JP2009208214A5 - - Google Patents

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Publication number
JP2009208214A5
JP2009208214A5 JP2008055946A JP2008055946A JP2009208214A5 JP 2009208214 A5 JP2009208214 A5 JP 2009208214A5 JP 2008055946 A JP2008055946 A JP 2008055946A JP 2008055946 A JP2008055946 A JP 2008055946A JP 2009208214 A5 JP2009208214 A5 JP 2009208214A5
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JP
Japan
Prior art keywords
polishing
substrate
outer peripheral
peripheral portion
polishing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008055946A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009208214A (ja
JP5393039B2 (ja
Filing date
Publication date
Priority claimed from JP2008055946A external-priority patent/JP5393039B2/ja
Priority to JP2008055946A priority Critical patent/JP5393039B2/ja
Application filed filed Critical
Priority to US12/379,983 priority patent/US9138854B2/en
Publication of JP2009208214A publication Critical patent/JP2009208214A/ja
Publication of JP2009208214A5 publication Critical patent/JP2009208214A5/ja
Priority to JP2013156521A priority patent/JP5827976B2/ja
Publication of JP5393039B2 publication Critical patent/JP5393039B2/ja
Application granted granted Critical
Priority to JP2015025116A priority patent/JP6018656B2/ja
Priority to US14/828,972 priority patent/US9649739B2/en
Priority to US15/485,446 priority patent/US10137552B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008055946A 2008-03-06 2008-03-06 研磨装置 Active JP5393039B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2008055946A JP5393039B2 (ja) 2008-03-06 2008-03-06 研磨装置
US12/379,983 US9138854B2 (en) 2008-03-06 2009-03-05 Polishing apparatus
JP2013156521A JP5827976B2 (ja) 2008-03-06 2013-07-29 研磨装置
JP2015025116A JP6018656B2 (ja) 2008-03-06 2015-02-12 研磨装置および研磨方法
US14/828,972 US9649739B2 (en) 2008-03-06 2015-08-18 Polishing apparatus
US15/485,446 US10137552B2 (en) 2008-03-06 2017-04-12 Polishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008055946A JP5393039B2 (ja) 2008-03-06 2008-03-06 研磨装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013156521A Division JP5827976B2 (ja) 2008-03-06 2013-07-29 研磨装置

Publications (3)

Publication Number Publication Date
JP2009208214A JP2009208214A (ja) 2009-09-17
JP2009208214A5 true JP2009208214A5 (enExample) 2010-10-07
JP5393039B2 JP5393039B2 (ja) 2014-01-22

Family

ID=41054106

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2008055946A Active JP5393039B2 (ja) 2008-03-06 2008-03-06 研磨装置
JP2013156521A Active JP5827976B2 (ja) 2008-03-06 2013-07-29 研磨装置
JP2015025116A Active JP6018656B2 (ja) 2008-03-06 2015-02-12 研磨装置および研磨方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2013156521A Active JP5827976B2 (ja) 2008-03-06 2013-07-29 研磨装置
JP2015025116A Active JP6018656B2 (ja) 2008-03-06 2015-02-12 研磨装置および研磨方法

Country Status (2)

Country Link
US (3) US9138854B2 (enExample)
JP (3) JP5393039B2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5254575B2 (ja) * 2007-07-11 2013-08-07 株式会社東芝 研磨装置および研磨方法
JP5663295B2 (ja) 2010-01-15 2015-02-04 株式会社荏原製作所 研磨装置、研磨方法、研磨具を押圧する押圧部材
JP5571409B2 (ja) 2010-02-22 2014-08-13 株式会社荏原製作所 半導体装置の製造方法
JP2011177842A (ja) 2010-03-02 2011-09-15 Ebara Corp 研磨装置及び研磨方法
JP2011224680A (ja) * 2010-04-16 2011-11-10 Ebara Corp 研磨方法及び研磨装置
JP5464497B2 (ja) * 2010-08-19 2014-04-09 株式会社サンシン 基板研磨方法及びその装置
JP5886602B2 (ja) 2011-03-25 2016-03-16 株式会社荏原製作所 研磨装置および研磨方法
US9457447B2 (en) * 2011-03-28 2016-10-04 Ebara Corporation Polishing apparatus and polishing method
TWI663018B (zh) * 2012-09-24 2019-06-21 日商荏原製作所股份有限公司 研磨方法及研磨裝置
JP2017148931A (ja) * 2016-02-19 2017-08-31 株式会社荏原製作所 研磨装置および研磨方法
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
JP6908496B2 (ja) * 2017-10-25 2021-07-28 株式会社荏原製作所 研磨装置

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JPS62193764A (ja) * 1986-02-18 1987-08-25 Hitachi Electronics Eng Co Ltd デイスク基板の研摩装置
JPS63251166A (ja) * 1987-04-07 1988-10-18 Hitachi Ltd ウエハチヤツク
JPH029562A (ja) * 1988-06-28 1990-01-12 Fuji Photo Film Co Ltd バーニッシュ装置
JP2995367B2 (ja) * 1992-06-20 1999-12-27 株式会社サンシン フィルタ基板研磨装置
US5443415A (en) * 1993-09-24 1995-08-22 International Technology Partners, Inc. Burnishing apparatus for flexible magnetic disks and method therefor
JP2895757B2 (ja) * 1994-08-05 1999-05-24 日本ミクロコーティング株式会社 研磨装置
JPH08108359A (ja) * 1994-10-07 1996-04-30 Fuji Photo Film Co Ltd 研磨装置
JP3348429B2 (ja) * 1996-12-26 2002-11-20 信越半導体株式会社 薄板ワーク平面研削方法
US5980368A (en) * 1997-11-05 1999-11-09 Aplex Group Polishing tool having a sealed fluid chamber for support of polishing pad
US5964646A (en) * 1997-11-17 1999-10-12 Strasbaugh Grinding process and apparatus for planarizing sawed wafers
US6165057A (en) * 1998-05-15 2000-12-26 Gill, Jr.; Gerald L. Apparatus for localized planarization of semiconductor wafer surface
JP4487353B2 (ja) * 1999-11-26 2010-06-23 ソニー株式会社 研磨装置および研磨方法
JP2001205549A (ja) 2000-01-25 2001-07-31 Speedfam Co Ltd 基板エッジ部の片面研磨方法およびその装置
US6267659B1 (en) * 2000-05-04 2001-07-31 International Business Machines Corporation Stacked polish pad
JP4135301B2 (ja) * 2000-07-17 2008-08-20 ソニー株式会社 記録媒体の製造方法と製造装置
JP2002100593A (ja) * 2000-09-21 2002-04-05 Nikon Corp 研磨装置、これを用いた半導体デバイスの製造方法及びこの製造方法により製造された半導体デバイス
US6939206B2 (en) * 2001-03-12 2005-09-06 Asm Nutool, Inc. Method and apparatus of sealing wafer backside for full-face electrochemical plating
JP4090247B2 (ja) * 2002-02-12 2008-05-28 株式会社荏原製作所 基板処理装置
US6790128B1 (en) * 2002-03-29 2004-09-14 Lam Research Corporation Fluid conserving platen for optimizing edge polishing
JP2004103825A (ja) * 2002-09-10 2004-04-02 Nihon Micro Coating Co Ltd 半導体ウエハエッジ研磨装置及び方法
JP4125148B2 (ja) * 2003-02-03 2008-07-30 株式会社荏原製作所 基板処理装置
US7682225B2 (en) * 2004-02-25 2010-03-23 Ebara Corporation Polishing apparatus and substrate processing apparatus
JP4284215B2 (ja) 2004-03-24 2009-06-24 株式会社東芝 基板処理方法
JP2005305586A (ja) 2004-04-20 2005-11-04 Nihon Micro Coating Co Ltd 研磨装置
US20060019417A1 (en) * 2004-07-26 2006-01-26 Atsushi Shigeta Substrate processing method and substrate processing apparatus
WO2006112532A1 (en) 2005-04-19 2006-10-26 Ebara Corporation Substrate processing apparatus
JP2007189208A (ja) 2005-12-12 2007-07-26 Ses Co Ltd ベベル処理方法及びベベル処理装置
JP2007208161A (ja) 2006-02-06 2007-08-16 Renesas Technology Corp 半導体装置の製造方法および半導体基板
JP4927504B2 (ja) * 2006-11-09 2012-05-09 株式会社ディスコ ウエーハの研削方法および研削装置
JP5048997B2 (ja) * 2006-11-10 2012-10-17 株式会社ディスコ ウエーハの研削装置および研削方法
TW200908123A (en) * 2007-05-21 2009-02-16 Applied Materials Inc Methods and apparatus to control substrate bevel and edge polishing profiles of films
JP5147417B2 (ja) * 2008-01-08 2013-02-20 株式会社ディスコ ウェーハの研磨方法および研磨装置
JP5160993B2 (ja) * 2008-07-25 2013-03-13 株式会社荏原製作所 基板処理装置

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