WO2009057258A1 - ワーク研磨用ヘッド及びこの研磨ヘッドを備えた研磨装置 - Google Patents

ワーク研磨用ヘッド及びこの研磨ヘッドを備えた研磨装置 Download PDF

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Publication number
WO2009057258A1
WO2009057258A1 PCT/JP2008/002962 JP2008002962W WO2009057258A1 WO 2009057258 A1 WO2009057258 A1 WO 2009057258A1 JP 2008002962 W JP2008002962 W JP 2008002962W WO 2009057258 A1 WO2009057258 A1 WO 2009057258A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
polishing head
work
rubber film
intermediate plate
Prior art date
Application number
PCT/JP2008/002962
Other languages
English (en)
French (fr)
Inventor
Hisashi Masumura
Kouji Morita
Hiromasa Hashimoto
Satoru Arakawa
Hiromi Kishida
Original Assignee
Shin-Etsu Handotai Co., Ltd.
Fujikoshi Machinery Corp.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin-Etsu Handotai Co., Ltd., Fujikoshi Machinery Corp. filed Critical Shin-Etsu Handotai Co., Ltd.
Priority to DE112008002802.8T priority Critical patent/DE112008002802B4/de
Priority to CN2008801071308A priority patent/CN101801605B/zh
Priority to US12/733,535 priority patent/US8021210B2/en
Priority to KR1020107008218A priority patent/KR101486780B1/ko
Publication of WO2009057258A1 publication Critical patent/WO2009057258A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

　本発明は、ラバー膜の中板への固定位置がワーク保持部側から離れた位置となるように、ラバー膜をブーツ状の構造とし、ブーツ状ラバー膜の末端部をＯリング状にして、中板とラバー膜の接触面積を極限まで少なくして中板に支持する構造とした研磨ヘッドである。これによってラバーチャック方式による研磨ヘッドにおいて、ワーク表面にキズ等の表面欠陥が発生することが極力抑制され、ワーク外周まで安定して均一に研磨可能な研磨ヘッド及び該研磨ヘッドを備えた研磨装置が提供される。
PCT/JP2008/002962 2007-10-31 2008-10-20 ワーク研磨用ヘッド及びこの研磨ヘッドを備えた研磨装置 WO2009057258A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE112008002802.8T DE112008002802B4 (de) 2007-10-31 2008-10-20 Polierkopf und diesen aufweisende Poliervorrichtung
CN2008801071308A CN101801605B (zh) 2007-10-31 2008-10-20 工件研磨用头及具备此研磨头的研磨装置
US12/733,535 US8021210B2 (en) 2007-10-31 2008-10-20 Polishing head and polishing apparatus having the same
KR1020107008218A KR101486780B1 (ko) 2007-10-31 2008-10-20 워크 연마용 헤드, 및 연마 헤드를 갖춘 연마 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-283864 2007-10-31
JP2007283864A JP5042778B2 (ja) 2007-10-31 2007-10-31 ワーク研磨用ヘッド及びこの研磨ヘッドを備えた研磨装置

Publications (1)

Publication Number Publication Date
WO2009057258A1 true WO2009057258A1 (ja) 2009-05-07

Family

ID=40590665

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002962 WO2009057258A1 (ja) 2007-10-31 2008-10-20 ワーク研磨用ヘッド及びこの研磨ヘッドを備えた研磨装置

Country Status (7)

Country Link
US (1) US8021210B2 (ja)
JP (1) JP5042778B2 (ja)
KR (1) KR101486780B1 (ja)
CN (1) CN101801605B (ja)
DE (1) DE112008002802B4 (ja)
TW (1) TWI410300B (ja)
WO (1) WO2009057258A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110893581A (zh) * 2019-12-02 2020-03-20 南京航空航天大学 一种液动式柔性抛光装置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101607099B1 (ko) * 2008-08-29 2016-03-29 신에쯔 한도타이 가부시키가이샤 연마 헤드 및 연마 장치
JP5303491B2 (ja) 2010-02-19 2013-10-02 信越半導体株式会社 研磨ヘッド及び研磨装置
JP5454513B2 (ja) 2011-05-27 2014-03-26 信越半導体株式会社 研磨ヘッドの高さ方向の位置の調整方法及びワークの研磨方法
DE112012002493T8 (de) * 2011-06-29 2014-06-12 Shin-Etsu Handotai Co., Ltd. Polierkopf und Poliervorrichtung
US20130017762A1 (en) * 2011-07-15 2013-01-17 Infineon Technologies Ag Method and Apparatus for Determining a Measure of a Thickness of a Polishing Pad of a Polishing Machine
JP5807580B2 (ja) * 2012-02-15 2015-11-10 信越半導体株式会社 研磨ヘッド及び研磨装置
TWI658899B (zh) * 2014-03-31 2019-05-11 日商荏原製作所股份有限公司 研磨裝置及研磨方法
JP6283957B2 (ja) * 2015-04-16 2018-02-28 信越半導体株式会社 研磨ヘッドの製造方法及び研磨ヘッド、並びに研磨装置
KR102307563B1 (ko) * 2015-05-06 2021-10-05 주식회사 케이씨텍 기판 캐리어 및 이를 구비하는 화학 기계적 기판 연마장치
JP6822432B2 (ja) * 2018-02-23 2021-01-27 株式会社Sumco ウェーハの片面研磨方法
CN114589579B (zh) * 2022-05-10 2022-08-12 眉山博雅新材料股份有限公司 一种抛光装置

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JPH11163101A (ja) * 1997-11-27 1999-06-18 Nec Corp 半導体ウエハー取付基台
JP2000127024A (ja) * 1998-10-27 2000-05-09 Toshiba Corp ポリッシング装置及び研磨加工方法
JP2001310257A (ja) * 2000-04-25 2001-11-06 Ebara Corp 研磨装置
JP2002231663A (ja) * 2001-01-30 2002-08-16 Tokyo Seimitsu Co Ltd ウェーハ研磨装置
JP2003039306A (ja) * 2001-07-27 2003-02-13 Tokyo Seimitsu Co Ltd ウエーハ研磨装置
JP2007021614A (ja) * 2005-07-13 2007-02-01 Komatsu Electronic Metals Co Ltd 研磨装置および研磨ヘッド

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US6056632A (en) * 1997-02-13 2000-05-02 Speedfam-Ipec Corp. Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
US6422927B1 (en) * 1998-12-30 2002-07-23 Applied Materials, Inc. Carrier head with controllable pressure and loading area for chemical mechanical polishing
US6558232B1 (en) * 2000-05-12 2003-05-06 Multi-Planar Technologies, Inc. System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
US6857945B1 (en) * 2000-07-25 2005-02-22 Applied Materials, Inc. Multi-chamber carrier head with a flexible membrane
EP1177859B1 (en) * 2000-07-31 2009-04-15 Ebara Corporation Substrate holding apparatus and substrate polishing apparatus
US7497767B2 (en) * 2000-09-08 2009-03-03 Applied Materials, Inc. Vibration damping during chemical mechanical polishing
JP2002264005A (ja) 2001-03-09 2002-09-18 Toshiba Ceramics Co Ltd 半導体ウェーハの研磨方法及びその研磨装置
US20090064452A1 (en) * 2001-05-25 2009-03-12 David K. Thatcher, Owner Powered carpet scrubbing and combing machine
US6569771B2 (en) * 2001-10-31 2003-05-27 United Microelectronics Corp. Carrier head for chemical mechanical polishing
JP4397176B2 (ja) * 2002-04-16 2010-01-13 アプライド マテリアルズ インコーポレイテッド キャリヤヘッドでの振動減衰
US7001245B2 (en) * 2003-03-07 2006-02-21 Applied Materials Inc. Substrate carrier with a textured membrane
JP3889744B2 (ja) * 2003-12-05 2007-03-07 株式会社東芝 研磨ヘッドおよび研磨装置
JP5112614B2 (ja) * 2004-12-10 2013-01-09 株式会社荏原製作所 基板保持装置および研磨装置
JP2007012918A (ja) * 2005-06-30 2007-01-18 Toshiba Ceramics Co Ltd 研磨ヘッド
JP2007050465A (ja) * 2005-08-17 2007-03-01 Toshiba Corp 研磨ヘッド、研磨装置及び研磨工具
US7727055B2 (en) * 2006-11-22 2010-06-01 Applied Materials, Inc. Flexible membrane for carrier head

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163101A (ja) * 1997-11-27 1999-06-18 Nec Corp 半導体ウエハー取付基台
JP2000127024A (ja) * 1998-10-27 2000-05-09 Toshiba Corp ポリッシング装置及び研磨加工方法
JP2001310257A (ja) * 2000-04-25 2001-11-06 Ebara Corp 研磨装置
JP2002231663A (ja) * 2001-01-30 2002-08-16 Tokyo Seimitsu Co Ltd ウェーハ研磨装置
JP2003039306A (ja) * 2001-07-27 2003-02-13 Tokyo Seimitsu Co Ltd ウエーハ研磨装置
JP2007021614A (ja) * 2005-07-13 2007-02-01 Komatsu Electronic Metals Co Ltd 研磨装置および研磨ヘッド

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110893581A (zh) * 2019-12-02 2020-03-20 南京航空航天大学 一种液动式柔性抛光装置

Also Published As

Publication number Publication date
KR101486780B1 (ko) 2015-01-28
DE112008002802B4 (de) 2020-07-09
JP5042778B2 (ja) 2012-10-03
DE112008002802T5 (de) 2010-10-21
US8021210B2 (en) 2011-09-20
US20100291838A1 (en) 2010-11-18
TW200942362A (en) 2009-10-16
CN101801605A (zh) 2010-08-11
JP2009107094A (ja) 2009-05-21
CN101801605B (zh) 2012-03-21
TWI410300B (zh) 2013-10-01
KR20100087097A (ko) 2010-08-03

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