JP2008306180A5 - - Google Patents

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Publication number
JP2008306180A5
JP2008306180A5 JP2008132105A JP2008132105A JP2008306180A5 JP 2008306180 A5 JP2008306180 A5 JP 2008306180A5 JP 2008132105 A JP2008132105 A JP 2008132105A JP 2008132105 A JP2008132105 A JP 2008132105A JP 2008306180 A5 JP2008306180 A5 JP 2008306180A5
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Japan
Prior art keywords
substrate
edge
backing plate
film
profile
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008132105A
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Japanese (ja)
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JP2008306180A (en
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Publication of JP2008306180A publication Critical patent/JP2008306180A/en
Publication of JP2008306180A5 publication Critical patent/JP2008306180A5/ja
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Claims (15)

基板の縁部上で膜を研磨する装置であって、
基板の縁部上で膜に研磨材料を押し付けるように適合されたバッキングプレートを有する研磨ヘッドを備え、
前記バッキングプレートが、前記基板の研磨中に、予め設定された膜プロファイルを提供するように適合されたプロファイル部分を有する装置。 An apparatus for polishing a film on an edge of a substrate,
Comprising a polishing head having a backing plate adapted to press the abrasive material against the film on the edge of the substrate;
The apparatus wherein the backing plate has a profile portion adapted to provide a preset film profile during polishing of the substrate. 前記プロファイル部分が、滑らかである、請求項１に記載の装置。   The apparatus of claim 1, wherein the profile portion is smooth. 前記プロファイル部分が、前記膜プロファイルに漸進的な曲率を提供するように適合された、請求項２に記載の装置。   The apparatus of claim 2, wherein the profile portion is adapted to provide a progressive curvature in the membrane profile. 前記プロファイル部分が、平坦領域及び曲線状領域により形成される、請求項１に記載の装置。   The apparatus of claim 1, wherein the profile portion is formed by a flat region and a curved region. 前記平坦領域及び前記曲線状領域が、カットオフジョイントで結合されている、請求項４に記載の装置。   The apparatus according to claim 4, wherein the flat region and the curved region are joined by a cut-off joint. 前記カットオフジョイントが、シャープな且つ角度のついた膜プロファイルを提供するように適合された、請求項５に記載の装置。   The apparatus of claim 5, wherein the cut-off joint is adapted to provide a sharp and angled membrane profile. 前記バッキングプレートが、前記基板の縁部の周りで揺動するように適合された、請求項１に記載の装置。   The apparatus of claim 1, wherein the backing plate is adapted to swing around an edge of the substrate. 基板の縁部上で膜を研磨するシステムであって、
基板を支持及び回転させるように適合された基板支持体と、
基板の縁部上で膜に研磨材料を押し付けるように適合されたバッキングプレートを有する研磨ヘッドであって、前記バッキングプレートが、前記基板の研磨中に、予め設定された膜プロファイルを提供するように適合されたプロファイル部分を有する、研磨ヘッドと、
前記研磨ヘッドの移動を動作させるように適合されたコントローラと、
を備えるシステム。 A system for polishing a film on an edge of a substrate,
A substrate support adapted to support and rotate the substrate;
A polishing head having a backing plate adapted to press an abrasive material against a film on an edge of the substrate, such that the backing plate provides a preset film profile during polishing of the substrate A polishing head having an adapted profile portion;
A controller adapted to operate movement of the polishing head;
A system comprising: 前記プロファイル部分が、滑らかである、請求項８に記載のシステム。   The system of claim 8, wherein the profile portion is smooth. 前記プロファイル部分が、漸進的な曲率を前記膜プロファイルに提供するように適合された、請求項９に記載のシステム。   The system of claim 9, wherein the profile portion is adapted to provide a progressive curvature to the membrane profile. 前記プロファイル部分が、平坦領域及び曲線状領域により形成される、請求項８に記載のシステム。   The system of claim 8, wherein the profile portion is formed by a flat region and a curved region. 前記平坦領域及び前記曲線状領域が、カットオフジョイントで結合されている、請求項１１に記載のシステム。   The system of claim 11, wherein the flat region and the curved region are joined by a cut-off joint. 前記カットオフジョイントが、シャープな且つ角度のついた膜プロファイルを提供するように適合された、請求項１２に記載のシステム。   The system of claim 12, wherein the cut-off joint is adapted to provide a sharp and angled membrane profile. 前記バッキングプレートが、前記基板の縁部の周りで揺動するように適合された、請求項８に記載のシステム。   The system of claim 8, wherein the backing plate is adapted to swing around an edge of the substrate. 基板の縁部上で膜を研磨する方法であって、
プロファイルされたバッキングプレートのための揺動開始角度及び揺動終了角度を選択するステップと、
基板の縁部上で膜を前記バッキングプレート及び研磨材料に接触させるステップと、
研磨中に、前記基板の縁部上で前記膜に対して前記バッキングプレートを揺動させるステップと、
を備える方法。 A method for polishing a film on an edge of a substrate, comprising:
Selecting a swing start angle and a swing end angle for the profiled backing plate;
Contacting the film on the edge of the substrate with the backing plate and abrasive material;
Oscillating the backing plate relative to the film on the edge of the substrate during polishing;
A method comprising:
JP2008132105A 2007-05-21 2008-05-20 Method and apparatus for controlling polishing profile of film on slope and edge of substrate Pending JP2008306180A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US93934307P 2007-05-21 2007-05-21

Publications (2)

Publication Number Publication Date
JP2008306180A JP2008306180A (en) 2008-12-18
JP2008306180A5 true JP2008306180A5 (en) 2011-06-23

Family

ID=40072855

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008132105A Pending JP2008306180A (en) 2007-05-21 2008-05-20 Method and apparatus for controlling polishing profile of film on slope and edge of substrate

Country Status (3)

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US (1) US20080293336A1 (en)
JP (1) JP2008306180A (en)
TW (1) TW200908123A (en)

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