JP2009208214A - 研磨装置 - Google Patents
研磨装置 Download PDFInfo
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- JP2009208214A JP2009208214A JP2008055946A JP2008055946A JP2009208214A JP 2009208214 A JP2009208214 A JP 2009208214A JP 2008055946 A JP2008055946 A JP 2008055946A JP 2008055946 A JP2008055946 A JP 2008055946A JP 2009208214 A JP2009208214 A JP 2009208214A
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- substrate
- polishing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/002—Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
- B24B21/06—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
- B24B21/06—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
- B24B21/08—Pressure shoes; Pressure members, e.g. backing belts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
【解決手段】本発明の基板装置は、基板Wを保持して回転させる基板保持機構1と、研磨具10を基板Wの外周部に押圧して該外周部を研磨する研磨機構2と、基板Wの外周部を流体で支持する外周部支持機構3とを備える。外周部支持機構3は、基板の外周部とは反対側の基板の面、または基板の外周部と同じ側の基板の面を支持するように構成される。
【選択図】図1
Description
本発明の好ましい態様は、前記外周部支持機構は、基板の前記外周部と同じ側の基板の面を支持することを特徴とする。
本発明の好ましい態様は、前記研磨機構を、前記基板保持機構に保持された基板の径方向に沿って移動させる移動機構をさらに備えたことを特徴とする。
本発明の好ましい態様は、前記研磨具は研磨テープであり、前記研磨装置は、前記研磨機構に研磨テープを供給する研磨テープ供給機構をさらに備えることを特徴とする。
図1は、本発明の第1の実施形態に係る研磨装置を示す概略正面図である。図1に示すように、この研磨装置は、ウエハなどの基板Wを水平に保持して回転させる基板保持機構1と、この基板保持機構1によって保持された基板Wの外周部を研磨する研磨機構2と、基板保持機構1によって保持された基板Wの外周部を支持する外周部支持機構3とを備えている。なお、本明細書では、基板の外周部とは、基板の最端部から内側に向かった平坦部をいう。
基板Wは、図示しない搬送ロボットにより研磨装置の研磨室に搬送され、基板保持機構1の基板ステージ11上に載置される。基板保持機構1は、基板Wを真空吸着などにより保持し、水平面内で基板Wを回転させる。研磨テープ供給機構15を動作させると、研磨テープ10はテープ送り機構16から研磨機構2を経由してテープ巻取り機構17に巻き取られる。研磨テープ10は、その長手方向に進行しながら、研磨機構2によって基板Wの上面側の外周部に押圧される。同時に、外周部支持機構3のノズル37から液体が基板Wの下面側の外周部に向けて噴射される。
2 研磨機構
3 外周部支持機構
10 研磨テープ(研磨具)
11 基板ステージ
12 基板回転機構
15 研磨テープ供給機構
16 テープ送り機構
17 テープ巻取り機構
20 加圧パッド
21 スプリング
22 ロッド
26 アーム
27 ベルト
28A,28B プーリ
29 モータ
30 プレート
31 スライド機構
33 リニアアクチュエータ
34 スライド機構
35 減圧弁
36 液体供給源
37 ノズル
40 外周部支持機構
41 基板支持体
43 液体供給源
45 シリンダ
46A 第1ポート
46B 第2ポート
48A 第1電空レギュレータ
48B 第2電空レギュレータ
50 気体供給源
52 加圧パッド
Claims (7)
- 基板を保持して回転させる基板保持機構と、
研磨具を基板の外周部に押圧して該外周部を研磨する研磨機構と、
基板の前記外周部を流体で支持する外周部支持機構とを備えることを特徴とする研磨装置。 - 前記外周部支持機構は、基板の前記外周部とは反対側の基板の面を支持することを特徴とする請求項1に記載の研磨装置。
- 前記外周部支持機構は、基板の前記外周部と同じ側の基板の面を支持することを特徴とする請求項1に記載の研磨装置。
- 基板を保持して回転させる基板保持機構と、
研磨具を基板の外周部に押圧して該外周部を研磨する研磨機構と、
前記研磨機構の押圧力を一定に調整する押圧力調整機構とを備えることを特徴とする研磨装置。 - 前記研磨機構は、内部に液体が封入された加圧パッドにより前記研磨具を基板の外周部に押圧することを特徴とする請求項4に記載の研磨装置。
- 前記研磨機構を、前記基板保持機構に保持された基板の径方向に沿って移動させる移動機構をさらに備えたことを特徴とする請求項1乃至5のいずれか一項に記載の研磨装置。
- 前記研磨具は研磨テープであり、
前記研磨装置は、前記研磨機構に研磨テープを供給する研磨テープ供給機構をさらに備えることを特徴とする請求項1乃至6のいずれか一項に記載の研磨装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008055946A JP5393039B2 (ja) | 2008-03-06 | 2008-03-06 | 研磨装置 |
US12/379,983 US9138854B2 (en) | 2008-03-06 | 2009-03-05 | Polishing apparatus |
JP2013156521A JP5827976B2 (ja) | 2008-03-06 | 2013-07-29 | 研磨装置 |
JP2015025116A JP6018656B2 (ja) | 2008-03-06 | 2015-02-12 | 研磨装置および研磨方法 |
US14/828,972 US9649739B2 (en) | 2008-03-06 | 2015-08-18 | Polishing apparatus |
US15/485,446 US10137552B2 (en) | 2008-03-06 | 2017-04-12 | Polishing apparatus |
Applications Claiming Priority (1)
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---|---|---|---|
JP2008055946A JP5393039B2 (ja) | 2008-03-06 | 2008-03-06 | 研磨装置 |
Related Child Applications (1)
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JP2013156521A Division JP5827976B2 (ja) | 2008-03-06 | 2013-07-29 | 研磨装置 |
Publications (3)
Publication Number | Publication Date |
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JP2009208214A true JP2009208214A (ja) | 2009-09-17 |
JP2009208214A5 JP2009208214A5 (ja) | 2010-10-07 |
JP5393039B2 JP5393039B2 (ja) | 2014-01-22 |
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Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008055946A Active JP5393039B2 (ja) | 2008-03-06 | 2008-03-06 | 研磨装置 |
JP2013156521A Active JP5827976B2 (ja) | 2008-03-06 | 2013-07-29 | 研磨装置 |
JP2015025116A Active JP6018656B2 (ja) | 2008-03-06 | 2015-02-12 | 研磨装置および研磨方法 |
Family Applications After (2)
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JP2013156521A Active JP5827976B2 (ja) | 2008-03-06 | 2013-07-29 | 研磨装置 |
JP2015025116A Active JP6018656B2 (ja) | 2008-03-06 | 2015-02-12 | 研磨装置および研磨方法 |
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US (3) | US9138854B2 (ja) |
JP (3) | JP5393039B2 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2011161625A (ja) * | 2010-01-15 | 2011-08-25 | Ebara Corp | 研磨装置、研磨方法、研磨具を押圧する押圧部材 |
JP2011171647A (ja) * | 2010-02-22 | 2011-09-01 | Ebara Corp | 半導体装置の製造方法 |
JP2011224680A (ja) * | 2010-04-16 | 2011-11-10 | Ebara Corp | 研磨方法及び研磨装置 |
EP2502701A2 (en) | 2011-03-25 | 2012-09-26 | Ebara Corporation | Polishing apparatus and polishing method |
US8641480B2 (en) | 2010-03-02 | 2014-02-04 | Ebara Corporation | Polishing apparatus and polishing method |
Families Citing this family (7)
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JP5254575B2 (ja) * | 2007-07-11 | 2013-08-07 | 株式会社東芝 | 研磨装置および研磨方法 |
JP5464497B2 (ja) * | 2010-08-19 | 2014-04-09 | 株式会社サンシン | 基板研磨方法及びその装置 |
US9457447B2 (en) * | 2011-03-28 | 2016-10-04 | Ebara Corporation | Polishing apparatus and polishing method |
TWI680031B (zh) * | 2012-09-24 | 2019-12-21 | 日商荏原製作所股份有限公司 | 研磨方法及研磨裝置 |
JP2017148931A (ja) * | 2016-02-19 | 2017-08-31 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
CN106736880B (zh) * | 2016-12-28 | 2018-08-31 | 沪东重机有限公司 | 用于燃气控制块倒圆锥腔底密封面的研磨方法 |
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2008
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2009
- 2009-03-05 US US12/379,983 patent/US9138854B2/en active Active
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2013
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2015
- 2015-02-12 JP JP2015025116A patent/JP6018656B2/ja active Active
- 2015-08-18 US US14/828,972 patent/US9649739B2/en active Active
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2017
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Cited By (14)
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EP2363240A2 (en) | 2010-01-15 | 2011-09-07 | Ebara Corporation | Polishing apparatus, polishing method and pressing member for pressing a polishing tool |
JP2011161625A (ja) * | 2010-01-15 | 2011-08-25 | Ebara Corp | 研磨装置、研磨方法、研磨具を押圧する押圧部材 |
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JP2011171647A (ja) * | 2010-02-22 | 2011-09-01 | Ebara Corp | 半導体装置の製造方法 |
US8748289B2 (en) | 2010-02-22 | 2014-06-10 | Ebara Corporation | Method for manufacturing semiconductor device |
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US8641480B2 (en) | 2010-03-02 | 2014-02-04 | Ebara Corporation | Polishing apparatus and polishing method |
JP2011224680A (ja) * | 2010-04-16 | 2011-11-10 | Ebara Corp | 研磨方法及び研磨装置 |
KR20120109342A (ko) * | 2011-03-25 | 2012-10-08 | 가부시키가이샤 에바라 세이사꾸쇼 | 연마 장치 및 연마 방법 |
US8979615B2 (en) | 2011-03-25 | 2015-03-17 | Ebara Corporation | Polishing apparatus and polishing method |
EP2502701A2 (en) | 2011-03-25 | 2012-09-26 | Ebara Corporation | Polishing apparatus and polishing method |
JP2016028845A (ja) * | 2011-03-25 | 2016-03-03 | 株式会社荏原製作所 | 研磨方法 |
KR101872903B1 (ko) | 2011-03-25 | 2018-06-29 | 가부시키가이샤 에바라 세이사꾸쇼 | 연마 장치 및 연마 방법 |
US10493588B2 (en) | 2011-03-25 | 2019-12-03 | Ebara Corporation | Polishing apparatus and polishing method |
Also Published As
Publication number | Publication date |
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US9649739B2 (en) | 2017-05-16 |
US20170216989A1 (en) | 2017-08-03 |
US20150352682A1 (en) | 2015-12-10 |
JP5827976B2 (ja) | 2015-12-02 |
JP2015119197A (ja) | 2015-06-25 |
JP5393039B2 (ja) | 2014-01-22 |
US20090227189A1 (en) | 2009-09-10 |
JP6018656B2 (ja) | 2016-11-02 |
JP2013248733A (ja) | 2013-12-12 |
US9138854B2 (en) | 2015-09-22 |
US10137552B2 (en) | 2018-11-27 |
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