JP2012505762A5 - - Google Patents

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Publication number
JP2012505762A5
JP2012505762A5 JP2011532105A JP2011532105A JP2012505762A5 JP 2012505762 A5 JP2012505762 A5 JP 2012505762A5 JP 2011532105 A JP2011532105 A JP 2011532105A JP 2011532105 A JP2011532105 A JP 2011532105A JP 2012505762 A5 JP2012505762 A5 JP 2012505762A5
Authority
JP
Japan
Prior art keywords
polishing pad
polishing
support member
receiving material
coupled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011532105A
Other languages
English (en)
Japanese (ja)
Other versions
JP5675626B2 (ja
JP2012505762A (ja
Filing date
Publication date
Priority claimed from US12/253,034 external-priority patent/US9238293B2/en
Application filed filed Critical
Publication of JP2012505762A publication Critical patent/JP2012505762A/ja
Publication of JP2012505762A5 publication Critical patent/JP2012505762A5/ja
Application granted granted Critical
Publication of JP5675626B2 publication Critical patent/JP5675626B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011532105A 2008-10-16 2009-08-20 研磨パッド端部の延伸 Expired - Fee Related JP5675626B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/253,034 2008-10-16
US12/253,034 US9238293B2 (en) 2008-10-16 2008-10-16 Polishing pad edge extension
PCT/US2009/054527 WO2010044953A1 (en) 2008-10-16 2009-08-20 Polishing pad edge extension

Publications (3)

Publication Number Publication Date
JP2012505762A JP2012505762A (ja) 2012-03-08
JP2012505762A5 true JP2012505762A5 (enExample) 2012-10-04
JP5675626B2 JP5675626B2 (ja) 2015-02-25

Family

ID=42106817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011532105A Expired - Fee Related JP5675626B2 (ja) 2008-10-16 2009-08-20 研磨パッド端部の延伸

Country Status (5)

Country Link
US (1) US9238293B2 (enExample)
JP (1) JP5675626B2 (enExample)
KR (1) KR20110083673A (enExample)
TW (1) TW201029798A (enExample)
WO (1) WO2010044953A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9902038B2 (en) * 2015-02-05 2018-02-27 Toshiba Memory Corporation Polishing apparatus, polishing method, and semiconductor manufacturing method
US12145236B2 (en) * 2021-02-26 2024-11-19 Axus Technology, Llc Containment and exhaust system for substrate polishing components
CN113199391A (zh) * 2021-06-09 2021-08-03 安徽格楠机械有限公司 一种融合机器人的双工位全自动双面研磨机

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7097544B1 (en) 1995-10-27 2006-08-29 Applied Materials Inc. Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
JP3231659B2 (ja) 1997-04-28 2001-11-26 日本電気株式会社 自動研磨装置
US6132298A (en) 1998-11-25 2000-10-17 Applied Materials, Inc. Carrier head with edge control for chemical mechanical polishing
JP2001170857A (ja) * 1999-04-01 2001-06-26 Mitsubishi Materials Corp ウェーハ研磨パッドのドレッシング装置およびドレッシング方法
JP2000334655A (ja) * 1999-05-26 2000-12-05 Matsushita Electric Ind Co Ltd Ｃｍｐ加工装置
JP2001062714A (ja) * 1999-08-26 2001-03-13 Hiroshima Nippon Denki Kk 研磨装置
US6432823B1 (en) 1999-11-04 2002-08-13 International Business Machines Corporation Off-concentric polishing system design
US6399501B2 (en) * 1999-12-13 2002-06-04 Applied Materials, Inc. Method and apparatus for detecting polishing endpoint with optical monitoring
US6428386B1 (en) * 2000-06-16 2002-08-06 Micron Technology, Inc. Planarizing pads, planarizing machines, and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
JP2002134448A (ja) * 2000-10-24 2002-05-10 Nikon Corp 研磨装置
US6866566B2 (en) * 2001-08-24 2005-03-15 Micron Technology, Inc. Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces
US6586337B2 (en) 2001-11-09 2003-07-01 Speedfam-Ipec Corporation Method and apparatus for endpoint detection during chemical mechanical polishing
JP2003229388A (ja) * 2002-02-01 2003-08-15 Nikon Corp 研磨装置、研磨方法、半導体デバイス及び半導体デバイス製造方法
US7341502B2 (en) * 2002-07-18 2008-03-11 Micron Technology, Inc. Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
US7288165B2 (en) 2003-10-24 2007-10-30 Applied Materials, Inc. Pad conditioning head for CMP process
KR20050114529A (ko) 2004-06-01 2005-12-06 동부아남반도체 주식회사 연마 패드의 컨디셔너 장치
US7066792B2 (en) * 2004-08-06 2006-06-27 Micron Technology, Inc. Shaped polishing pads for beveling microfeature workpiece edges, and associate system and methods
KR20060030257A (ko) 2004-10-05 2006-04-10 삼성전자주식회사 반도체 소자 제조에 사용되는 화학적 기계적 연마 장치
JP4079151B2 (ja) * 2005-01-24 2008-04-23 ヤマハ株式会社 研磨方法
JP4762647B2 (ja) * 2005-02-25 2011-08-31 株式会社荏原製作所 研磨装置及び研磨方法
TWI386989B (zh) * 2005-02-25 2013-02-21 荏原製作所股份有限公司 研磨裝置及研磨方法
JP4851795B2 (ja) * 2006-01-13 2012-01-11 株式会社ディスコ ウエーハの分割装置
US20070212983A1 (en) 2006-03-13 2007-09-13 Applied Materials, Inc. Apparatus and methods for conditioning a polishing pad
JP4803167B2 (ja) * 2007-12-10 2011-10-26 ヤマハ株式会社 研磨装置
US7967661B2 (en) * 2008-06-19 2011-06-28 Micron Technology, Inc. Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture
JP5267918B2 (ja) * 2008-07-15 2013-08-21 株式会社ニコン 保持装置および研磨装置

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