JP2013197425A5 - - Google Patents

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Publication number
JP2013197425A5
JP2013197425A5 JP2012064655A JP2012064655A JP2013197425A5 JP 2013197425 A5 JP2013197425 A5 JP 2013197425A5 JP 2012064655 A JP2012064655 A JP 2012064655A JP 2012064655 A JP2012064655 A JP 2012064655A JP 2013197425 A5 JP2013197425 A5 JP 2013197425A5
Authority
JP
Japan
Prior art keywords
grinding
sic substrate
substrate
sic
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012064655A
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English (en)
Japanese (ja)
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JP2013197425A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012064655A priority Critical patent/JP2013197425A/ja
Priority claimed from JP2012064655A external-priority patent/JP2013197425A/ja
Publication of JP2013197425A publication Critical patent/JP2013197425A/ja
Publication of JP2013197425A5 publication Critical patent/JP2013197425A5/ja
Pending legal-status Critical Current

Links

JP2012064655A 2012-03-22 2012-03-22 炭化珪素基板の平坦化研削加工方法 Pending JP2013197425A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012064655A JP2013197425A (ja) 2012-03-22 2012-03-22 炭化珪素基板の平坦化研削加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012064655A JP2013197425A (ja) 2012-03-22 2012-03-22 炭化珪素基板の平坦化研削加工方法

Publications (2)

Publication Number Publication Date
JP2013197425A JP2013197425A (ja) 2013-09-30
JP2013197425A5 true JP2013197425A5 (enExample) 2013-11-28

Family

ID=49395977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012064655A Pending JP2013197425A (ja) 2012-03-22 2012-03-22 炭化珪素基板の平坦化研削加工方法

Country Status (1)

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JP (1) JP2013197425A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6935224B2 (ja) * 2017-04-25 2021-09-15 株式会社ディスコ ウエーハの生成方法
JP7537434B2 (ja) 2019-07-25 2024-08-21 Agc株式会社 積層部材
CN114127032B (zh) * 2019-07-25 2023-04-28 Agc株式会社 层叠构件
KR20230022408A (ko) * 2020-06-10 2023-02-15 에이지씨 가부시키가이샤 적층 부재
JPWO2021251246A1 (enExample) 2020-06-10 2021-12-16
JP7589507B2 (ja) * 2020-11-06 2024-11-26 住友金属鉱山株式会社 板状成形体の製造方法
JP7589508B2 (ja) * 2020-11-06 2024-11-26 住友金属鉱山株式会社 板状成形体の製造方法
TW202237395A (zh) 2021-01-20 2022-10-01 日商Agc股份有限公司 積層構件

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