TW201029798A - Polishing pad edge extension - Google Patents

Polishing pad edge extension Download PDF

Info

Publication number
TW201029798A
TW201029798A TW098134519A TW98134519A TW201029798A TW 201029798 A TW201029798 A TW 201029798A TW 098134519 A TW098134519 A TW 098134519A TW 98134519 A TW98134519 A TW 98134519A TW 201029798 A TW201029798 A TW 201029798A
Authority
TW
Taiwan
Prior art keywords
polishing pad
abrasive
polishing
adjustment
coupled
Prior art date
Application number
TW098134519A
Other languages
English (en)
Chinese (zh)
Inventor
Hung Chih Chen
Shou-Sung Chang
Stan D Tsai
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW201029798A publication Critical patent/TW201029798A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW098134519A 2008-10-16 2009-10-12 Polishing pad edge extension TW201029798A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/253,034 US9238293B2 (en) 2008-10-16 2008-10-16 Polishing pad edge extension

Publications (1)

Publication Number Publication Date
TW201029798A true TW201029798A (en) 2010-08-16

Family

ID=42106817

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098134519A TW201029798A (en) 2008-10-16 2009-10-12 Polishing pad edge extension

Country Status (5)

Country Link
US (1) US9238293B2 (enExample)
JP (1) JP5675626B2 (enExample)
KR (1) KR20110083673A (enExample)
TW (1) TW201029798A (enExample)
WO (1) WO2010044953A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113199391A (zh) * 2021-06-09 2021-08-03 安徽格楠机械有限公司 一种融合机器人的双工位全自动双面研磨机

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9902038B2 (en) * 2015-02-05 2018-02-27 Toshiba Memory Corporation Polishing apparatus, polishing method, and semiconductor manufacturing method
US12145236B2 (en) * 2021-02-26 2024-11-19 Axus Technology, Llc Containment and exhaust system for substrate polishing components

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7097544B1 (en) 1995-10-27 2006-08-29 Applied Materials Inc. Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
JP3231659B2 (ja) 1997-04-28 2001-11-26 日本電気株式会社 自動研磨装置
US6132298A (en) 1998-11-25 2000-10-17 Applied Materials, Inc. Carrier head with edge control for chemical mechanical polishing
JP2001170857A (ja) * 1999-04-01 2001-06-26 Mitsubishi Materials Corp ウェーハ研磨パッドのドレッシング装置およびドレッシング方法
JP2000334655A (ja) * 1999-05-26 2000-12-05 Matsushita Electric Ind Co Ltd Ｃｍｐ加工装置
JP2001062714A (ja) * 1999-08-26 2001-03-13 Hiroshima Nippon Denki Kk 研磨装置
US6432823B1 (en) 1999-11-04 2002-08-13 International Business Machines Corporation Off-concentric polishing system design
US6399501B2 (en) * 1999-12-13 2002-06-04 Applied Materials, Inc. Method and apparatus for detecting polishing endpoint with optical monitoring
US6428386B1 (en) * 2000-06-16 2002-08-06 Micron Technology, Inc. Planarizing pads, planarizing machines, and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
JP2002134448A (ja) * 2000-10-24 2002-05-10 Nikon Corp 研磨装置
US6866566B2 (en) * 2001-08-24 2005-03-15 Micron Technology, Inc. Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces
US6586337B2 (en) 2001-11-09 2003-07-01 Speedfam-Ipec Corporation Method and apparatus for endpoint detection during chemical mechanical polishing
JP2003229388A (ja) * 2002-02-01 2003-08-15 Nikon Corp 研磨装置、研磨方法、半導体デバイス及び半導体デバイス製造方法
US7341502B2 (en) * 2002-07-18 2008-03-11 Micron Technology, Inc. Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
US7288165B2 (en) 2003-10-24 2007-10-30 Applied Materials, Inc. Pad conditioning head for CMP process
KR20050114529A (ko) 2004-06-01 2005-12-06 동부아남반도체 주식회사 연마 패드의 컨디셔너 장치
US7066792B2 (en) * 2004-08-06 2006-06-27 Micron Technology, Inc. Shaped polishing pads for beveling microfeature workpiece edges, and associate system and methods
KR20060030257A (ko) 2004-10-05 2006-04-10 삼성전자주식회사 반도체 소자 제조에 사용되는 화학적 기계적 연마 장치
JP4079151B2 (ja) * 2005-01-24 2008-04-23 ヤマハ株式会社 研磨方法
JP4762647B2 (ja) * 2005-02-25 2011-08-31 株式会社荏原製作所 研磨装置及び研磨方法
TWI386989B (zh) * 2005-02-25 2013-02-21 荏原製作所股份有限公司 研磨裝置及研磨方法
JP4851795B2 (ja) * 2006-01-13 2012-01-11 株式会社ディスコ ウエーハの分割装置
US20070212983A1 (en) 2006-03-13 2007-09-13 Applied Materials, Inc. Apparatus and methods for conditioning a polishing pad
JP4803167B2 (ja) * 2007-12-10 2011-10-26 ヤマハ株式会社 研磨装置
US7967661B2 (en) * 2008-06-19 2011-06-28 Micron Technology, Inc. Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture
JP5267918B2 (ja) * 2008-07-15 2013-08-21 株式会社ニコン 保持装置および研磨装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113199391A (zh) * 2021-06-09 2021-08-03 安徽格楠机械有限公司 一种融合机器人的双工位全自动双面研磨机

Also Published As

Publication number Publication date
US9238293B2 (en) 2016-01-19
WO2010044953A1 (en) 2010-04-22
KR20110083673A (ko) 2011-07-20
US20100099339A1 (en) 2010-04-22
JP5675626B2 (ja) 2015-02-25
JP2012505762A (ja) 2012-03-08

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