FR2874909B1 - Element de capteur micromecanique - Google Patents

Element de capteur micromecanique

Info

Publication number
FR2874909B1
FR2874909B1 FR0552686A FR0552686A FR2874909B1 FR 2874909 B1 FR2874909 B1 FR 2874909B1 FR 0552686 A FR0552686 A FR 0552686A FR 0552686 A FR0552686 A FR 0552686A FR 2874909 B1 FR2874909 B1 FR 2874909B1
Authority
FR
France
Prior art keywords
sensor element
micromechanical sensor
micromechanical
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0552686A
Other languages
English (en)
Other versions
FR2874909A1 (fr
Inventor
Hubert Benzel
Stefan Finkbeiner
Matthias Illing
Frank Schaefer
Simon Armbruster
Gerhard Lammel
Christoph Schelling
Joerg Brasas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR2874909A1 publication Critical patent/FR2874909A1/fr
Application granted granted Critical
Publication of FR2874909B1 publication Critical patent/FR2874909B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00047—Cavities
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G01L9/0045—Diaphragm associated with a buried cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0109—Bridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0111—Bulk micromachining
    • B81C2201/0115—Porous silicon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0111—Bulk micromachining
    • B81C2201/0116—Thermal treatment for structural rearrangement of substrate atoms, e.g. for making buried cavities

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
  • Micromachines (AREA)
FR0552686A 2004-09-08 2005-09-06 Element de capteur micromecanique Expired - Fee Related FR2874909B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102004043357.7A DE102004043357B4 (de) 2004-09-08 2004-09-08 Verfahren zur Herstellung eines mikromechanischen Sensorelements

Publications (2)

Publication Number Publication Date
FR2874909A1 FR2874909A1 (fr) 2006-03-10
FR2874909B1 true FR2874909B1 (fr) 2011-07-15

Family

ID=35851994

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0552686A Expired - Fee Related FR2874909B1 (fr) 2004-09-08 2005-09-06 Element de capteur micromecanique

Country Status (5)

Country Link
US (1) US7572661B2 (fr)
JP (1) JP2006075982A (fr)
DE (1) DE102004043357B4 (fr)
FR (1) FR2874909B1 (fr)
IT (1) ITMI20051638A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10244786A1 (de) * 2002-09-26 2004-04-08 Robert Bosch Gmbh Mikromechanisches Bauelement und Verfahren
DE102005060855A1 (de) 2005-12-20 2007-06-28 Robert Bosch Gmbh Mikromechanischer kapazitiver Druckwandler und Herstellungsverfahren
US7425465B2 (en) 2006-05-15 2008-09-16 Fujifilm Diamatix, Inc. Method of fabricating a multi-post structures on a substrate
DE102006028435A1 (de) 2006-06-21 2007-12-27 Robert Bosch Gmbh Sensor und Verfahren zu seiner Herstellung
EP1931173B1 (fr) * 2006-12-06 2011-07-20 Electronics and Telecommunications Research Institute Microphone condensateur doté d'un diaphragme d'articulation en flexion et son procédé de fabrication
DE102008054428A1 (de) 2008-12-09 2010-06-10 Robert Bosch Gmbh Aufbau eines Drucksensors
FI125960B (en) 2013-05-28 2016-04-29 Murata Manufacturing Co Improved pressure gauge box
US9321635B2 (en) * 2013-11-28 2016-04-26 Solid State System Co., Ltd. Method to release diaphragm in MEMS device
DE102014204664A1 (de) 2014-03-13 2015-09-17 Robert Bosch Gmbh Drucksensor und Verfahren zum Herstellen des Drucksensors
FR3069072B1 (fr) * 2017-07-11 2021-06-04 Commissariat Energie Atomique Procede de fabrication d'un micro/nano-filtre sur un micro/nano-canal ou micro/nano-cavite realise dans un substrat silicium

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4241045C1 (de) * 1992-12-05 1994-05-26 Bosch Gmbh Robert Verfahren zum anisotropen Ätzen von Silicium
KR0155141B1 (ko) * 1993-12-24 1998-10-15 손병기 다공질실리콘을 이용한 반도체 장치의 제조방법
GB9616225D0 (en) * 1996-08-01 1996-09-11 Surface Tech Sys Ltd Method of surface treatment of semiconductor substrates
DE19847455A1 (de) * 1998-10-15 2000-04-27 Bosch Gmbh Robert Verfahren zur Bearbeitung von Silizium mittels Ätzprozessen
DE69930099T2 (de) 1999-04-09 2006-08-31 Stmicroelectronics S.R.L., Agrate Brianza Herstellung von vergrabenen Hohlräumen in einer einkristallinen Halbleiterscheibe und Halbleiterscheibe
DE69941456D1 (de) * 1999-12-31 2009-11-05 St Microelectronics Srl Herstellungsverfahren eines SOI Wafers
DE10030352A1 (de) 2000-06-21 2002-01-10 Bosch Gmbh Robert Mikromechanisches Bauelement, insbesondere Sensorelement, mit einer stabilisierten Membran und Verfahren zur Herstellung eines derartigen Bauelements
DE10032579B4 (de) 2000-07-05 2020-07-02 Robert Bosch Gmbh Verfahren zur Herstellung eines Halbleiterbauelements sowie ein nach dem Verfahren hergestelltes Halbleiterbauelement
US6750153B2 (en) * 2000-10-24 2004-06-15 Nanosciences Corporation Process for producing macroscopic cavities beneath the surface of a silicon wafer
DE10054484A1 (de) * 2000-11-03 2002-05-08 Bosch Gmbh Robert Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren
ITVA20000042A1 (it) * 2000-12-15 2002-06-15 St Microelectronics Srl Sensore di pressione monoliticamente integrato e relativo processo direalizzazione.
DE10065026A1 (de) * 2000-12-23 2002-07-04 Bosch Gmbh Robert Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren
DE10114036A1 (de) * 2001-03-22 2002-10-02 Bosch Gmbh Robert Verfahren zur Herstellung von mikromechanischen Sensoren und damit hergestellte Sensoren
DE10118568A1 (de) * 2001-04-14 2002-10-17 Bosch Gmbh Robert Verfahren zum Erzeugen von optisch transparenten Bereichen in einem Siliziumsubstrat
DE10138759A1 (de) * 2001-08-07 2003-03-06 Bosch Gmbh Robert Verfahren zur Herstellung eines Halbleiterbauelements sowie Halbleiterbauelement, insbesondere Membransensor
DE102004036032A1 (de) * 2003-12-16 2005-07-21 Robert Bosch Gmbh Verfahren zur Herstellung eines Halbleiterbauelements sowie ein Halbleiterbauelement, insbesondere ein Membransensor

Also Published As

Publication number Publication date
US7572661B2 (en) 2009-08-11
ITMI20051638A1 (it) 2006-03-09
DE102004043357A1 (de) 2006-03-09
DE102004043357B4 (de) 2015-10-22
FR2874909A1 (fr) 2006-03-10
JP2006075982A (ja) 2006-03-23
US20060063293A1 (en) 2006-03-23

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20160531