microcavite et structure d'encapsulation d'un dispositif microelectronique
JP5360900B2 (ja) * 2009-11-04 2013-12-04 北川工業株式会社 導電部品
JP2011165413A (ja) * 2010-02-08 2011-08-25 Shinko Electric Ind Co Ltd 電気コネクタ及びその製造方法
FR2967302B1 (fr) 2010-11-09 2012-12-21 Commissariat Energie Atomique Structure d'encapsulation d'un micro-dispositif comportant un matériau getter
JP5582995B2 (ja) * 2010-12-14 2014-09-03 新光電気工業株式会社 ソケット
FR2974895B1 (fr) 2011-05-02 2013-06-28 Commissariat Energie Atomique Gyrometre a capacites parasites reduites
FR2977883B1 (fr) 2011-07-11 2014-03-14 Commissariat Energie Atomique Structure getter a capacite de pompage optimisee
JP5794850B2 (ja) * 2011-07-26 2015-10-14 新光電気工業株式会社 接続端子構造の製造方法
JP2013055035A (ja) * 2011-08-09 2013-03-21 Yokowo Co Ltd コネクタ
FR2985602B1 (fr) 2012-01-05 2014-03-07 Commissariat Energie Atomique Procede de gravure d'un motif complexe
US9627306B2 (en) * 2012-02-15 2017-04-18 Cypress Semiconductor Corporation Ball grid structure
US8784117B2 (en) * 2012-07-17 2014-07-22 Hon Hai Precision Industry Co., Ltd. Electrical connector with X-type dual spring contacts for lower profile and lattice shielding therewith
FR3008965B1 (fr) 2013-07-26 2017-03-03 Commissariat Energie Atomique Structure d'encapsulation comprenant un capot renforce mecaniquement et a effet getter
FR3014240B1 (fr) 2013-11-29 2017-05-05 Commissariat Energie Atomique Procede de realisation d'un substrat comportant un materiau getter dispose sur des parois d'un ou plusieurs trous borgnes formes dans le substrat
FR3018916B1 (fr) 2014-03-19 2017-08-25 Commissariat Energie Atomique Capteur de mesure de pression differentielle microelectromecanique et/ou nanoelectromecanique

Also Published As

Publication number Publication date
US20170222340A1 (en) 2017-08-03
FR3021815A1 (fr) 2015-12-04
FR3021814A1 (fr) 2015-12-04
WO2016020445A1 (fr) 2016-02-11
US10320097B2 (en) 2019-06-11
EP3178134A1 (fr) 2017-06-14

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