JP2008306180A5 - - Google Patents

Download PDF

Info

Publication number
JP2008306180A5
JP2008306180A5 JP2008132105A JP2008132105A JP2008306180A5 JP 2008306180 A5 JP2008306180 A5 JP 2008306180A5 JP 2008132105 A JP2008132105 A JP 2008132105A JP 2008132105 A JP2008132105 A JP 2008132105A JP 2008306180 A5 JP2008306180 A5 JP 2008306180A5
Authority
JP
Japan
Prior art keywords
substrate
edge
backing plate
film
profile
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008132105A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008306180A (ja
Filing date
Publication date
Application filed filed Critical
Publication of JP2008306180A publication Critical patent/JP2008306180A/ja
Publication of JP2008306180A5 publication Critical patent/JP2008306180A5/ja
Pending legal-status Critical Current

Links

JP2008132105A 2007-05-21 2008-05-20 膜の基板斜面及び縁部の研磨プロファイルを制御する方法及び装置 Pending JP2008306180A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US93934307P 2007-05-21 2007-05-21

Publications (2)

Publication Number Publication Date
JP2008306180A JP2008306180A (ja) 2008-12-18
JP2008306180A5 true JP2008306180A5 (enExample) 2011-06-23

Family

ID=40072855

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008132105A Pending JP2008306180A (ja) 2007-05-21 2008-05-20 膜の基板斜面及び縁部の研磨プロファイルを制御する方法及び装置

Country Status (3)

Country Link
US (1) US20080293336A1 (enExample)
JP (1) JP2008306180A (enExample)
TW (1) TW200908123A (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080293333A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for controlling the size of an edge exclusion zone of a substrate
JP2008306179A (ja) * 2007-05-21 2008-12-18 Applied Materials Inc バッキングパッドを使用して基板の両面の縁部から膜及び薄片を除去する方法及び装置
JP2008284684A (ja) * 2007-05-21 2008-11-27 Applied Materials Inc 研磨アームを使用して基板の縁部を研磨する方法及び装置
TW200908122A (en) * 2007-05-21 2009-02-16 Applied Materials Inc Methods and apparatus for using a rolling backing pad for substrate polishing
JP2008284683A (ja) * 2007-05-21 2008-11-27 Applied Materials Inc 基板の振動により基板のノッチを研磨する方法及び装置
TW200908124A (en) * 2007-05-21 2009-02-16 Applied Materials Inc Methods and apparatus for using a bevel polishing head with an efficient tape routing arrangement
US20080291448A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for finding a substrate notch center
US20080293329A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for identifying a substrate edge profile and adjusting the processing of the substrate according to the identified edge profile
JP2009119537A (ja) * 2007-11-12 2009-06-04 Toshiba Corp 基板処理方法及び基板処理装置
JP5393039B2 (ja) * 2008-03-06 2014-01-22 株式会社荏原製作所 研磨装置
TW201002472A (en) * 2008-04-21 2010-01-16 Applied Materials Inc Apparatus and methods for using a polishing tape cassette
US20100105290A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Methods and apparatus for indicating a polishing tape end
JP5663295B2 (ja) * 2010-01-15 2015-02-04 株式会社荏原製作所 研磨装置、研磨方法、研磨具を押圧する押圧部材
JP2011224680A (ja) * 2010-04-16 2011-11-10 Ebara Corp 研磨方法及び研磨装置
US8968537B2 (en) 2011-02-09 2015-03-03 Applied Materials, Inc. PVD sputtering target with a protected backing plate
JP5886602B2 (ja) 2011-03-25 2016-03-16 株式会社荏原製作所 研磨装置および研磨方法
US9457447B2 (en) 2011-03-28 2016-10-04 Ebara Corporation Polishing apparatus and polishing method
JP6223873B2 (ja) * 2014-03-14 2017-11-01 株式会社荏原製作所 研磨装置及び研磨方法
EP3567138B1 (en) 2018-05-11 2020-03-25 SiCrystal GmbH Chamfered silicon carbide substrate and method of chamfering
EP3567139B1 (en) 2018-05-11 2021-04-07 SiCrystal GmbH Chamfered silicon carbide substrate and method of chamfering
JP2021037585A (ja) * 2019-09-03 2021-03-11 株式会社荏原製作所 研磨装置

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4533399A (en) * 1983-04-12 1985-08-06 Minnesota Mining And Manufacturing Company Contact lens cleaning method
US5117590A (en) * 1988-08-12 1992-06-02 Shin-Etsu Handotai Co., Ltd. Method of automatically chamfering a wafer and apparatus therefor
JP2719855B2 (ja) * 1991-05-24 1998-02-25 信越半導体株式会社 ウエーハ外周の鏡面面取り装置
JP2559650B2 (ja) * 1991-11-27 1996-12-04 信越半導体株式会社 ウエーハ面取部研磨装置
US5868857A (en) * 1996-12-30 1999-02-09 Intel Corporation Rotating belt wafer edge cleaning apparatus
AT408856B (de) * 1997-12-02 2002-03-25 Lisec Peter Vorrichtung zum automatischen säumen von plattenförmigen gegenständen
JP3197253B2 (ja) * 1998-04-13 2001-08-13 株式会社日平トヤマ ウエーハの面取り方法
US6739947B1 (en) * 1998-11-06 2004-05-25 Beaver Creek Concepts Inc In situ friction detector method and apparatus
JP2001205549A (ja) * 2000-01-25 2001-07-31 Speedfam Co Ltd 基板エッジ部の片面研磨方法およびその装置
US6629875B2 (en) * 2000-01-28 2003-10-07 Accretech Usa, Inc. Machine for grinding-polishing of a water edge
JP2002043267A (ja) * 2000-07-21 2002-02-08 Ebara Corp 基板洗浄装置、基板洗浄方法及び基板処理装置
US6257953B1 (en) * 2000-09-25 2001-07-10 Center For Tribology, Inc. Method and apparatus for controlled polishing
US6488567B1 (en) * 2000-11-09 2002-12-03 Axsun Technologies, Inc. System and method for automated fiber polishing
JP2002219642A (ja) * 2001-01-24 2002-08-06 Fuji Electric Co Ltd 磁気記録媒体用ガラス基板およびその製造方法、並びに該基板を用いた磁気記録媒体
JP2002329687A (ja) * 2001-05-02 2002-11-15 Speedfam Co Ltd デバイスウエハの外周研磨装置及び研磨方法
JP3949941B2 (ja) * 2001-11-26 2007-07-25 株式会社東芝 半導体装置の製造方法および研磨装置
JP4090247B2 (ja) * 2002-02-12 2008-05-28 株式会社荏原製作所 基板処理装置
JP4125148B2 (ja) * 2003-02-03 2008-07-30 株式会社荏原製作所 基板処理装置
US7682225B2 (en) * 2004-02-25 2010-03-23 Ebara Corporation Polishing apparatus and substrate processing apparatus
JP4284215B2 (ja) * 2004-03-24 2009-06-24 株式会社東芝 基板処理方法
JP5026957B2 (ja) * 2004-10-15 2012-09-19 株式会社東芝 研磨装置及び研磨方法
JP2006142388A (ja) * 2004-11-16 2006-06-08 Nihon Micro Coating Co Ltd 研磨テープ及び方法
US20060243304A1 (en) * 2005-04-25 2006-11-02 Applied Materials, Inc. Methods and apparatus for cleaning an edge of a substrate
US20070131653A1 (en) * 2005-12-09 2007-06-14 Ettinger Gary C Methods and apparatus for processing a substrate
JP2008036783A (ja) * 2006-08-08 2008-02-21 Sony Corp 研磨方法および研磨装置
JP2008306179A (ja) * 2007-05-21 2008-12-18 Applied Materials Inc バッキングパッドを使用して基板の両面の縁部から膜及び薄片を除去する方法及び装置
JP2008284684A (ja) * 2007-05-21 2008-11-27 Applied Materials Inc 研磨アームを使用して基板の縁部を研磨する方法及び装置
US20080293329A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for identifying a substrate edge profile and adjusting the processing of the substrate according to the identified edge profile
US20080293333A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for controlling the size of an edge exclusion zone of a substrate
TW200908124A (en) * 2007-05-21 2009-02-16 Applied Materials Inc Methods and apparatus for using a bevel polishing head with an efficient tape routing arrangement
US20080291448A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for finding a substrate notch center
US20080293344A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for polishing a notch of a substrate using a polishing pad
JP2008284683A (ja) * 2007-05-21 2008-11-27 Applied Materials Inc 基板の振動により基板のノッチを研磨する方法及び装置
JP2008290233A (ja) * 2007-05-21 2008-12-04 Applied Materials Inc 半導体製造における基板斜面及び縁部の研磨用の高性能及び低価格の研磨テープのための方法及び装置
TW200908122A (en) * 2007-05-21 2009-02-16 Applied Materials Inc Methods and apparatus for using a rolling backing pad for substrate polishing

Similar Documents

Publication Publication Date Title
JP2008306180A5 (enExample)
JP2009534194A5 (enExample)
JP2009208214A5 (enExample)
TW200908123A (en) Methods and apparatus to control substrate bevel and edge polishing profiles of films
JP2009197239A5 (enExample)
JP2009532114A5 (enExample)
WO2010008824A3 (en) Closed-loop control for effective pad conditioning
WO2010039409A3 (en) Apparatus and method for cleaning semiconductor substrate using pressurized fluid
JP2013004928A5 (enExample)
JP2014233815A5 (ja) 研磨ヘッドの製造方法
EP2397255A3 (en) Method and apparatus for dressing polishing pad
WO2010059645A3 (en) Method and apparatus for linear pad conditioning
WO2015008210A3 (en) Flexible abrasive for polishing surfaces
JP2012151320A5 (ja) ウェーハ洗浄装置及び洗浄方法
US9004900B2 (en) Material forming apparatus
ATE549124T1 (de) Schleifen von flächen an werkstücken
CN103991031A (zh) 具有双转向的夹持大小头扳手装置
CN204414310U (zh) 自动修坯装置
CN203442415U (zh) 防腐胶带缠绕机构
JP2011224894A5 (enExample)
CN109158456A (zh) 一种便于操作的手动弯管机
JP2012505762A5 (enExample)
JP2018510771A5 (enExample)
ATE534486T1 (de) Verfahren zum betreiben einer doppelseitenschleifmaschine sowie doppelseitenschleifmaschine
ATE397998T1 (de) Aufnahme für ein schleifwerkzeug, schleifwerkzeug und tragkörper für ein schleifwerkzeug