JP2016036005A5 - - Google Patents

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Publication number
JP2016036005A5
JP2016036005A5 JP2014241478A JP2014241478A JP2016036005A5 JP 2016036005 A5 JP2016036005 A5 JP 2016036005A5 JP 2014241478 A JP2014241478 A JP 2014241478A JP 2014241478 A JP2014241478 A JP 2014241478A JP 2016036005 A5 JP2016036005 A5 JP 2016036005A5
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Japan
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roller
groove
guide
stage
moves along
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JP2014241478A
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JP6513940B2 (ja
JP2016036005A (ja
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JP2014241478A 2013-12-03 2014-11-28 積層体の作製装置 Expired - Fee Related JP6513940B2 (ja)

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Application Number Priority Date Filing Date Title
JP2014241478A JP6513940B2 (ja) 2013-12-03 2014-11-28 積層体の作製装置

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2013249751 2013-12-03
JP2013249751 2013-12-03
JP2014159799 2014-08-05
JP2014159799 2014-08-05
JP2014241478A JP6513940B2 (ja) 2013-12-03 2014-11-28 積層体の作製装置

Publications (3)

Publication Number Publication Date
JP2016036005A JP2016036005A (ja) 2016-03-17
JP2016036005A5 true JP2016036005A5 (enExample) 2018-01-18
JP6513940B2 JP6513940B2 (ja) 2019-05-15

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JP2014241478A Expired - Fee Related JP6513940B2 (ja) 2013-12-03 2014-11-28 積層体の作製装置

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US (2) US9427949B2 (enExample)
JP (1) JP6513940B2 (enExample)
KR (1) KR102179335B1 (enExample)
TW (1) TWI732735B (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8137417B2 (en) * 2006-09-29 2012-03-20 Semiconductor Energy Laboratory Co., Ltd. Peeling apparatus and manufacturing apparatus of semiconductor device
TWI671141B (zh) * 2013-08-30 2019-09-11 半導體能源研究所股份有限公司 支撐體供應裝置及供應支撐體的方法
WO2015083042A1 (ja) 2013-12-03 2015-06-11 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
JP6378530B2 (ja) 2014-05-03 2018-08-22 株式会社半導体エネルギー研究所 フィルム吸着機構
WO2015170208A1 (en) 2014-05-03 2015-11-12 Semiconductor Energy Laboratory Co., Ltd. Film-like member support apparatus
US9676175B2 (en) 2014-06-20 2017-06-13 Semiconductor Energy Laboratory Co., Ltd. Peeling apparatus
KR102398067B1 (ko) * 2014-11-05 2022-05-13 삼성디스플레이 주식회사 정전 척
CN104924733B (zh) * 2015-05-15 2017-04-05 京东方科技集团股份有限公司 膜层剥离装置和膜层剥离方法
TW201737766A (zh) * 2016-01-21 2017-10-16 康寧公司 處理基板的方法
DE102016104254A1 (de) * 2016-03-09 2017-10-26 Friedrich-Schiller-Universität Jena Verfahren zur Herstellung einer halbleitenden Folie und elektronisches Bauelement
US10181424B2 (en) 2016-04-12 2019-01-15 Semiconductor Energy Laboratory Co., Ltd. Peeling method and manufacturing method of flexible device
WO2017182909A1 (en) * 2016-04-22 2017-10-26 Semiconductor Energy Laboratory Co., Ltd. Separation method and manufacturing method of flexible device
US10804407B2 (en) * 2016-05-12 2020-10-13 Semiconductor Energy Laboratory Co., Ltd. Laser processing apparatus and stack processing apparatus
KR20230106750A (ko) 2016-07-29 2023-07-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 박리 방법, 표시 장치, 표시 모듈, 및 전자 기기
TW201808628A (zh) * 2016-08-09 2018-03-16 半導體能源研究所股份有限公司 半導體裝置的製造方法
KR102425705B1 (ko) * 2016-08-31 2022-07-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
DE102016119031B4 (de) * 2016-10-07 2025-08-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Wärmeisoliertes Mikrosystem
CN106356692B (zh) * 2016-10-28 2018-10-16 清华大学深圳研究生院 一种加工超导导线接头连接体的设备和方法
WO2018093719A1 (en) * 2016-11-15 2018-05-24 Corning Incorporated Methods for processing a substrate
US11117358B2 (en) 2017-03-30 2021-09-14 3M Innovative Properties Company Transfer articles
US10105862B1 (en) * 2017-03-31 2018-10-23 Biocut, Llc Fenestrated graft press cutting die assembly
CN206781204U (zh) * 2017-06-09 2017-12-22 合肥鑫晟光电科技有限公司 一种撕膜装置
JP6879840B2 (ja) * 2017-06-28 2021-06-02 株式会社ディスコ テープ貼り機及びテープ外し方法
US10384434B2 (en) 2017-08-31 2019-08-20 Industrial Technology Research Institute Separating device and separating method
CN107644950B (zh) * 2017-09-22 2019-06-25 武汉华星光电技术有限公司 一种对柔性面板和玻璃基板进行分离的装置及方法
US11237475B2 (en) * 2017-11-10 2022-02-01 Asml Netherlands B.V. EUV pellicles
CN111016402B (zh) * 2019-12-17 2022-03-22 京东方科技集团股份有限公司 膜材剥离设备和膜材剥离方法
KR102751035B1 (ko) * 2019-12-19 2025-01-07 삼성디스플레이 주식회사 박리 장치 및 그를 이용한 표시 장치의 제조 방법
US11390061B2 (en) * 2020-05-09 2022-07-19 Nps Co., Ltd. Curl removing apparatus for multi-layer film
CN115257144B (zh) * 2022-08-16 2024-03-12 无锡市天彩包装印刷有限公司 一种纸板贴面机及贴面工艺
US12623368B2 (en) 2023-10-23 2026-05-12 General Electric Company Systems and methods of automatic film removal
CN119734905B (zh) * 2025-03-04 2025-05-13 成都敏匠智能科技有限公司 一种可调节式的模块化片料底膜剥离结构

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06329329A (ja) * 1993-05-18 1994-11-29 Adtec Eng:Kk フィルム剥離装置
JP4619462B2 (ja) 1996-08-27 2011-01-26 セイコーエプソン株式会社 薄膜素子の転写方法
EP1351308B1 (en) 1996-08-27 2009-04-22 Seiko Epson Corporation Exfoliating method and transferring method of thin film device
USRE38466E1 (en) 1996-11-12 2004-03-16 Seiko Epson Corporation Manufacturing method of active matrix substrate, active matrix substrate and liquid crystal display device
US6127199A (en) 1996-11-12 2000-10-03 Seiko Epson Corporation Manufacturing method of active matrix substrate, active matrix substrate and liquid crystal display device
US5891297A (en) * 1997-10-29 1999-04-06 Sharp Microelectronics Technology, Inc. System and method for peeling a polarized film
JPH11246111A (ja) * 1998-03-03 1999-09-14 Dainippon Printing Co Ltd シート剥離装置およびシート剥離方法
JP3619058B2 (ja) * 1998-06-18 2005-02-09 キヤノン株式会社 半導体薄膜の製造方法
JP4027740B2 (ja) 2001-07-16 2007-12-26 株式会社半導体エネルギー研究所 半導体装置の作製方法
US8415208B2 (en) 2001-07-16 2013-04-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and peeling off method and method of manufacturing semiconductor device
JP2003128490A (ja) * 2001-10-23 2003-05-08 Sony Corp 薄膜剥離装置
US7973313B2 (en) 2003-02-24 2011-07-05 Semiconductor Energy Laboratory Co., Ltd. Thin film integrated circuit device, IC label, container comprising the thin film integrated circuit, manufacturing method of the thin film integrated circuit device, manufacturing method of the container, and management method of product having the container
US7271076B2 (en) 2003-12-19 2007-09-18 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device
CN101527270B (zh) 2004-06-02 2012-07-04 株式会社半导体能源研究所 一种半导体设备
US7534702B2 (en) * 2004-06-29 2009-05-19 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a semiconductor device
JP2006012697A (ja) * 2004-06-29 2006-01-12 Nec Kansai Ltd 発光表示装置
US7591863B2 (en) 2004-07-16 2009-09-22 Semiconductor Energy Laboratory Co., Ltd. Laminating system, IC sheet, roll of IC sheet, and method for manufacturing IC chip
KR101254277B1 (ko) 2004-07-30 2013-04-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 라미네이팅 시스템, ｉｃ 시트, ｉｃ 시트 두루마리, 및ｉｃ 칩의 제조방법
JP2006100728A (ja) * 2004-09-30 2006-04-13 Nitto Denko Corp 保護テープ剥離方法およびこれを用いた装置
US7566633B2 (en) 2005-02-25 2009-07-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US9040420B2 (en) 2005-03-01 2015-05-26 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device including peeling layers from substrates by etching
US7767543B2 (en) 2005-09-06 2010-08-03 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a micro-electro-mechanical device with a folded substrate
JP4459992B2 (ja) 2006-09-29 2010-04-28 株式会社半導体エネルギー研究所 剥離装置
US8048777B2 (en) 2006-09-29 2011-11-01 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP4402144B2 (ja) * 2006-09-29 2010-01-20 株式会社半導体エネルギー研究所 半導体装置の作製方法
US8137417B2 (en) 2006-09-29 2012-03-20 Semiconductor Energy Laboratory Co., Ltd. Peeling apparatus and manufacturing apparatus of semiconductor device
KR20080072183A (ko) * 2007-02-01 2008-08-06 삼성전자주식회사 필름 박리장치 및 그 방법
KR20080089730A (ko) * 2007-04-02 2008-10-08 삼성전자주식회사 편광판의 제거 장치 및 그 방법
US7855153B2 (en) 2008-02-08 2010-12-21 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
KR20120070387A (ko) * 2010-12-21 2012-06-29 (주)조인테크놀러지 기판 박리 장치
KR101989484B1 (ko) * 2012-07-09 2019-06-17 삼성디스플레이 주식회사 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템
CN202782096U (zh) * 2012-07-24 2013-03-13 北京京东方光电科技有限公司 一种偏光片剥离装置
WO2014129519A1 (en) 2013-02-20 2014-08-28 Semiconductor Energy Laboratory Co., Ltd. Peeling method, semiconductor device, and peeling apparatus
TWI671141B (zh) 2013-08-30 2019-09-11 半導體能源研究所股份有限公司 支撐體供應裝置及供應支撐體的方法
KR102285804B1 (ko) 2013-08-30 2021-08-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 적층의 가공 장치 및 가공 방법
TWI618131B (zh) 2013-08-30 2018-03-11 半導體能源研究所股份有限公司 剝離起點形成裝置及形成方法、疊層體製造裝置
US9925749B2 (en) 2013-09-06 2018-03-27 Semiconductor Energy Laboratory Co., Ltd. Bonding apparatus and stack body manufacturing apparatus
CN103560101B (zh) * 2013-11-11 2016-05-04 京东方科技集团股份有限公司 一种柔性器件剥离设备

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