FR2872572B1 - Test de l'etancheite de mems ou de petits composants encapsules - Google Patents

Test de l'etancheite de mems ou de petits composants encapsules

Info

Publication number
FR2872572B1
FR2872572B1 FR0451370A FR0451370A FR2872572B1 FR 2872572 B1 FR2872572 B1 FR 2872572B1 FR 0451370 A FR0451370 A FR 0451370A FR 0451370 A FR0451370 A FR 0451370A FR 2872572 B1 FR2872572 B1 FR 2872572B1
Authority
FR
France
Prior art keywords
mems
testing
sealing
encapsulated components
small encapsulated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0451370A
Other languages
English (en)
Other versions
FR2872572A1 (fr
Inventor
Crecy Francois De
Bernard Diem
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR0451370A priority Critical patent/FR2872572B1/fr
Priority to PCT/FR2005/050523 priority patent/WO2006008412A1/fr
Priority to EP05782184A priority patent/EP1761752A1/fr
Priority to JP2007518667A priority patent/JP2008504549A/ja
Priority to US11/630,471 priority patent/US7572053B2/en
Publication of FR2872572A1 publication Critical patent/FR2872572A1/fr
Application granted granted Critical
Publication of FR2872572B1 publication Critical patent/FR2872572B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M3/00Investigating fluid-tightness of structures
    • G01M3/002Investigating fluid-tightness of structures by using thermal means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M3/00Investigating fluid-tightness of structures
    • G01M3/02Investigating fluid-tightness of structures by using fluid or vacuum
    • G01M3/26Investigating fluid-tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors
    • G01M3/32Investigating fluid-tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors for containers, e.g. radiators
    • G01M3/3281Investigating fluid-tightness of structures by using fluid or vacuum by measuring rate of loss or gain of fluid, e.g. by pressure-responsive devices, by flow detectors for containers, e.g. radiators removably mounted in a test cell
FR0451370A 2004-06-30 2004-06-30 Test de l'etancheite de mems ou de petits composants encapsules Expired - Fee Related FR2872572B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR0451370A FR2872572B1 (fr) 2004-06-30 2004-06-30 Test de l'etancheite de mems ou de petits composants encapsules
PCT/FR2005/050523 WO2006008412A1 (fr) 2004-06-30 2005-06-29 Test de l'etancheite de mems ou de petits composants encapsules
EP05782184A EP1761752A1 (fr) 2004-06-30 2005-06-29 Test de l'etancheite de mems ou de petits composants encapsules
JP2007518667A JP2008504549A (ja) 2004-06-30 2005-06-29 Memsに関してのまたは小型封入デバイスに関しての密封試験
US11/630,471 US7572053B2 (en) 2004-06-30 2005-06-29 Tightness test for MEMS or for small encapsulated components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0451370A FR2872572B1 (fr) 2004-06-30 2004-06-30 Test de l'etancheite de mems ou de petits composants encapsules

Publications (2)

Publication Number Publication Date
FR2872572A1 FR2872572A1 (fr) 2006-01-06
FR2872572B1 true FR2872572B1 (fr) 2006-09-22

Family

ID=34946064

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0451370A Expired - Fee Related FR2872572B1 (fr) 2004-06-30 2004-06-30 Test de l'etancheite de mems ou de petits composants encapsules

Country Status (5)

Country Link
US (1) US7572053B2 (fr)
EP (1) EP1761752A1 (fr)
JP (1) JP2008504549A (fr)
FR (1) FR2872572B1 (fr)
WO (1) WO2006008412A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008013098B4 (de) * 2007-04-02 2012-02-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mikromechanisches System mit Temperaturstabilisierung
EP2015046A1 (fr) * 2007-06-06 2009-01-14 Infineon Technologies SensoNor AS Capteur de vide
DE102007038060A1 (de) * 2007-08-10 2009-02-12 Endress + Hauser Wetzer Gmbh + Co. Kg Vorrichtung zur Bestimmung und/oder Überwachung einer Prozessgröße
US20110260163A1 (en) * 2008-03-13 2011-10-27 University Of Utah Research Foundation Permeable diaphragm piezoresistive based sensors
US8267486B2 (en) * 2008-12-23 2012-09-18 Analog Devices, Inc. Apparatus and method of detecting microchip hermeticity
JP2011021964A (ja) * 2009-07-15 2011-02-03 Mtc:Kk 密封性能測定装置
JP5749510B2 (ja) * 2011-02-09 2015-07-15 株式会社アルバック 密閉型デバイス
FR3021814B1 (fr) 2014-08-08 2018-06-15 Commissariat Energie Atomique Connecteur pour la connexion en matrice entre un boitier et un support, comportant un corps principal plie
CN112504546B (zh) * 2020-11-11 2022-09-06 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所)(中国赛宝实验室)) 晶圆级气密封装的微小腔体内部气压测试方法和系统
CN114314498B (zh) * 2022-03-14 2022-06-03 南京元感微电子有限公司 Mems薄膜真空计及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH616743A5 (en) * 1977-07-01 1980-04-15 Bbc Brown Boveri & Cie Device for measuring the density of gaseous media.
US4682503A (en) * 1986-05-16 1987-07-28 Honeywell Inc. Microscopic size, thermal conductivity type, air or gas absolute pressure sensor
US4812801A (en) * 1987-05-14 1989-03-14 The United States Of America As Represented By The Secretary Of The Air Force Solid state gas pressure sensor
US5347869A (en) * 1993-03-25 1994-09-20 Opto Tech Corporation Structure of micro-pirani sensor
JPH11108790A (ja) * 1997-09-30 1999-04-23 Mitsumi Electric Co Ltd 圧電振動子モジュールのリーク検出方法
FR2770294B1 (fr) * 1997-10-23 1999-12-03 Gec Alsthom T & D Sa Procede pour determiner avec une grande precision un taux de fuite d'une enveloppe d'appareillage electrique
US6019505A (en) * 1997-12-31 2000-02-01 Honeywell Inc. Time lag approach for measuring thermal conductivity and specific heat
US6638784B2 (en) * 1999-06-24 2003-10-28 Rockwell Collins, Inc. Hermetic chip scale packaging means and method including self test
DE10123920B4 (de) * 2001-05-17 2006-02-02 Robert Bosch Gmbh Integriertes Mikrostruktursensorelement zur Erfassung thermodynamischer Größen eines Fluids
JP2003156376A (ja) * 2001-11-21 2003-05-30 Tokyo Gas Co Ltd ガスwi計測装置およびガス燃焼流量計測装置ならびにそれらに用いられるガス密度計測器
DE10319661A1 (de) * 2003-05-02 2004-11-18 Robert Bosch Gmbh Verkappter Mikrosensor
US7087451B2 (en) 2004-03-24 2006-08-08 Intel Corporation Microfabricated hot wire vacuum sensor

Also Published As

Publication number Publication date
US20070234782A1 (en) 2007-10-11
US7572053B2 (en) 2009-08-11
FR2872572A1 (fr) 2006-01-06
WO2006008412A1 (fr) 2006-01-26
JP2008504549A (ja) 2008-02-14
EP1761752A1 (fr) 2007-03-14

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