JP2014099598A5 - - Google Patents

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Publication number
JP2014099598A5
JP2014099598A5 JP2013215091A JP2013215091A JP2014099598A5 JP 2014099598 A5 JP2014099598 A5 JP 2014099598A5 JP 2013215091 A JP2013215091 A JP 2013215091A JP 2013215091 A JP2013215091 A JP 2013215091A JP 2014099598 A5 JP2014099598 A5 JP 2014099598A5
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JP
Japan
Prior art keywords
arm
base
damper
polishing
dampers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013215091A
Other languages
English (en)
Japanese (ja)
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JP2014099598A (ja
JP6282437B2 (ja
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Publication date
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Publication of JP2014099598A publication Critical patent/JP2014099598A/ja
Publication of JP2014099598A5 publication Critical patent/JP2014099598A5/ja
Application granted granted Critical
Publication of JP6282437B2 publication Critical patent/JP6282437B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013215091A 2012-10-18 2013-10-15 研磨パッドコンディショナ用ダンパ Active JP6282437B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261715750P 2012-10-18 2012-10-18
US61/715,750 2012-10-18

Publications (3)

Publication Number Publication Date
JP2014099598A JP2014099598A (ja) 2014-05-29
JP2014099598A5 true JP2014099598A5 (enExample) 2017-04-13
JP6282437B2 JP6282437B2 (ja) 2018-02-21

Family

ID=50485754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013215091A Active JP6282437B2 (ja) 2012-10-18 2013-10-15 研磨パッドコンディショナ用ダンパ

Country Status (4)

Country Link
US (1) US20140113533A1 (enExample)
JP (1) JP6282437B2 (enExample)
KR (1) KR102022125B1 (enExample)
TW (1) TWI597129B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9375825B2 (en) 2014-04-30 2016-06-28 Applied Materials, Inc. Polishing pad conditioning system including suction
CN106463384B (zh) * 2014-07-18 2020-03-17 应用材料公司 修改基板厚度轮廓
US9662762B2 (en) 2014-07-18 2017-05-30 Applied Materials, Inc. Modifying substrate thickness profiles
WO2016108284A1 (ja) 2014-12-31 2016-07-07 東邦エンジニアリング株式会社 平坦加工方法および平坦加工装置
JP6187948B1 (ja) 2016-03-11 2017-08-30 東邦エンジニアリング株式会社 平坦加工装置、その動作方法および加工物の製造方法
KR102561647B1 (ko) * 2018-05-28 2023-07-31 삼성전자주식회사 컨디셔너 및 이를 포함하는 화학 기계적 연마 장치
KR102300359B1 (ko) * 2019-08-07 2021-09-08 세메스 주식회사 기판 처리 장치 및 그 구동 방법
US20220379433A1 (en) * 2021-05-28 2022-12-01 Ta Liang Technology Co., Ltd. Polishing system and dressing device thereof
TWI765726B (zh) * 2021-05-28 2022-05-21 大量科技股份有限公司 拋光系統及其修整裝置
US12459078B2 (en) * 2022-06-06 2025-11-04 Applied Materials, Inc. In-situ conditioner disk cleaning during CMP

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3669089A (en) * 1970-12-16 1972-06-13 Henry F Swenson Swing arm for holding a dressing device
JP2627862B2 (ja) * 1994-02-03 1997-07-09 株式会社鴻池組 構造物の制振装置
TW320591B (enExample) * 1995-04-26 1997-11-21 Fujitsu Ltd
US5938507A (en) * 1995-10-27 1999-08-17 Applied Materials, Inc. Linear conditioner apparatus for a chemical mechanical polishing system
US5904615A (en) * 1997-07-18 1999-05-18 Hankook Machine Tools Co., Ltd. Pad conditioner for chemical mechanical polishing apparatus
US6102777A (en) * 1998-03-06 2000-08-15 Keltech Engineering Lapping apparatus and method for high speed lapping with a rotatable abrasive platen
US6263605B1 (en) * 1998-12-21 2001-07-24 Motorola, Inc. Pad conditioner coupling and end effector for a chemical mechanical planarization system and method therefor
US6553807B2 (en) * 1999-02-22 2003-04-29 Seagate Technology Llc Disc drive component level shock tester
JP2003048147A (ja) * 2001-07-31 2003-02-18 Applied Materials Inc 研磨パッドのコンディショニング装置及びこれを用いた研磨装置
JP5528826B2 (ja) * 2010-01-22 2014-06-25 株式会社荏原製作所 研磨装置及び方法、並びに、ドレッシングユニットの性能試験方法

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