JP2013004928A5 - - Google Patents

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Publication number
JP2013004928A5
JP2013004928A5 JP2011137789A JP2011137789A JP2013004928A5 JP 2013004928 A5 JP2013004928 A5 JP 2013004928A5 JP 2011137789 A JP2011137789 A JP 2011137789A JP 2011137789 A JP2011137789 A JP 2011137789A JP 2013004928 A5 JP2013004928 A5 JP 2013004928A5
Authority
JP
Japan
Prior art keywords
workpiece
polishing
polishing head
pressure
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011137789A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013004928A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011137789A priority Critical patent/JP2013004928A/ja
Priority claimed from JP2011137789A external-priority patent/JP2013004928A/ja
Priority to SG2013084462A priority patent/SG194964A1/en
Priority to KR1020137033820A priority patent/KR20140048887A/ko
Priority to PCT/JP2012/003454 priority patent/WO2012176376A1/ja
Priority to DE112012002411.7T priority patent/DE112012002411T5/de
Priority to US14/117,566 priority patent/US20140101925A1/en
Priority to CN201280029952.5A priority patent/CN103702798A/zh
Priority to TW101121349A priority patent/TW201321130A/zh
Publication of JP2013004928A publication Critical patent/JP2013004928A/ja
Publication of JP2013004928A5 publication Critical patent/JP2013004928A5/ja
Pending legal-status Critical Current

Links

JP2011137789A 2011-06-21 2011-06-21 研磨ヘッド、研磨装置及びワークの研磨方法 Pending JP2013004928A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2011137789A JP2013004928A (ja) 2011-06-21 2011-06-21 研磨ヘッド、研磨装置及びワークの研磨方法
CN201280029952.5A CN103702798A (zh) 2011-06-21 2012-05-28 研磨头、研磨装置及工件的研磨方法
DE112012002411.7T DE112012002411T5 (de) 2011-06-21 2012-05-28 Polierkopf, Poliervorrichtung und Verfahren zum Polieren eines Werkstücks
KR1020137033820A KR20140048887A (ko) 2011-06-21 2012-05-28 연마헤드, 연마장치 및 워크의 연마방법
PCT/JP2012/003454 WO2012176376A1 (ja) 2011-06-21 2012-05-28 研磨ヘッド、研磨装置及びワークの研磨方法
SG2013084462A SG194964A1 (en) 2011-06-21 2012-05-28 Polishing head, polishing apparatus, and method for polishing workpiece
US14/117,566 US20140101925A1 (en) 2011-06-21 2012-05-28 Polishing head, polishing apparatus, and method for polishing workpiece
TW101121349A TW201321130A (zh) 2011-06-21 2012-06-14 研磨頭、研磨裝置及工件的研磨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011137789A JP2013004928A (ja) 2011-06-21 2011-06-21 研磨ヘッド、研磨装置及びワークの研磨方法

Publications (2)

Publication Number Publication Date
JP2013004928A JP2013004928A (ja) 2013-01-07
JP2013004928A5 true JP2013004928A5 (enExample) 2014-01-09

Family

ID=47422242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011137789A Pending JP2013004928A (ja) 2011-06-21 2011-06-21 研磨ヘッド、研磨装置及びワークの研磨方法

Country Status (8)

Country Link
US (1) US20140101925A1 (enExample)
JP (1) JP2013004928A (enExample)
KR (1) KR20140048887A (enExample)
CN (1) CN103702798A (enExample)
DE (1) DE112012002411T5 (enExample)
SG (1) SG194964A1 (enExample)
TW (1) TW201321130A (enExample)
WO (1) WO2012176376A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101596561B1 (ko) * 2014-01-02 2016-03-07 주식회사 엘지실트론 웨이퍼 연마 장치
US9566687B2 (en) * 2014-10-13 2017-02-14 Sunedison Semiconductor Limited (Uen201334164H) Center flex single side polishing head having recess and cap
CN104282545A (zh) * 2014-10-15 2015-01-14 易德福 一种晶片研磨方法
GB2534130B (en) * 2015-01-06 2018-12-19 Smart Separations Ltd Apparatus and methods
JP6394569B2 (ja) * 2015-11-06 2018-09-26 信越半導体株式会社 ウェーハの研磨方法及び研磨装置
JP6508123B2 (ja) * 2016-05-13 2019-05-08 信越半導体株式会社 テンプレートアセンブリの選別方法及びワークの研磨方法並びにテンプレートアセンブリ
JP6312229B1 (ja) * 2017-06-12 2018-04-18 信越半導体株式会社 研磨方法及び研磨装置
CN111434458A (zh) * 2019-01-11 2020-07-21 株式会社 V 技术 研磨头及研磨装置
CN111390750B (zh) * 2020-03-25 2021-09-03 福建北电新材料科技有限公司 晶片面型加工装置
JP7363978B1 (ja) * 2022-07-04 2023-10-18 株式会社Sumco ウェーハ研磨条件の決定方法、ウェーハの製造方法およびウェーハ片面研磨システム
CN118528086B (zh) * 2024-07-29 2024-09-17 万向钱潮股份公司 一种轴承双端面加工方法及系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0970750A (ja) * 1995-09-07 1997-03-18 Sony Corp 基板研磨装置
JP2000198069A (ja) * 1998-10-30 2000-07-18 Shin Etsu Handotai Co Ltd 研磨用ワ―ク保持盤およびその製造方法ならびにワ―クの研磨方法および研磨装置
US6386957B1 (en) * 1998-10-30 2002-05-14 Shin-Etsu Handotai Co., Ltd. Workpiece holder for polishing, method for producing the same, method for polishing workpiece, and polishing apparatus
US6758726B2 (en) * 2002-06-28 2004-07-06 Lam Research Corporation Partial-membrane carrier head
CN100468646C (zh) * 2005-02-02 2009-03-11 联华电子股份有限公司 化学机械研磨方法

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