JP4693468B2 - 研磨パッド貼着用加圧ローラを備えた両面研磨装置 - Google Patents

研磨パッド貼着用加圧ローラを備えた両面研磨装置 Download PDF

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JP4693468B2
JP4693468B2 JP2005109991A JP2005109991A JP4693468B2 JP 4693468 B2 JP4693468 B2 JP 4693468B2 JP 2005109991 A JP2005109991 A JP 2005109991A JP 2005109991 A JP2005109991 A JP 2005109991A JP 4693468 B2 JP4693468 B2 JP 4693468B2
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pad
roller
double
polishing pad
polishing
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JP2005109991A
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JP2006289523A5 (enExample
JP2006289523A (ja
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仁志 長山
昭彦 山谷
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SpeedFam Co Ltd
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SpeedFam Co Ltd
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2005109991A 2005-04-06 2005-04-06 研磨パッド貼着用加圧ローラを備えた両面研磨装置 Expired - Fee Related JP4693468B2 (ja)

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JP2005109991A JP4693468B2 (ja) 2005-04-06 2005-04-06 研磨パッド貼着用加圧ローラを備えた両面研磨装置

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JP2005109991A JP4693468B2 (ja) 2005-04-06 2005-04-06 研磨パッド貼着用加圧ローラを備えた両面研磨装置

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JP2008070144A Division JP2008149459A (ja) 2008-03-18 2008-03-18 研磨パッド貼着用加圧ローラを備えた両面研磨装置及び研磨パッドの貼着方法

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JP2006289523A JP2006289523A (ja) 2006-10-26
JP2006289523A5 JP2006289523A5 (enExample) 2008-05-01
JP4693468B2 true JP4693468B2 (ja) 2011-06-01

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101443459B1 (ko) 2012-12-27 2014-09-19 주식회사 엘지실트론 니들 드레서 및 이를 포함하는 웨이퍼 양면 연마장치
KR101453680B1 (ko) 2013-07-09 2014-10-22 주식회사 엘지실트론 웨이퍼 양면 연마장치 및 이에 적용된 양면 연마패드 제거용 롤러
EP4000806A1 (de) 2020-11-16 2022-05-25 Siltronic AG Verfahren zum beidseitigen polieren von halbleiterscheiben zwischen einem unteren polierteller und einem oberen polierteller
EP4000802A1 (de) 2020-11-17 2022-05-25 Siltronic AG Verfahren zum beidseitigen polieren von halbleiterscheiben zwischen einem unteren polierteller und einem oberen polierteller
CN115351721B (zh) * 2022-06-24 2023-11-24 淮安澳洋顺昌光电技术有限公司 一种抛光机抛光布自动粘贴装置及方法
EP4306262A1 (de) 2022-07-13 2024-01-17 Siltronic AG Verfahren zum beidseitigen polieren von halbleiterscheiben zwischen einem unteren polierteller und einem oberen polierteller
EP4321298A1 (de) 2022-08-12 2024-02-14 Siltronic AG Vorrichtung und verfahren zum anpressen eines oberen poliertuchs gegen einen oberen polierteller einer maschine zum gleichzeitigen polieren einer vorderseite und einer rückseite einer halbleiterscheibe
CN119427175B (zh) * 2024-11-29 2025-09-02 西安奕斯伟材料科技股份有限公司 一种双面抛光垫更换装置及方法、设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62102974A (ja) * 1985-10-29 1987-05-13 Hoya Corp 加工用パツドと平面加工装置
JP3100905B2 (ja) * 1995-08-24 2000-10-23 松下電器産業株式会社 半導体基板の研磨方法及びその装置
JPH11300599A (ja) * 1998-04-23 1999-11-02 Speedfam-Ipec Co Ltd ワークの片面研磨方法及び装置
JP3821985B2 (ja) * 1998-05-07 2006-09-13 株式会社荏原製作所 ポリッシング装置
JPH11320387A (ja) * 1998-05-07 1999-11-24 Speedfam-Ipec Co Ltd 研磨パッドの貼着方法
JP4307411B2 (ja) * 2005-06-15 2009-08-05 三益半導体工業株式会社 研磨パッド貼り付け方法及びワークの製造方法

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