DE112012002493T8 - Polierkopf und Poliervorrichtung - Google Patents

Polierkopf und Poliervorrichtung Download PDF

Info

Publication number
DE112012002493T8
DE112012002493T8 DE112012002493.1T DE112012002493T DE112012002493T8 DE 112012002493 T8 DE112012002493 T8 DE 112012002493T8 DE 112012002493 T DE112012002493 T DE 112012002493T DE 112012002493 T8 DE112012002493 T8 DE 112012002493T8
Authority
DE
Germany
Prior art keywords
polishing
head
polishing device
polishing head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE112012002493.1T
Other languages
English (en)
Other versions
DE112012002493T5 (de
Inventor
Hisashi Masumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of DE112012002493T5 publication Critical patent/DE112012002493T5/de
Application granted granted Critical
Publication of DE112012002493T8 publication Critical patent/DE112012002493T8/de
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE112012002493.1T 2011-06-29 2012-05-31 Polierkopf und Poliervorrichtung Expired - Fee Related DE112012002493T8 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011143927 2011-06-29
JPJP2011143927 2011-06-29
PCT/JP2012/003598 WO2013001719A1 (ja) 2011-06-29 2012-05-31 研磨ヘッド及び研磨装置

Publications (2)

Publication Number Publication Date
DE112012002493T5 DE112012002493T5 (de) 2014-03-27
DE112012002493T8 true DE112012002493T8 (de) 2014-06-12

Family

ID=47423651

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112012002493.1T Expired - Fee Related DE112012002493T8 (de) 2011-06-29 2012-05-31 Polierkopf und Poliervorrichtung

Country Status (7)

Country Link
US (1) US20140113531A1 (de)
JP (1) JPWO2013001719A1 (de)
KR (1) KR20140048894A (de)
CN (1) CN103619538A (de)
DE (1) DE112012002493T8 (de)
TW (1) TW201318767A (de)
WO (1) WO2013001719A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6283957B2 (ja) * 2015-04-16 2018-02-28 信越半導体株式会社 研磨ヘッドの製造方法及び研磨ヘッド、並びに研磨装置
CN106992112A (zh) * 2016-01-21 2017-07-28 苏州新美光纳米科技有限公司 超薄晶片的抛光方法
JP6508123B2 (ja) * 2016-05-13 2019-05-08 信越半導体株式会社 テンプレートアセンブリの選別方法及びワークの研磨方法並びにテンプレートアセンブリ
JP6891847B2 (ja) * 2018-04-05 2021-06-18 信越半導体株式会社 研磨ヘッド及びウェーハの研磨方法
CN109352513B (zh) * 2018-12-13 2021-05-07 上海超硅半导体有限公司 一种晶圆抛光方法
CN110364463A (zh) * 2019-07-25 2019-10-22 西安奕斯伟硅片技术有限公司 一种硅片处理装置及方法
CN111644977A (zh) * 2020-07-17 2020-09-11 中国科学院微电子研究所 研磨用固定环以及研磨头
JP2022191609A (ja) * 2021-06-16 2022-12-28 株式会社Sumco 研磨ヘッド、研磨装置及び半導体ウェーハの製造方法
CN114227525A (zh) * 2021-12-24 2022-03-25 济南晶正电子科技有限公司 一种抛光改善晶圆厚度均匀性的方法
CN114905406B (zh) * 2022-04-21 2023-06-16 中国人民解放军国防科技大学 一种倒封装芯片衬底减薄系统与方法

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5624299A (en) * 1993-12-27 1997-04-29 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved carrier and method of use
JP3595011B2 (ja) * 1994-03-02 2004-12-02 アプライド マテリアルズ インコーポレイテッド 研磨制御を改善した化学的機械的研磨装置
JP2000033555A (ja) * 1998-07-17 2000-02-02 Sony Corp 研磨装置
US6368189B1 (en) * 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
JP2001105298A (ja) * 1999-10-04 2001-04-17 Speedfam Co Ltd 流体加圧式キャリアの内圧安定化装置
JP3683149B2 (ja) * 2000-02-01 2005-08-17 株式会社東京精密 研磨装置の研磨ヘッドの構造
US6722964B2 (en) * 2000-04-04 2004-04-20 Ebara Corporation Polishing apparatus and method
US6419567B1 (en) * 2000-08-14 2002-07-16 Semiconductor 300 Gmbh & Co. Kg Retaining ring for chemical-mechanical polishing (CMP) head, polishing apparatus, slurry cycle system, and method
US7255637B2 (en) * 2000-09-08 2007-08-14 Applied Materials, Inc. Carrier head vibration damping
US6652362B2 (en) * 2000-11-23 2003-11-25 Samsung Electronics Co., Ltd. Apparatus for polishing a semiconductor wafer and method therefor
JP3969069B2 (ja) * 2000-12-04 2007-08-29 株式会社東京精密 ウェーハ研磨装置
JP3970561B2 (ja) * 2001-07-10 2007-09-05 株式会社荏原製作所 基板保持装置及び基板研磨装置
JP2003039305A (ja) * 2001-08-01 2003-02-13 Minolta Co Ltd 研磨装置
JP2004154874A (ja) * 2002-11-05 2004-06-03 Ebara Corp ポリッシング装置及びポリッシング方法
TWI238754B (en) * 2002-11-07 2005-09-01 Ebara Tech Inc Vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof
JP2004209613A (ja) * 2003-01-08 2004-07-29 Toshiba Ceramics Co Ltd 片面研磨装置の被加工物保持機構
JP3889744B2 (ja) * 2003-12-05 2007-03-07 株式会社東芝 研磨ヘッドおよび研磨装置
JP2005268566A (ja) * 2004-03-19 2005-09-29 Ebara Corp 化学機械研磨装置の基板把持機構のヘッド構造
JP4808453B2 (ja) * 2005-08-26 2011-11-02 株式会社荏原製作所 研磨方法及び研磨装置
US20070135024A1 (en) * 2005-12-08 2007-06-14 Itsuki Kobata Polishing pad and polishing apparatus
US20080014842A1 (en) * 2006-03-03 2008-01-17 Berkstresser David E Polishing head for polishing semiconductor wafers
JP4374370B2 (ja) * 2006-10-27 2009-12-02 信越半導体株式会社 研磨ヘッド及び研磨装置
JP5042778B2 (ja) * 2007-10-31 2012-10-03 信越半導体株式会社 ワーク研磨用ヘッド及びこの研磨ヘッドを備えた研磨装置
WO2009066351A1 (ja) * 2007-11-20 2009-05-28 Shin-Etsu Handotai Co., Ltd. 研磨ヘッド及び研磨装置
KR101958874B1 (ko) * 2008-06-04 2019-03-15 가부시키가이샤 에바라 세이사꾸쇼 기판처리장치, 기판처리방법, 기판 파지기구, 및 기판 파지방법
JP5145131B2 (ja) * 2008-06-24 2013-02-13 信越半導体株式会社 研磨ヘッドの製造方法
JP5390807B2 (ja) * 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
US8636561B2 (en) * 2008-08-29 2014-01-28 Shin-Etsu Handotai Co., Ltd. Polishing head and polishing apparatus
JP5340795B2 (ja) * 2009-04-27 2013-11-13 株式会社荏原製作所 研磨方法及び研磨装置
JP5511600B2 (ja) * 2010-09-09 2014-06-04 株式会社荏原製作所 研磨装置
JP5976522B2 (ja) * 2012-05-31 2016-08-23 株式会社荏原製作所 研磨装置および研磨方法
US10702972B2 (en) * 2012-05-31 2020-07-07 Ebara Corporation Polishing apparatus
US20140357161A1 (en) * 2013-05-31 2014-12-04 Sunedison Semiconductor Limited Center flex single side polishing head

Also Published As

Publication number Publication date
DE112012002493T5 (de) 2014-03-27
JPWO2013001719A1 (ja) 2015-02-23
KR20140048894A (ko) 2014-04-24
WO2013001719A1 (ja) 2013-01-03
CN103619538A (zh) 2014-03-05
US20140113531A1 (en) 2014-04-24
TW201318767A (zh) 2013-05-16

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Legal Events

Date Code Title Description
R083 Amendment of/additions to inventor(s)
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20141201