JP2016204187A5 - - Google Patents

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Publication number
JP2016204187A5
JP2016204187A5 JP2015085606A JP2015085606A JP2016204187A5 JP 2016204187 A5 JP2016204187 A5 JP 2016204187A5 JP 2015085606 A JP2015085606 A JP 2015085606A JP 2015085606 A JP2015085606 A JP 2015085606A JP 2016204187 A5 JP2016204187 A5 JP 2016204187A5
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JP
Japan
Prior art keywords
polishing
abrasive grains
epitaxial wafer
manufacturing
slurry containing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015085606A
Other languages
English (en)
Japanese (ja)
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JP2016204187A (ja
JP6234957B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2015085606A priority Critical patent/JP6234957B2/ja
Priority claimed from JP2015085606A external-priority patent/JP6234957B2/ja
Priority to PCT/JP2016/001183 priority patent/WO2016170721A1/ja
Priority to TW105106854A priority patent/TW201708632A/zh
Publication of JP2016204187A publication Critical patent/JP2016204187A/ja
Publication of JP2016204187A5 publication Critical patent/JP2016204187A5/ja
Application granted granted Critical
Publication of JP6234957B2 publication Critical patent/JP6234957B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015085606A 2015-04-20 2015-04-20 エピタキシャルウェーハの製造方法 Active JP6234957B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2015085606A JP6234957B2 (ja) 2015-04-20 2015-04-20 エピタキシャルウェーハの製造方法
PCT/JP2016/001183 WO2016170721A1 (ja) 2015-04-20 2016-03-04 エピタキシャルウェーハの製造方法
TW105106854A TW201708632A (zh) 2015-04-20 2016-03-07 磊晶晶圓的製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015085606A JP6234957B2 (ja) 2015-04-20 2015-04-20 エピタキシャルウェーハの製造方法

Publications (3)

Publication Number Publication Date
JP2016204187A JP2016204187A (ja) 2016-12-08
JP2016204187A5 true JP2016204187A5 (enExample) 2017-03-02
JP6234957B2 JP6234957B2 (ja) 2017-11-22

Family

ID=57143054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015085606A Active JP6234957B2 (ja) 2015-04-20 2015-04-20 エピタキシャルウェーハの製造方法

Country Status (3)

Country Link
JP (1) JP6234957B2 (enExample)
TW (1) TW201708632A (enExample)
WO (1) WO2016170721A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6635088B2 (ja) * 2017-04-24 2020-01-22 信越半導体株式会社 シリコンウエーハの研磨方法
DE102017210423A1 (de) * 2017-06-21 2018-12-27 Siltronic Ag Verfahren, Steuerungssystem und Anlage zum Bearbeiten einer Halbleiterscheibe sowie Halbleiterscheibe
JPWO2019043890A1 (ja) * 2017-08-31 2020-08-06 株式会社Sumco 半導体ウェーハの製造方法
US11621171B2 (en) 2018-09-25 2023-04-04 Nissan Chemical Corporation Method for polishing silicon wafer with reduced wear on carrier, and polishing liquid used therein

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004195571A (ja) * 2002-12-17 2004-07-15 Noritake Co Ltd 両面研磨機用ワークキャリア及びその製造方法
JP2010021487A (ja) * 2008-07-14 2010-01-28 Sumco Corp 半導体ウェーハおよびその製造方法
JP5401683B2 (ja) * 2008-08-01 2014-01-29 株式会社Ｓｕｍｃｏ 両面鏡面半導体ウェーハおよびその製造方法
JP5644401B2 (ja) * 2010-11-15 2014-12-24 株式会社Sumco エピタキシャルウェーハの製造方法およびエピタキシャルウェーハ
JP5768554B2 (ja) * 2011-07-21 2015-08-26 旭硝子株式会社 磁気記録媒体用ガラス基板の製造方法および磁気記録媒体用ガラス基板
KR20140098761A (ko) * 2011-11-16 2014-08-08 닛산 가가쿠 고교 가부시키 가이샤 반도체 웨이퍼용 연마액 조성물

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