WO2010059645A3 - Method and apparatus for linear pad conditioning - Google Patents

Method and apparatus for linear pad conditioning Download PDF

Info

Publication number
WO2010059645A3
WO2010059645A3 PCT/US2009/064855 US2009064855W WO2010059645A3 WO 2010059645 A3 WO2010059645 A3 WO 2010059645A3 US 2009064855 W US2009064855 W US 2009064855W WO 2010059645 A3 WO2010059645 A3 WO 2010059645A3
Authority
WO
WIPO (PCT)
Prior art keywords
polishing pad
conditioning
coupled
arm member
rotating
Prior art date
Application number
PCT/US2009/064855
Other languages
French (fr)
Other versions
WO2010059645A2 (en
Inventor
Alpay Yilmaz
Edward Golubovsky
Jagan Rangarajan
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to JP2011537555A priority Critical patent/JP2012510160A/en
Publication of WO2010059645A2 publication Critical patent/WO2010059645A2/en
Publication of WO2010059645A3 publication Critical patent/WO2010059645A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Abstract

A method and apparatus for conditioning a polishing pad is described. The apparatus includes a base coupled to a platform, a first arm member having a first end coupled to the base, and a second arm member having a first end pivotably coupled to a second end of the first arm member and a conditioning disk coupled to a second end opposite the first end. The method includes rotating a polishing pad, urging a rotating conditioning disk against a polishing surface of the polishing pad, and moving the conditioning disk in a linear direction relative to the rotating polishing pad to perform a conditioning process.
PCT/US2009/064855 2008-11-24 2009-11-17 Method and apparatus for linear pad conditioning WO2010059645A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011537555A JP2012510160A (en) 2008-11-24 2009-11-17 Method and apparatus for conditioning a pad by linear motion

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11753608P 2008-11-24 2008-11-24
US61/117,536 2008-11-24
US12/615,216 2009-11-09
US12/615,216 US20100130107A1 (en) 2008-11-24 2009-11-09 Method and apparatus for linear pad conditioning

Publications (2)

Publication Number Publication Date
WO2010059645A2 WO2010059645A2 (en) 2010-05-27
WO2010059645A3 true WO2010059645A3 (en) 2010-08-26

Family

ID=42196758

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/064855 WO2010059645A2 (en) 2008-11-24 2009-11-17 Method and apparatus for linear pad conditioning

Country Status (5)

Country Link
US (1) US20100130107A1 (en)
JP (1) JP2012510160A (en)
KR (1) KR20110101168A (en)
TW (1) TW201021970A (en)
WO (1) WO2010059645A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7905765B2 (en) * 2005-11-24 2011-03-15 Jtekt Corporation Parallel mechanism, calibration method for use in the same, and machine tool including the same
US9074722B1 (en) 2010-05-07 2015-07-07 Roderick L. Phillips Portable arrangement for supporting personal computing/communication device
US20130115862A1 (en) * 2011-11-09 2013-05-09 Applied Materials, Inc. Chemical mechanical polishing platform architecture
US20140273767A1 (en) * 2013-03-12 2014-09-18 Applied Materials, Inc. Polishing pad conditioner pivot point
JP5994749B2 (en) 2013-08-05 2016-09-21 東京エレクトロン株式会社 Developing device, developing method, and storage medium
JP6221954B2 (en) * 2013-08-05 2017-11-01 東京エレクトロン株式会社 Development method, development device, and storage medium
USD749937S1 (en) 2014-03-12 2016-02-23 Stonehedge Solutions, Inc. Portable holder
USD749936S1 (en) 2014-03-12 2016-02-23 Stonehedge Solutions, Inc. Portable holder
CN109075054B (en) * 2016-03-25 2023-06-09 应用材料公司 Polishing system with local zone rate control and oscillation mode

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030134580A1 (en) * 2002-01-15 2003-07-17 Kunihiko Sakurai Polishing apparatus
US20050181707A1 (en) * 2004-02-12 2005-08-18 Wood Jeffrey H. Pneumatically actuated flexible coupling end effectors for lapping/polishing
KR100776570B1 (en) * 2006-06-29 2007-11-15 두산메카텍 주식회사 Polishing-pad conditioning device for chemical mechanical polishing apparatus and method thereof
US20080287043A1 (en) * 2007-01-30 2008-11-20 Kenichiro Saito Polishing apparatus

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5664987A (en) * 1994-01-31 1997-09-09 National Semiconductor Corporation Methods and apparatus for control of polishing pad conditioning for wafer planarization
US5938507A (en) * 1995-10-27 1999-08-17 Applied Materials, Inc. Linear conditioner apparatus for a chemical mechanical polishing system
US5961373A (en) * 1997-06-16 1999-10-05 Motorola, Inc. Process for forming a semiconductor device
US6123607A (en) * 1998-01-07 2000-09-26 Ravkin; Michael A. Method and apparatus for improved conditioning of polishing pads
US6354918B1 (en) * 1998-06-19 2002-03-12 Ebara Corporation Apparatus and method for polishing workpiece
JP3760064B2 (en) * 1999-08-09 2006-03-29 株式会社日立製作所 Semiconductor device manufacturing method and semiconductor device flattening apparatus
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
US6547651B1 (en) * 1999-11-10 2003-04-15 Strasbaugh Subaperture chemical mechanical planarization with polishing pad conditioning
JP3768399B2 (en) * 2000-11-17 2006-04-19 株式会社荏原製作所 Dressing device and polishing device
US7101799B2 (en) * 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US7037177B2 (en) * 2001-08-30 2006-05-02 Micron Technology, Inc. Method and apparatus for conditioning a chemical-mechanical polishing pad
US6769968B2 (en) * 2002-03-29 2004-08-03 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interchangeable conditioning disk apparatus
US6764389B1 (en) * 2002-08-20 2004-07-20 Lsi Logic Corporation Conditioning bar assembly having an abrasion member supported on a polycarbonate member
US6976907B2 (en) * 2003-01-10 2005-12-20 Intel Corporation Polishing pad conditioning
US7004825B1 (en) * 2003-09-29 2006-02-28 Lam Research Corporation Apparatus and associated method for conditioning in chemical mechanical planarization
US7210988B2 (en) * 2004-08-24 2007-05-01 Applied Materials, Inc. Method and apparatus for reduced wear polishing pad conditioning
JP2006102830A (en) * 2004-10-01 2006-04-20 Matsushita Electric Ind Co Ltd Polishing method
US8292691B2 (en) * 2008-09-29 2012-10-23 Applied Materials, Inc. Use of pad conditioning in temperature controlled CMP
US7899571B2 (en) * 2008-11-05 2011-03-01 Texas Instruments Incorporated Predictive method to improve within wafer CMP uniformity through optimized pad conditioning

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030134580A1 (en) * 2002-01-15 2003-07-17 Kunihiko Sakurai Polishing apparatus
US20050181707A1 (en) * 2004-02-12 2005-08-18 Wood Jeffrey H. Pneumatically actuated flexible coupling end effectors for lapping/polishing
KR100776570B1 (en) * 2006-06-29 2007-11-15 두산메카텍 주식회사 Polishing-pad conditioning device for chemical mechanical polishing apparatus and method thereof
US20080287043A1 (en) * 2007-01-30 2008-11-20 Kenichiro Saito Polishing apparatus

Also Published As

Publication number Publication date
US20100130107A1 (en) 2010-05-27
KR20110101168A (en) 2011-09-15
WO2010059645A2 (en) 2010-05-27
TW201021970A (en) 2010-06-16
JP2012510160A (en) 2012-04-26

Similar Documents

Publication Publication Date Title
WO2010059645A3 (en) Method and apparatus for linear pad conditioning
WO2008116043A8 (en) Abrasive articles, rotationally reciprocating tools, and methods
WO2010081003A3 (en) Systems, apparatus and methods for moving substrates
WO2008010901A8 (en) Surface for reduced friction and wear and method of making the same
WO2008116049A3 (en) Methods of removing defects in surfaces
TW200716304A (en) Method of adhering polishing pads and jig for adhering the same
EP2070652A3 (en) Grinding wheel truing tool and manufacturing method thereof, and truing apparatus, method for manufacturing grinding wheel and wafer edge grinding apparatus using the same
EP2463056A3 (en) Robotic surface preparation by a random orbital device
JP2010533592A5 (en)
EP1617462A3 (en) Tape adhering method and tape adhering apparatus
EP2532478A3 (en) Method and appartus for conditioning a polishing pad
TW200603213A (en) Method of processing a substrate
TW200731447A (en) Bonding means and bonding apparatus for supporting plate, and bonding method for supporting plate
WO2009132003A3 (en) Methods and apparatus for low cost and high performance polishing tape for substrate bevel and edge polishing in semiconductor manufacturing
WO2008021216A3 (en) Methods and apparatus for a robot wrist assembly
JP2009208214A5 (en)
WO2006061172A3 (en) Device for polishing hard surfaces, especially glass surfaces
ATE555175T1 (en) COMPOSITION FOR POLISHING SILICON DIOXIDE SURFACES
TW200730299A (en) Pad conditioner, pad conditioning method, and polishing apparatus
DE602005016086D1 (en) Corrugated pincushion processing device and method of use therefor
WO2007118216A3 (en) Portable optical fiber polisher
DK2047949T3 (en) Ball grinder surface in a ball valve
EP2163663A3 (en) Coater platter homing tool
TWI315886B (en) A substrate and a method for polishing a substrate
EP2354871A3 (en) Method of machining between contoured surfaces with cup shaped tool

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09828123

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 2011537555

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20117014644

Country of ref document: KR

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 09828123

Country of ref document: EP

Kind code of ref document: A2