JP2006289523A5 - - Google Patents

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Publication number
JP2006289523A5
JP2006289523A5 JP2005109991A JP2005109991A JP2006289523A5 JP 2006289523 A5 JP2006289523 A5 JP 2006289523A5 JP 2005109991 A JP2005109991 A JP 2005109991A JP 2005109991 A JP2005109991 A JP 2005109991A JP 2006289523 A5 JP2006289523 A5 JP 2006289523A5
Authority
JP
Japan
Prior art keywords
pad
double
roller
side polishing
polishing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005109991A
Other languages
English (en)
Japanese (ja)
Other versions
JP4693468B2 (ja
JP2006289523A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005109991A priority Critical patent/JP4693468B2/ja
Priority claimed from JP2005109991A external-priority patent/JP4693468B2/ja
Publication of JP2006289523A publication Critical patent/JP2006289523A/ja
Publication of JP2006289523A5 publication Critical patent/JP2006289523A5/ja
Application granted granted Critical
Publication of JP4693468B2 publication Critical patent/JP4693468B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2005109991A 2005-04-06 2005-04-06 研磨パッド貼着用加圧ローラを備えた両面研磨装置 Expired - Fee Related JP4693468B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005109991A JP4693468B2 (ja) 2005-04-06 2005-04-06 研磨パッド貼着用加圧ローラを備えた両面研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005109991A JP4693468B2 (ja) 2005-04-06 2005-04-06 研磨パッド貼着用加圧ローラを備えた両面研磨装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008070144A Division JP2008149459A (ja) 2008-03-18 2008-03-18 研磨パッド貼着用加圧ローラを備えた両面研磨装置及び研磨パッドの貼着方法

Publications (3)

Publication Number Publication Date
JP2006289523A JP2006289523A (ja) 2006-10-26
JP2006289523A5 true JP2006289523A5 (enExample) 2008-05-01
JP4693468B2 JP4693468B2 (ja) 2011-06-01

Family

ID=37410669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005109991A Expired - Fee Related JP4693468B2 (ja) 2005-04-06 2005-04-06 研磨パッド貼着用加圧ローラを備えた両面研磨装置

Country Status (1)

Country Link
JP (1) JP4693468B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101443459B1 (ko) 2012-12-27 2014-09-19 주식회사 엘지실트론 니들 드레서 및 이를 포함하는 웨이퍼 양면 연마장치
KR101453680B1 (ko) 2013-07-09 2014-10-22 주식회사 엘지실트론 웨이퍼 양면 연마장치 및 이에 적용된 양면 연마패드 제거용 롤러
EP4000806A1 (de) 2020-11-16 2022-05-25 Siltronic AG Verfahren zum beidseitigen polieren von halbleiterscheiben zwischen einem unteren polierteller und einem oberen polierteller
EP4000802A1 (de) 2020-11-17 2022-05-25 Siltronic AG Verfahren zum beidseitigen polieren von halbleiterscheiben zwischen einem unteren polierteller und einem oberen polierteller
CN115351721B (zh) * 2022-06-24 2023-11-24 淮安澳洋顺昌光电技术有限公司 一种抛光机抛光布自动粘贴装置及方法
EP4306262A1 (de) 2022-07-13 2024-01-17 Siltronic AG Verfahren zum beidseitigen polieren von halbleiterscheiben zwischen einem unteren polierteller und einem oberen polierteller
EP4321298A1 (de) 2022-08-12 2024-02-14 Siltronic AG Vorrichtung und verfahren zum anpressen eines oberen poliertuchs gegen einen oberen polierteller einer maschine zum gleichzeitigen polieren einer vorderseite und einer rückseite einer halbleiterscheibe
CN119427175B (zh) * 2024-11-29 2025-09-02 西安奕斯伟材料科技股份有限公司 一种双面抛光垫更换装置及方法、设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62102974A (ja) * 1985-10-29 1987-05-13 Hoya Corp 加工用パツドと平面加工装置
JP3100905B2 (ja) * 1995-08-24 2000-10-23 松下電器産業株式会社 半導体基板の研磨方法及びその装置
JPH11300599A (ja) * 1998-04-23 1999-11-02 Speedfam-Ipec Co Ltd ワークの片面研磨方法及び装置
JP3821985B2 (ja) * 1998-05-07 2006-09-13 株式会社荏原製作所 ポリッシング装置
JPH11320387A (ja) * 1998-05-07 1999-11-24 Speedfam-Ipec Co Ltd 研磨パッドの貼着方法
JP4307411B2 (ja) * 2005-06-15 2009-08-05 三益半導体工業株式会社 研磨パッド貼り付け方法及びワークの製造方法

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