TW201321130A - 研磨頭、研磨裝置及工件的研磨方法 - Google Patents

研磨頭、研磨裝置及工件的研磨方法 Download PDF

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Publication number
TW201321130A
TW201321130A TW101121349A TW101121349A TW201321130A TW 201321130 A TW201321130 A TW 201321130A TW 101121349 A TW101121349 A TW 101121349A TW 101121349 A TW101121349 A TW 101121349A TW 201321130 A TW201321130 A TW 201321130A
Authority
TW
Taiwan
Prior art keywords
workpiece
polishing
shape
polishing head
pressure
Prior art date
Application number
TW101121349A
Other languages
English (en)
Chinese (zh)
Inventor
榤村壽
Original Assignee
信越半導體股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 信越半導體股份有限公司 filed Critical 信越半導體股份有限公司
Publication of TW201321130A publication Critical patent/TW201321130A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/10—Auxiliary devices, e.g. bolsters, extension members
    • B23Q3/106—Auxiliary devices, e.g. bolsters, extension members extendable members, e.g. extension members
    • B23Q3/107—Auxiliary devices, e.g. bolsters, extension members extendable members, e.g. extension members with positive adjustment means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/129—Preparing bulk and homogeneous wafers by polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49998—Work holding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW101121349A 2011-06-21 2012-06-14 研磨頭、研磨裝置及工件的研磨方法 TW201321130A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011137789A JP2013004928A (ja) 2011-06-21 2011-06-21 研磨ヘッド、研磨装置及びワークの研磨方法

Publications (1)

Publication Number Publication Date
TW201321130A true TW201321130A (zh) 2013-06-01

Family

ID=47422242

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101121349A TW201321130A (zh) 2011-06-21 2012-06-14 研磨頭、研磨裝置及工件的研磨方法

Country Status (8)

Country Link
US (1) US20140101925A1 (enExample)
JP (1) JP2013004928A (enExample)
KR (1) KR20140048887A (enExample)
CN (1) CN103702798A (enExample)
DE (1) DE112012002411T5 (enExample)
SG (1) SG194964A1 (enExample)
TW (1) TW201321130A (enExample)
WO (1) WO2012176376A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI722164B (zh) * 2016-05-13 2021-03-21 日商信越半導體股份有限公司 模板組件的選別方法以及工件的研磨方法及模板組件

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101596561B1 (ko) * 2014-01-02 2016-03-07 주식회사 엘지실트론 웨이퍼 연마 장치
US9566687B2 (en) * 2014-10-13 2017-02-14 Sunedison Semiconductor Limited (Uen201334164H) Center flex single side polishing head having recess and cap
CN104282545A (zh) * 2014-10-15 2015-01-14 易德福 一种晶片研磨方法
GB2534130B (en) * 2015-01-06 2018-12-19 Smart Separations Ltd Apparatus and methods
JP6394569B2 (ja) * 2015-11-06 2018-09-26 信越半導体株式会社 ウェーハの研磨方法及び研磨装置
JP6312229B1 (ja) * 2017-06-12 2018-04-18 信越半導体株式会社 研磨方法及び研磨装置
CN111434458A (zh) * 2019-01-11 2020-07-21 株式会社 V 技术 研磨头及研磨装置
CN111390750B (zh) * 2020-03-25 2021-09-03 福建北电新材料科技有限公司 晶片面型加工装置
JP7363978B1 (ja) 2022-07-04 2023-10-18 株式会社Sumco ウェーハ研磨条件の決定方法、ウェーハの製造方法およびウェーハ片面研磨システム
CN118528086B (zh) * 2024-07-29 2024-09-17 万向钱潮股份公司 一种轴承双端面加工方法及系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0970750A (ja) * 1995-09-07 1997-03-18 Sony Corp 基板研磨装置
JP2000198069A (ja) * 1998-10-30 2000-07-18 Shin Etsu Handotai Co Ltd 研磨用ワ―ク保持盤およびその製造方法ならびにワ―クの研磨方法および研磨装置
KR100668161B1 (ko) * 1998-10-30 2007-01-11 신에쯔 한도타이 가부시키가이샤 연마용 워크피스 홀더 및 그 제조방법, 워크피스의 연마방법 및 연마장치
US6758726B2 (en) * 2002-06-28 2004-07-06 Lam Research Corporation Partial-membrane carrier head
CN100468646C (zh) * 2005-02-02 2009-03-11 联华电子股份有限公司 化学机械研磨方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI722164B (zh) * 2016-05-13 2021-03-21 日商信越半導體股份有限公司 模板組件的選別方法以及工件的研磨方法及模板組件

Also Published As

Publication number Publication date
WO2012176376A1 (ja) 2012-12-27
SG194964A1 (en) 2013-12-30
US20140101925A1 (en) 2014-04-17
KR20140048887A (ko) 2014-04-24
JP2013004928A (ja) 2013-01-07
DE112012002411T5 (de) 2014-04-30
CN103702798A (zh) 2014-04-02

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