JP2014195050A5 - - Google Patents

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Publication number
JP2014195050A5
JP2014195050A5 JP2014024551A JP2014024551A JP2014195050A5 JP 2014195050 A5 JP2014195050 A5 JP 2014195050A5 JP 2014024551 A JP2014024551 A JP 2014024551A JP 2014024551 A JP2014024551 A JP 2014024551A JP 2014195050 A5 JP2014195050 A5 JP 2014195050A5
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JP
Japan
Prior art keywords
substrate
pure water
soft
polishing
processing method
Prior art date
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Application number
JP2014024551A
Other languages
English (en)
Japanese (ja)
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JP2014195050A (ja
JP6378890B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2014024551A priority Critical patent/JP6378890B2/ja
Priority claimed from JP2014024551A external-priority patent/JP6378890B2/ja
Priority to TW103106213A priority patent/TWI601196B/zh
Priority to US14/191,365 priority patent/US9142398B2/en
Priority to KR1020140024083A priority patent/KR102213810B1/ko
Publication of JP2014195050A publication Critical patent/JP2014195050A/ja
Publication of JP2014195050A5 publication Critical patent/JP2014195050A5/ja
Application granted granted Critical
Publication of JP6378890B2 publication Critical patent/JP6378890B2/ja
Active legal-status Critical Current
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JP2014024551A 2013-03-01 2014-02-12 基板処理方法 Active JP6378890B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014024551A JP6378890B2 (ja) 2013-03-01 2014-02-12 基板処理方法
TW103106213A TWI601196B (zh) 2013-03-01 2014-02-25 基板處理方法
US14/191,365 US9142398B2 (en) 2013-03-01 2014-02-26 Substrate processing method
KR1020140024083A KR102213810B1 (ko) 2013-03-01 2014-02-28 기판 처리 방법

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013041149 2013-03-01
JP2013041149 2013-03-01
JP2014024551A JP6378890B2 (ja) 2013-03-01 2014-02-12 基板処理方法

Publications (3)

Publication Number Publication Date
JP2014195050A JP2014195050A (ja) 2014-10-09
JP2014195050A5 true JP2014195050A5 (enExample) 2017-03-02
JP6378890B2 JP6378890B2 (ja) 2018-08-22

Family

ID=51421136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014024551A Active JP6378890B2 (ja) 2013-03-01 2014-02-12 基板処理方法

Country Status (4)

Country Link
US (1) US9142398B2 (enExample)
JP (1) JP6378890B2 (enExample)
KR (1) KR102213810B1 (enExample)
TW (1) TWI601196B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102272661B1 (ko) 2014-10-02 2021-07-06 삼성디스플레이 주식회사 기판 세정 장치
US9293339B1 (en) * 2015-09-24 2016-03-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of polishing semiconductor substrate
US10269555B2 (en) 2015-09-30 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Post-CMP cleaning and apparatus
US9966266B2 (en) * 2016-04-25 2018-05-08 United Microelectronics Corp. Apparatus for semiconductor wafer treatment and semiconductor wafer treatment
JP2019216207A (ja) * 2018-06-14 2019-12-19 株式会社荏原製作所 基板処理方法
KR102265857B1 (ko) * 2019-09-04 2021-06-17 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
CN111536783B (zh) * 2020-07-10 2020-09-29 清华大学 喷射角度可调的马兰戈尼干燥装置

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JPH09270412A (ja) * 1996-04-01 1997-10-14 Canon Inc 洗浄装置及び洗浄方法
JPH10189511A (ja) 1996-12-20 1998-07-21 Sony Corp ウェーハ洗浄装置
JPH11214341A (ja) * 1998-01-28 1999-08-06 Kaijo Corp 被洗浄体のすすぎ方法
JP4260970B2 (ja) * 1999-03-24 2009-04-30 島田理化工業株式会社 半導体ウェーハ洗浄装置
JP4830091B2 (ja) * 2000-09-11 2011-12-07 公益財団法人国際科学振興財団 気液混合洗浄装置及び気液混合洗浄方法
JP4046486B2 (ja) * 2001-06-13 2008-02-13 Ｎｅｃエレクトロニクス株式会社 洗浄水及びウエハの洗浄方法
JP3553542B2 (ja) * 2001-11-29 2004-08-11 株式会社荏原製作所 半導体ウエハ研磨装置および方法
JP3973196B2 (ja) 2001-12-17 2007-09-12 東京エレクトロン株式会社 液処理方法及び液処理装置
US6955485B2 (en) * 2002-03-01 2005-10-18 Tokyo Electron Limited Developing method and developing unit
JP2004299814A (ja) * 2003-03-28 2004-10-28 Takasago Thermal Eng Co Ltd 除電された絶縁体基板の製造方法及び製造装置
JP4279032B2 (ja) * 2003-04-02 2009-06-17 高砂熱学工業株式会社 除電された絶縁体基板の製造方法及びその装置
JP2005032915A (ja) * 2003-07-10 2005-02-03 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2005072559A (ja) * 2003-08-05 2005-03-17 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
KR100512129B1 (ko) * 2003-08-14 2005-09-05 (주)선재하이테크 연 엑스선을 이용한 정전기 제거장치
WO2005123857A1 (en) * 2004-06-22 2005-12-29 Asahi Glass Company, Limited Polishing method for glass substrate, and glass substrate
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JP2007088398A (ja) * 2004-12-14 2007-04-05 Realize Advanced Technology Ltd 洗浄装置、この洗浄装置を用いた洗浄システム、及び被洗浄基板の洗浄方法
US20080278880A1 (en) * 2005-10-21 2008-11-13 Kondoh Industries, Ltd. Remover of Static Charges on Surfaces of Substrates of Semiconductors and Liquid Crystals in the Processes of Their Manufacture
US7947637B2 (en) * 2006-06-30 2011-05-24 Fujifilm Electronic Materials, U.S.A., Inc. Cleaning formulation for removing residues on surfaces
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JP2010199239A (ja) * 2009-02-24 2010-09-09 Tokyo Electron Ltd 被処理基板の除電方法及び基板処理装置
JP5295829B2 (ja) * 2009-03-12 2013-09-18 東京エレクトロン株式会社 基板洗浄方法
US8637395B2 (en) * 2009-11-16 2014-01-28 International Business Machines Corporation Methods for photo-patternable low-k (PPLK) integration with curing after pattern transfer
JP5783971B2 (ja) * 2012-08-10 2015-09-24 株式会社東芝 塗布装置および塗布方法
CN104662644B (zh) * 2012-09-27 2018-11-27 斯克林集团公司 处理液供给装置及方法、处理液及基板处理装置及方法
JP6044951B2 (ja) * 2012-09-27 2016-12-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

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