JP5675626B2 - 研磨パッド端部の延伸 - Google Patents

研磨パッド端部の延伸 Download PDF

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Publication number
JP5675626B2
JP5675626B2 JP2011532105A JP2011532105A JP5675626B2 JP 5675626 B2 JP5675626 B2 JP 5675626B2 JP 2011532105 A JP2011532105 A JP 2011532105A JP 2011532105 A JP2011532105 A JP 2011532105A JP 5675626 B2 JP5675626 B2 JP 5675626B2
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JP
Japan
Prior art keywords
polishing pad
polishing
support member
processing
conditioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011532105A
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English (en)
Japanese (ja)
Other versions
JP2012505762A5 (enExample
JP2012505762A (ja
Inventor
ハン チー チェン，
ハン チー チェン，
シュー−ソン チャン，
シュー−ソン チャン，
スタン， ディー． ツァイ，
スタン， ディー． ツァイ，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
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Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2012505762A publication Critical patent/JP2012505762A/ja
Publication of JP2012505762A5 publication Critical patent/JP2012505762A5/ja
Application granted granted Critical
Publication of JP5675626B2 publication Critical patent/JP5675626B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2011532105A 2008-10-16 2009-08-20 研磨パッド端部の延伸 Expired - Fee Related JP5675626B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/253,034 2008-10-16
US12/253,034 US9238293B2 (en) 2008-10-16 2008-10-16 Polishing pad edge extension
PCT/US2009/054527 WO2010044953A1 (en) 2008-10-16 2009-08-20 Polishing pad edge extension

Publications (3)

Publication Number Publication Date
JP2012505762A JP2012505762A (ja) 2012-03-08
JP2012505762A5 JP2012505762A5 (enExample) 2012-10-04
JP5675626B2 true JP5675626B2 (ja) 2015-02-25

Family

ID=42106817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011532105A Expired - Fee Related JP5675626B2 (ja) 2008-10-16 2009-08-20 研磨パッド端部の延伸

Country Status (5)

Country Link
US (1) US9238293B2 (enExample)
JP (1) JP5675626B2 (enExample)
KR (1) KR20110083673A (enExample)
TW (1) TW201029798A (enExample)
WO (1) WO2010044953A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9902038B2 (en) * 2015-02-05 2018-02-27 Toshiba Memory Corporation Polishing apparatus, polishing method, and semiconductor manufacturing method
US12145236B2 (en) * 2021-02-26 2024-11-19 Axus Technology, Llc Containment and exhaust system for substrate polishing components
CN113199391A (zh) * 2021-06-09 2021-08-03 安徽格楠机械有限公司 一种融合机器人的双工位全自动双面研磨机

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7097544B1 (en) 1995-10-27 2006-08-29 Applied Materials Inc. Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
JP3231659B2 (ja) 1997-04-28 2001-11-26 日本電気株式会社 自動研磨装置
US6132298A (en) 1998-11-25 2000-10-17 Applied Materials, Inc. Carrier head with edge control for chemical mechanical polishing
JP2001170857A (ja) * 1999-04-01 2001-06-26 Mitsubishi Materials Corp ウェーハ研磨パッドのドレッシング装置およびドレッシング方法
JP2000334655A (ja) * 1999-05-26 2000-12-05 Matsushita Electric Ind Co Ltd Ｃｍｐ加工装置
JP2001062714A (ja) * 1999-08-26 2001-03-13 Hiroshima Nippon Denki Kk 研磨装置
US6432823B1 (en) 1999-11-04 2002-08-13 International Business Machines Corporation Off-concentric polishing system design
US6399501B2 (en) * 1999-12-13 2002-06-04 Applied Materials, Inc. Method and apparatus for detecting polishing endpoint with optical monitoring
US6428386B1 (en) * 2000-06-16 2002-08-06 Micron Technology, Inc. Planarizing pads, planarizing machines, and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
JP2002134448A (ja) * 2000-10-24 2002-05-10 Nikon Corp 研磨装置
US6866566B2 (en) * 2001-08-24 2005-03-15 Micron Technology, Inc. Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces
US6586337B2 (en) 2001-11-09 2003-07-01 Speedfam-Ipec Corporation Method and apparatus for endpoint detection during chemical mechanical polishing
JP2003229388A (ja) * 2002-02-01 2003-08-15 Nikon Corp 研磨装置、研磨方法、半導体デバイス及び半導体デバイス製造方法
US7341502B2 (en) * 2002-07-18 2008-03-11 Micron Technology, Inc. Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
US7288165B2 (en) 2003-10-24 2007-10-30 Applied Materials, Inc. Pad conditioning head for CMP process
KR20050114529A (ko) 2004-06-01 2005-12-06 동부아남반도체 주식회사 연마 패드의 컨디셔너 장치
US7066792B2 (en) * 2004-08-06 2006-06-27 Micron Technology, Inc. Shaped polishing pads for beveling microfeature workpiece edges, and associate system and methods
KR20060030257A (ko) 2004-10-05 2006-04-10 삼성전자주식회사 반도체 소자 제조에 사용되는 화학적 기계적 연마 장치
JP4079151B2 (ja) * 2005-01-24 2008-04-23 ヤマハ株式会社 研磨方法
JP4762647B2 (ja) * 2005-02-25 2011-08-31 株式会社荏原製作所 研磨装置及び研磨方法
TWI386989B (zh) * 2005-02-25 2013-02-21 荏原製作所股份有限公司 研磨裝置及研磨方法
JP4851795B2 (ja) * 2006-01-13 2012-01-11 株式会社ディスコ ウエーハの分割装置
US20070212983A1 (en) 2006-03-13 2007-09-13 Applied Materials, Inc. Apparatus and methods for conditioning a polishing pad
JP4803167B2 (ja) * 2007-12-10 2011-10-26 ヤマハ株式会社 研磨装置
US7967661B2 (en) * 2008-06-19 2011-06-28 Micron Technology, Inc. Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture
JP5267918B2 (ja) * 2008-07-15 2013-08-21 株式会社ニコン 保持装置および研磨装置

Also Published As

Publication number Publication date
US9238293B2 (en) 2016-01-19
WO2010044953A1 (en) 2010-04-22
KR20110083673A (ko) 2011-07-20
TW201029798A (en) 2010-08-16
US20100099339A1 (en) 2010-04-22
JP2012505762A (ja) 2012-03-08

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