JP2015092538A5 - - Google Patents
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- Publication number
- JP2015092538A5 JP2015092538A5 JP2014141828A JP2014141828A JP2015092538A5 JP 2015092538 A5 JP2015092538 A5 JP 2015092538A5 JP 2014141828 A JP2014141828 A JP 2014141828A JP 2014141828 A JP2014141828 A JP 2014141828A JP 2015092538 A5 JP2015092538 A5 JP 2015092538A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- solvent
- volatile solvent
- water
- volatile
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 65
- 239000002904 solvent Substances 0.000 claims description 51
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 37
- 238000004140 cleaning Methods 0.000 claims description 18
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 238000003672 processing method Methods 0.000 claims description 7
- 238000005406 washing Methods 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 3
- 230000000694 effects Effects 0.000 claims 1
- 230000001737 promoting effect Effects 0.000 claims 1
- 238000005086 pumping Methods 0.000 claims 1
- 238000006467 substitution reaction Methods 0.000 claims 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical group CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 claims 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 description 1
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014141828A JP6426927B2 (ja) | 2013-09-30 | 2014-07-09 | 基板処理装置及び基板処理方法 |
| KR1020140106954A KR101971303B1 (ko) | 2013-09-30 | 2014-08-18 | 기판 처리 장치 및 기판 처리 방법 |
| US14/495,314 US20150090297A1 (en) | 2013-09-30 | 2014-09-24 | Substrate processing device and substrate processing method |
| CN201410513859.2A CN104517809B (zh) | 2013-09-30 | 2014-09-29 | 基板处理装置和基板处理方法 |
| EP14187005.5A EP2854164B1 (en) | 2013-09-30 | 2014-09-30 | Substrate processing device and substrate processing method |
| TW103133986A TWI649822B (zh) | 2013-09-30 | 2014-09-30 | 基板處理裝置及基板處理方法 |
| KR1020170026397A KR20170028914A (ko) | 2013-09-30 | 2017-02-28 | 기판 처리 장치 및 기판 처리 방법 |
| US15/608,554 US10406566B2 (en) | 2013-09-30 | 2017-05-30 | Substrate processing device and substrate processing method |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013205172 | 2013-09-30 | ||
| JP2013205172 | 2013-09-30 | ||
| JP2014141828A JP6426927B2 (ja) | 2013-09-30 | 2014-07-09 | 基板処理装置及び基板処理方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018142888A Division JP6585243B2 (ja) | 2013-09-30 | 2018-07-30 | 基板処理装置及び基板処理方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015092538A JP2015092538A (ja) | 2015-05-14 |
| JP2015092538A5 true JP2015092538A5 (enExample) | 2017-08-10 |
| JP6426927B2 JP6426927B2 (ja) | 2018-11-21 |
Family
ID=51730316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014141828A Active JP6426927B2 (ja) | 2013-09-30 | 2014-07-09 | 基板処理装置及び基板処理方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US20150090297A1 (enExample) |
| EP (1) | EP2854164B1 (enExample) |
| JP (1) | JP6426927B2 (enExample) |
| KR (2) | KR101971303B1 (enExample) |
| CN (1) | CN104517809B (enExample) |
| TW (1) | TWI649822B (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6563762B2 (ja) * | 2015-09-29 | 2019-08-21 | 芝浦メカトロニクス株式会社 | 基板処理装置及び基板処理方法 |
| JP6588819B2 (ja) * | 2015-12-24 | 2019-10-09 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
| CN106041331B (zh) * | 2016-06-21 | 2018-10-02 | 昆山国显光电有限公司 | 一种oled基板冷却系统 |
| US10971354B2 (en) | 2016-07-15 | 2021-04-06 | Applied Materials, Inc. | Drying high aspect ratio features |
| JP6798185B2 (ja) * | 2016-08-08 | 2020-12-09 | 東京エレクトロン株式会社 | 液処理方法、基板処理装置及び記憶媒体 |
| JP6693846B2 (ja) * | 2016-09-28 | 2020-05-13 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
| US10546762B2 (en) | 2016-11-18 | 2020-01-28 | Applied Materials, Inc. | Drying high aspect ratio features |
| CN107611010A (zh) * | 2017-08-31 | 2018-01-19 | 长江存储科技有限责任公司 | 一种晶圆清洗方法 |
| JP7227757B2 (ja) * | 2018-05-31 | 2023-02-22 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
| US11710647B2 (en) * | 2021-01-28 | 2023-07-25 | Applied Materials, Inc. | Hyperbaric clean method and apparatus for cleaning semiconductor chamber components |
| CN114975159A (zh) * | 2021-02-22 | 2022-08-30 | 顶程国际股份有限公司 | 湿式处理设备与湿式处理方法 |
| JP7726653B2 (ja) * | 2021-03-31 | 2025-08-20 | 芝浦メカトロニクス株式会社 | 基板乾燥装置及び基板処理装置 |
| JP7745359B2 (ja) * | 2021-04-16 | 2025-09-29 | 株式会社Screenホールディングス | 基板処理方法、基板処理装置および乾燥処理液 |
| JP7650719B2 (ja) * | 2021-05-17 | 2025-03-25 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
| KR102721924B1 (ko) * | 2021-07-12 | 2024-10-24 | 시바우라 메카트로닉스 가부시끼가이샤 | 유기막 형성 장치 및 유기막의 제조 방법 |
| JP2023019610A (ja) * | 2021-07-29 | 2023-02-09 | 株式会社Screenホールディングス | 基板処理方法 |
| JP7739157B2 (ja) * | 2021-11-30 | 2025-09-16 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW386235B (en) * | 1995-05-23 | 2000-04-01 | Tokyo Electron Ltd | Method for spin rinsing |
| JPH10195080A (ja) * | 1997-01-10 | 1998-07-28 | Toshiba Corp | 共沸組成物、これを用いた水切り蒸気乾燥剤、水切り蒸気乾燥方法および水切り蒸気乾燥装置 |
| GB2346953A (en) * | 1999-02-16 | 2000-08-23 | Stephen Rodger Henly | Removing water from articles |
| US6729040B2 (en) * | 1999-05-27 | 2004-05-04 | Oliver Design, Inc. | Apparatus and method for drying a substrate using hydrophobic and polar organic compounds |
| KR100634374B1 (ko) * | 2004-06-23 | 2006-10-16 | 삼성전자주식회사 | 기판을 건조하는 장치 및 방법 |
| JP2006093334A (ja) * | 2004-09-22 | 2006-04-06 | Ses Co Ltd | 基板処理装置 |
| JP4527660B2 (ja) * | 2005-06-23 | 2010-08-18 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
| JP2007038209A (ja) * | 2005-06-27 | 2007-02-15 | Shimada Phys & Chem Ind Co Ltd | 基板洗浄装置および基板洗浄方法 |
| JP2008034779A (ja) | 2006-06-27 | 2008-02-14 | Dainippon Screen Mfg Co Ltd | 基板処理方法および基板処理装置 |
| DE602007007161D1 (de) | 2006-09-14 | 2010-07-29 | Fujifilm Corp | Mittel zur Entfernung von Wasser aus einem Substrat, Verfahren zur Wasserentfernung und Trocknungsverfahren damit |
| US8021490B2 (en) | 2007-01-04 | 2011-09-20 | Eastman Chemical Company | Substrate cleaning processes through the use of solvents and systems |
| JP4879126B2 (ja) * | 2007-09-12 | 2012-02-22 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP4994990B2 (ja) * | 2007-08-03 | 2012-08-08 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置、プログラム、記録媒体および置換剤 |
| JP5404361B2 (ja) * | 2009-12-11 | 2014-01-29 | 株式会社東芝 | 半導体基板の表面処理装置及び方法 |
| KR101596750B1 (ko) * | 2010-06-23 | 2016-02-23 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 방법, 이 기판 처리 방법을 실행하기 위한 컴퓨터 프로그램이 기록된 기록 매체 및 기판 처리 장치 |
| JP5422497B2 (ja) * | 2010-06-23 | 2014-02-19 | 株式会社東芝 | 基板乾燥方法 |
| KR101256290B1 (ko) * | 2011-05-20 | 2013-04-18 | 주식회사 케이씨텍 | 기판 건조 장치 |
-
2014
- 2014-07-09 JP JP2014141828A patent/JP6426927B2/ja active Active
- 2014-08-18 KR KR1020140106954A patent/KR101971303B1/ko active Active
- 2014-09-24 US US14/495,314 patent/US20150090297A1/en not_active Abandoned
- 2014-09-29 CN CN201410513859.2A patent/CN104517809B/zh active Active
- 2014-09-30 EP EP14187005.5A patent/EP2854164B1/en not_active Not-in-force
- 2014-09-30 TW TW103133986A patent/TWI649822B/zh active
-
2017
- 2017-02-28 KR KR1020170026397A patent/KR20170028914A/ko not_active Withdrawn
- 2017-05-30 US US15/608,554 patent/US10406566B2/en active Active
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